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公开(公告)号：EP0087102A1
公开(公告)日：1983-08-31
申请号：EP83101410.5
申请日：1983-02-14
发明人： Fujii, Tsunenori , Suzuki, Kenji , Yoshida, Masahiro , Okawa, Hisashi , Koto, Kaoru , Ohmori, Hideki , Yokokura, Hisao , Okabe, Yoshiaki , Hattori, Shintaroo , Kitamura, Teruo , Mukoh, Akio , Sato, Mikio
IPC分类号： C09K19/00
CPC分类号： C09K19/3068 , C09K19/2007
摘要： The liquid crystal compound of this invention is characterized by having the general formula.
wherein R and R' each represent an alkyl group, and X, X', Y and Y' each represent --
公开(公告)号：EP0058981A2
公开(公告)日：1982-09-01
申请号：EP82101339.8
申请日：1982-02-22
发明人： Hirai, Yoichi , Fujii, Tsunenori , Koto, Kaoru , Suzuki, Kenji , Yoshida, Masahiro , Okawa, Hisashi , Kitamura, Teruo , Yokokura, Hisao , Okabe, Yoshiaki , Hattori, Shintaroo , Mukoh, Akio , Sato, Mikio
IPC分类号： C07C43/164 , C07C43/168 , C07C43/21 , C07C69/75 , C07C69/76 , C07C69/773 , C07C121/75 , C07D239/26 , C09K19/08 , C09K19/12 , C09K19/30
CPC分类号： C07D239/26 , C07C29/00 , C07C29/147 , C07C31/137 , C07C43/168 , C07C43/21 , C07C43/225 , C07C43/23 , C07C57/46 , C07C255/00 , C09K19/2007 , C09K19/3003 , C09K19/3068 , C09K19/32 , C09K19/321 , C09K19/3402 , C09K19/3458 , C09K19/3475 , C09K2019/3425 , C07C33/34 , C07C33/24
摘要： A colorless liquid crystalline compound having at least one 6-membered ring and non-cyclic end groups in the molecular skeleton, said 6-membered ring containing two or more carbon atoms, at least one of which is directly bonded to a methylene group of a non-cyclic group having an alkoxy group at another end has a wide mesomorphic range. When said colorless liquid crystalline compound is mixed with a liquid crystal composition. the resulting mixture also has an enlarged mesomorphic range and in almost all cases has a reduced viscosity.
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公开(公告)号：EP0087102B1
公开(公告)日：1985-12-18
申请号：EP83101410.5
申请日：1983-02-14
发明人： Fujii, Tsunenori , Suzuki, Kenji , Yoshida, Masahiro , Okawa, Hisashi , Koto, Kaoru , Ohmori, Hideki , Yokokura, Hisao , Okabe, Yoshiaki , Hattori, Shintaroo , Kitamura, Teruo , Mukoh, Akio , Sato, Mikio
IPC分类号： C09K19/00
CPC分类号： C09K19/3068 , C09K19/2007
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4.发明公开Liquid crystal compounds, liquid crystal compositions and liquid crystal display devices 失效Flüssigkristall-Verbindungen，-Zusammensetzungen und -Anzeigevorrichtungen。
公开(公告)号：EP0118046A1
公开(公告)日：1984-09-12
申请号：EP84101232.1
申请日：1984-02-07
发明人： Yokokura, Hisao , Kitamura, Teruo , Okabe, Yoshiaki , Mukoo, Akio , Abe, Hidetoshi , Fujii, Tsunenori , Yoshida, Masahiro , Oomiri, Hideki , Okawa, Hisashi , Kurihara, Makoto , Suzuki, Kenji
IPC分类号： C07C69/76 , C07C69/753 , C07C69/616 , C09K3/34 , G02F1/13
CPC分类号： C09K19/321 , C07C45/46 , C07C49/782 , C07C49/792 , C07C63/49 , C09K19/12 , C09K19/3003
摘要： The liquid-erystal compound of the present invention is characterized by having the following molecular structure:
(a) the molecular skeleton has two or more six-membered rings,
(b) the respective six-membered rings are bonded directly to each other,
(c) a carbon atom in each of the terminal six-membered rings is bonded directly to an acyclic terminal group,
(d) one of the acyclic terminal groups bonded to the carbon atom of the six-membered ring is an alkyl group or an alkoxycarbonyl-free group bonding through an alkylene group, and
(e) the other acyclic terminal group bonded to the carbon atom in the six-membered ring has a carbonyl group and a terminal alkoxyl group.摘要翻译： 本发明的液晶化合物的特征在于具有以下分子结构：（a）分子骨架具有两个或更多个六元环，（b）各个六元环彼此直接键合，（c ）末端六元环中的碳原子直接键合在无环末端基上，（d）与六元环的碳原子键合的无环末端之一是烷基或烷氧羰基 - 通过亚烷基的自由基键合，和（e）与六元环中的碳原子键合的另一个无环末端具有羰基和末端烷氧基。
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公开(公告)号：EP0058981B1
公开(公告)日：1986-01-22
申请号：EP82101339.8
申请日：1982-02-22
发明人： Hirai, Yoichi , Fujii, Tsunenori , Koto, Kaoru , Suzuki, Kenji , Yoshida, Masahiro , Okawa, Hisashi , Kitamura, Teruo , Yokokura, Hisao , Okabe, Yoshiaki , Hattori, Shintaroo , Mukoh, Akio , Sato, Mikio
IPC分类号： C07C43/164 , C07C43/168 , C07C43/21 , C07C69/75 , C07C69/76 , C07C69/773 , C07C121/75 , C07D239/26 , C09K19/08 , C09K19/12 , C09K19/30
CPC分类号： C07D239/26 , C07C29/00 , C07C29/147 , C07C31/137 , C07C43/168 , C07C43/21 , C07C43/225 , C07C43/23 , C07C57/46 , C07C255/00 , C09K19/2007 , C09K19/3003 , C09K19/3068 , C09K19/32 , C09K19/321 , C09K19/3402 , C09K19/3458 , C09K19/3475 , C09K2019/3425 , C07C33/34 , C07C33/24
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公开(公告)号：EP0058981A3
公开(公告)日：1983-11-09
申请号：EP82101339
申请日：1982-02-22
发明人： Hirai, Yoichi , Fujii, Tsunenori , Koto, Kaoru , Suzuki, Kenji , Yoshida, Masahiro , Okawa, Hisashi , Kitamura, Teruo , Yokokura, Hisao , Okabe, Yoshiaki , Hattori, Shintaroo , Mukoh, Akio , Sato, Mikio
IPC分类号： C07C43/164 , C07C43/168 , C07C43/21 , C07C69/75 , C07C69/76 , C07C69/773 , C07C121/75 , C07D239/26 , C09K03/34
CPC分类号： C07D239/26 , C07C29/00 , C07C29/147 , C07C31/137 , C07C43/168 , C07C43/21 , C07C43/225 , C07C43/23 , C07C57/46 , C07C255/00 , C09K19/2007 , C09K19/3003 , C09K19/3068 , C09K19/32 , C09K19/321 , C09K19/3402 , C09K19/3458 , C09K19/3475 , C09K2019/3425 , C07C33/34 , C07C33/24
摘要： A colorless liquid crystalline compound having at least one 6-membered ring and non-cyclic end groups in the molecular skeleton, said 6-membered ring containing two or more carbon atoms, at least one of which is directly bonded to a methylene group of a non-cyclic group having an alkoxy group at another end has a wide mesomorphic range. When said colorless liquid crystalline compound is mixed with a liquid crystal composition. the resulting mixture also has an enlarged mesomorphic range and in almost all cases has a reduced viscosity.
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7.发明公开Thermosetting resin compositions and their use for thin film wiring boards 失效HitzehärtendeHarzzusammensetzungen und ihre Verwendung vonDünnfilmleiterplatten
公开(公告)号：EP0755979A3
公开(公告)日：1997-06-18
申请号：EP96116246.8
申请日：1994-03-31
发明人： Miwa, Takao , Suzuki, Masahiro , Takahashi, Akio , Okabe, Yoshiaki , Satsu, Yuichi , Nishimura, Shin
IPC分类号： C08L79/08 , C08G73/10 , C08K5/3415
CPC分类号： H05K3/4655 , C08G73/1039 , C08G73/1071 , C08K5/3415 , C08L79/08 , C09J179/08 , H05K1/0306 , H05K3/386 , H05K3/4605 , H05K3/4652 , H05K2201/0154 , H05K2201/0195 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10 2 to 10 7 dyne/cm 2 in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.
摘要翻译： 本发明涉及一种热固性树脂组合物，其包含（A）热固性聚酰亚胺和（B）双马来酰亚胺，并且在热固化步骤中显示10 2至10 7达因/ cm 2的弹性模量 适用于形成具有优异的耐热性和高可靠性的薄膜电路板中使用的粘合膜。 本发明还涉及前体化合物和组合物。
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公开(公告)号：EP0226020A3
公开(公告)日：1989-03-15
申请号：EP86115271.8
申请日：1986-11-04
申请人： HITACHI, LTD.
发明人： Eguchi, Shuji , Taketani, Noriaki , Tanno, Seikichi , Okabe, Yoshiaki , Terao, Hiromu , Asano, Hideki , Wajima, Motoyo , Abe, Tomiya
CPC分类号： D01F8/10 , G02B6/02033
摘要： A plastic optical fiber comprising a core and a clad, said core being formed by an amorphous and optically transparent polymer and said clad being formed by a polymer having a refractive index lower than that of the core by at least 0.3%, at least one of the core and the clad being formed by an amorphous and optically transparent polymer containing metal elements and halogen atoms, is low in light loss and excellent in heat resistance.
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公开(公告)号：EP0178579A2
公开(公告)日：1986-04-23
申请号：EP85112788.6
申请日：1985-10-09
申请人： HITACHI, LTD.
发明人： Asano, Hideki , Eguchi, Shuji , Tanno, Seikichi , Okabe, Yoshiaki , Taketani, Noriaki , Nemoto, Masanori , Narusawa, Tuneo , Mihara, Yoshimitsu , Takada, Yukihiko
CPC分类号： G11B33/12 , G02B6/12004 , G11B33/02 , H05K1/0274 , H05K1/0284 , H05K1/0393 , H05K1/056 , H05K1/18 , H05K3/301 , H05K2201/09045 , H05K2201/09118 , H05K2203/1327
摘要： 57 This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread on the substrate surface.
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10.发明公开
公开(公告)号：EP0755979A2
公开(公告)日：1997-01-29
申请号：EP96116246.8
申请日：1994-03-31
发明人： Miwa, Takao , Suzuki, Masahiro , Takahashi, Akio , Okabe, Yoshiaki , Satsu, Yuichi , Nishimura, Shin
IPC分类号： C08L79/08 , C08G73/10 , C08K5/3415
CPC分类号： H05K3/4655 , C08G73/1039 , C08G73/1071 , C08K5/3415 , C08L79/08 , C09J179/08 , H05K1/0306 , H05K3/386 , H05K3/4605 , H05K3/4652 , H05K2201/0154 , H05K2201/0195 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10 2 to 10 7 dyne/cm 2 in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.
摘要翻译： 本发明涉及一种热固性树脂组合物，其包含（A）热固性聚酰亚胺和（B）双马来酰亚胺，并且在热固化步骤过程中显示出102-107达因/厘米2的弹性模量，该热固化步骤适合形成 具有优异的耐热性和高可靠性的薄膜布线板。 本发明还涉及前体化合物和组合物。
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