公开(公告)号：EP1868241A4

公开(公告)日：2012-02-15

申请号：EP06729450

申请日：2006-03-17

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： OSHIKA YOSHIKAZU ,  NAKANO MASAYUKI

IPC: H01L23/12 ,  B23K35/30 ,  H01L21/52

CPC classification number: H05K1/111 ,  B23K35/001 ,  H01L21/4864 ,  H01L23/15 ,  H01L23/49811 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83825 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/341 ,  H05K3/388 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2224/48

Abstract: A submount (50) comprising a submount substrate (52) and a solder layer (54) adherently deposited on the submount substrate (52) for soldering with a semiconductor device, characterized in that said solder layer (54) is formed of constituent elements in a composition ratio which varies in a depth direction of said solder layer (54).

公开(公告)号：EP1909321A4

公开(公告)日：2009-09-23

申请号：EP06756534

申请日：2006-05-24

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： OSHIKA YOSHIKAZU

IPC: H01L23/12 ,  H01L23/36 ,  H01S5/022

CPC classification number: H05K1/053 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3735 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2224/85469 ,  H01L2224/85484 ,  H01L2924/00011 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01S5/02272 ,  H01S5/02476 ,  H05K2201/0179 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01004

公开(公告)号：EP1939929A4

公开(公告)日：2012-03-14

申请号：EP06810273

申请日：2006-09-19

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： NAKANO MASAYUKI ,  OSHIKA YOSHIKAZU

IPC: H01L21/52 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  C22C5/02 ,  H01L21/50 ,  H01L21/60 ,  H01L23/373 ,  H05K1/11

CPC classification number: C22C5/02 ,  B23K35/262 ,  B23K35/264 ,  B23K35/282 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  H01L21/50 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09745 ,  Y02P70/611 ,  Y10T29/49393 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00

公开(公告)号：EP2009971A4

公开(公告)日：2011-01-12

申请号：EP07740178

申请日：2007-03-28

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： OSHIKA YOSHIKAZU ,  HASHIMOTO MUNENORI ,  NAKANO MASAYUKI

IPC: H05K3/34 ,  H01L21/52

CPC classification number: H05K3/3463 ,  H01L24/29 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/62 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K2201/10992 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/29298

Abstract: A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base substrate (2) consists of a plurality of layers (5a) of a solder free from lead, which are different in its phase from one another. They are constituted by a layer of a phase that is completely melted, and a layer of a phase that is not completely melted at a temperature not less than a eutectic temperature of the solder. The solder layer (5) can be applied to a device joining substrate (1) comprising an electrode layer (4) formed on the base substrate (2) and the solder layer (5) formed on the electrode layer.