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1.发明授权METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING SELF ALIGNED SEMICONDUCTOR MESAS AND CONTACT LAYERS AND RELATED DEVICES 有权形成具有自对准半导体材料和接触层以及相关器件的半导体器件的方法
公开(公告)号：EP1573871B1
公开(公告)日：2018-03-07
申请号：EP03814166.9
申请日：2003-12-18
申请人： Cree, Inc.
CPC分类号： H01L33/145 , H01S5/021 , H01S5/0421 , H01S5/0425 , H01S5/22 , H01S5/2205 , H01S5/2206 , H01S5/2214 , H01S5/2231 , H01S5/2275 , H01S5/32341 , H01S2301/176
摘要： A method of forming a semiconductor device may include forming a semiconductor structure (14) on a substrate (12) wherein the semiconductor structure (14) defines a mesa (20) having a mesa surface (20A) opposite the substrate (12) and mesa sidewalls between the mesa surface and the substrate. A first passivation layer (30) can be formed on at least portions of the mesa sidewalls and on the substrate (12) adjacent the mesa sidewalls wherein at least a portion of the mesa surface (20A) is free of the first passivation layer (30) and wherein the first passivation layer (30) comprises a first material. A second passivation layer (40) can be formed on the first passivation layer (30) wherein at least a portion of the mesa surface (20A) is free of the second passivation layer (40), and wherein the second passivation layer (40) comprises a second material different than the first material. Related devices are also discussed.
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公开(公告)号：EP2011164B1
公开(公告)日：2018-08-29
申请号：EP07754938.4
申请日：2007-04-04
申请人： Cree, Inc.
CPC分类号： H01L33/502 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01322 , H01L2933/0091 , Y02B20/181 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.
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公开(公告)号：EP2364341B1
公开(公告)日：2014-12-17
申请号：EP09756883.6
申请日：2009-11-09
申请人： Cree, Inc.
IPC分类号： C09K11/64
CPC分类号： C09K11/7734 , C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593 , C04B35/5935 , C04B35/597 , C04B2235/3224 , C04B2235/3852 , C04B2235/3865 , C04B2235/3869 , C04B2235/3873 , C04B2235/445 , C09K11/025 , C09K11/0883 , C09K11/7728
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公开(公告)号：EP2643861A2
公开(公告)日：2013-10-02
申请号：EP11843773.0
申请日：2011-10-31
申请人： Cree, Inc.
发明人： HUSSELL, Christopher, P. , ANDREWS, Peter, Scott , REIHERZER, Jesse, Colin , EMERSON, David, T.
CPC分类号： H01L33/08 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
摘要翻译： 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和以图案化阵列布置在衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件可以进一步包括围绕LED阵列设置的保持材料。 在一个方面中，可以分配保持材料。
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5.发明公开EMISSION TUNING METHODS AND DEVICES FABRICATED UTILIZING METHODS 有权EMISSIONSABSTIMMVERFAHREN和使用过程中产生的设备
公开(公告)号：EP2283526A2
公开(公告)日：2011-02-16
申请号：EP09728238.8
申请日：2009-03-31
申请人： Cree, Inc.
发明人： CHITNIS, Ashay , EDMOND, John , BRITT, Jeffrey, C. , KELLER, Bernd, P. , EMERSON, David, T. , BERGMANN, Michael, John , CABALU, Jasper, S.
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/0095 , H01L2224/13 , H01L2933/0041 , Y10T408/47
摘要： A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some light from the LEDs passes through the conversion material and is converted. The light emission from the LED chips comprises light from the conversion material, typically in combination with LED light. The emission characteristics of at least some of the LED chips is measured and at least some of the conversion material over the LEDs is removed to alter the emission characteristics of the LED chips. The invention is particularly applicable to fabricating LED chips on a wafer where the LED chips have light emission characteristics that are within a range of target emission characteristics. This target range can fall within an emission region on a CIE curve to reduce the need for binning of the LEDs from the wafer. The emission characteristics of the LED chips in the wafer can be tuned to the desired range by micro-machining the conversion material over the LEDs.
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公开(公告)号：EP2111648B1
公开(公告)日：2019-05-15
申请号：EP07840092.6
申请日：2007-11-20
申请人： Cree, Inc.
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公开(公告)号：EP2625726A2
公开(公告)日：2013-08-14
申请号：EP11831387.3
申请日：2011-10-03
申请人： Cree, Inc.
发明人： ANDREWS, Peter, S. , ROSADO, Raymond , LAUGHNER, Michael, P. , EMERSON, David, T. , BRITT, Jeffrey, C.
CPC分类号： H01L25/0753 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.
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8.发明公开WAFER LEVEL PHOSPHOR COATING METHOD AND DEVICES FABRICATED UTILIZING METHOD 审中-公开晶圆级荧光粉涂层方法以及使用该方法生产安排
公开(公告)号：EP2111648A2
公开(公告)日：2009-10-28
申请号：EP07840092.6
申请日：2007-11-20
申请人： Cree, Inc. , Seruto, James
发明人： SERUTO, James , CHITNIS, Ashay , IBBETSON, James , KELLER, Bernd , EMERSON, David, T. , EDMOND, John , BERGMANN, Michael, J. , CABALU, Jasper, S. , BRITT, Jeffrey, C. , CHAKRABORTY, Arpan , TARSA, Eric, J. , FU, Yankun
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/0095 , H01L33/36 , H01L33/387 , H01L33/44 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
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公开(公告)号：EP2102920A2
公开(公告)日：2009-09-23
申请号：EP08713756.8
申请日：2008-01-15
申请人： CREE, INC.
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , G02B6/0073 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting diode lamp is disclosed that includes a resin package that defines a recess in the shape of a solid polygon or another three-dimensional solid. The recess includes a floor, two side walls along the respective longer sides of the floor, and two end walls along the respective shorter sides of the floor. The two side walls define an angle therebetween greater than 3°, and the two end walls define an angle therebetween greater than 40°. A light emitting diode chip is positioned on the rectangular floor of the package.
摘要翻译： 公开了一种发光二极管灯，其包括限定具有实心多边形或另一立体固体形状的凹部的树脂封装。 凹部包括地板，沿着地板的相应长边的两个侧壁以及沿着地板的相应短边的两个端壁。 两个侧壁在它们之间限定了大于3°的角度，并且两个端壁在它们之间限定了大于40°的角度。 发光二极管芯片位于封装的矩形地板上。
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10.发明公开ELECTRONIC DEVICES INCLUDING SEMICONDUCTOR MESA STRUCTURES AND CONDUCTIVITY JUNCTIONS AND METHODS OF FORMING SAID DEVICES 审中-公开进行生产这些设备的MESA结构化半导体器件和导电连接和方法电子器件
公开(公告)号：EP1573827A2
公开(公告)日：2005-09-14
申请号：EP03814183.4
申请日：2003-12-18
申请人： CREE, INC.
CPC分类号： H01L33/145 , H01S5/021 , H01S5/0421 , H01S5/0425 , H01S5/22 , H01S5/2205 , H01S5/2206 , H01S5/2214 , H01S5/2231 , H01S5/2275 , H01S5/32341 , H01S2301/176
摘要： An electronic device including a substrate and a semiconductor mesa on the substrate. Said device mesa having a mesa base adjacent to the substrate, a mesa surface opposite the substrate, and mesa sidewalls between the mesa surface and the mesa base. In addition, the semiconductor mesa has a first conductivity type between the mesa base and a junction, the junction being between the mesa base and the mesa surface, and the semiconductor mesa having a second conductivity type between the junction and the mesa surface. Related manufacturing methods are also defined.
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