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1.发明公开CIRCUIT CONNECTING MATERIAL AND STRUCTURE FOR CONNECTING CIRCUIT MEMBER 审中-公开施瓦茨保加利亚革命妇女组织维也纳爱尔兰律师事务所
公开(公告)号：EP2222146A1
公开(公告)日：2010-08-25
申请号：EP08861615.6
申请日：2008-12-16
CPC分类号： H01R4/04 , C08K3/017 , C08K3/08 , C08K9/02 , C09J7/10 , C09J9/02 , C09J11/04 , C09J2201/36 , C09J2205/102 , H01R12/52 , H01R12/7076 , H05K3/323 , H05K3/361 , H05K2203/1189
摘要： A circuit connecting material which is situated between mutually opposing circuit electrodes and, upon pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the circuit connecting material having a laminated construction comprising an anisotropic conductive adhesive layer A with conductive particles 21 dispersed therein and an insulating adhesive layer B, wherein the adhesive force of the insulating adhesive layer B for glass substrates is greater than the adhesive force of the anisotropic conductive adhesive layer A for glass substrates.
摘要翻译： 位于相互相对的电路电极之间的电路连接材料，并且在按压相互相对的电路电极时沿着按压方向电连接电极，该电路连接材料具有包括各向异性导电粘合剂层A与导电粒子21的叠层结构 分散在其中并且绝缘粘合剂层B，其中用于玻璃基板的绝缘粘合剂层B的粘合力大于玻璃基板的各向异性导电粘合剂层A的粘合力。
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2.发明公开CIRCUIT CONNECTING ADHESIVE FILM AND CIRCUIT CONNECTING STRUCTURE 审中-公开KLEBFILMFÜRSCHALTKREISVERBINDUNG UND STRUKTURFÜRSCHALTKREISVERBINDUNG
公开(公告)号：EP2237650A1
公开(公告)日：2010-10-06
申请号：EP08839429.1
申请日：2008-10-08
CPC分类号： H05K3/323 , H05K2201/0133 , H05K2201/0212 , Y10T428/28
摘要： A circuit connecting adhesive film comprising an insulating adhesive, conductive particles and a particulate non-conductive phase containing a polyamide-based elastomer and/or a polyester-based elastomer, wherein the conductive particles and non-conductive phase are dispersed in the insulating adhesive.
摘要翻译： 连接粘合膜的电路，其包含绝缘粘合剂，导电颗粒和含有聚酰胺基弹性体和/或聚酯类弹性体的颗粒非导电相，其中导电颗粒和非导电相分散在绝缘粘合剂中。
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3.发明授权CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件的连接结构及方法将电路连接链接
公开(公告)号：EP2046104B1
公开(公告)日：2012-01-18
申请号：EP06768353.2
申请日：2006-07-21
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , NAKAZAWA, Takashi , KOBAYASHI, Kouji , FUJINAWA, Tohru , TATSUZAWA, Takashi
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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4.发明公开CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER 审中-公开的电路连接材料，电路构件和方法，连接结构产生电路连接的连接结构
公开(公告)号：EP2055757A1
公开(公告)日：2009-05-06
申请号：EP07792745.7
申请日：2007-08-20
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , KOBAYASHI, Kouji , NAKAZAWA, Takashi , TATSUZAWA, Takashi , MASUDA, Katsuyuki , EJIRI, Takako
CPC分类号： H05K3/323 , C08G73/1039 , C08K9/02 , C08L2666/28 , C09J9/02 , C09J11/08 , C09J163/00 , C09J179/08 , H01B1/22 , H01B1/24 , H01B3/004 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/07811 , H01L2924/10253 , H01L2924/12044 , H01R4/04 , H05K3/361 , H05K2201/015 , H05K2203/122 , Y10T29/49117 , H01L2924/00
摘要： The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.
摘要翻译： 本发明提供一种连接材料，用于电连接具有形成在第一电路基板的主表面上的第一电路电极的第一电路部件的电路，和在第二电路的一个主表面上形成具有第二电路电极的第二电路部件 基板，与所述第一和相对的海誓山盟第二电路电极，其特征在于粘接剂成分含有含氟有机化合物，worin粘接剂成分的含有0.10％或小于由含有机硅的化合物的质量，在硅原子计 的基础上，粘接剂成分的总量。
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5.发明公开CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件的连接结构及方法将电路连接链接
公开(公告)号：EP2046104A1
公开(公告)日：2009-04-08
申请号：EP06768353.2
申请日：2006-07-21
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , NAKAZAWA, Takashi , KOBAYASHI, Kouji , FUJINAWA, Tohru , TATSUZAWA, Takashi
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译： 用于电路部件各自具有一个基板和形成在所述基板的主表面上的电路电极，响应于光或热，以及含有氨基甲酸乙酯基团和酯有机化合物的粘合剂组合物，其包含没固化之间连接的电路连接材料 组。
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6.发明公开ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER 审中-公开HAFTMASSE，SCHALTKREISVERBINDENDES材料SOWIE VERBINDUNGSSTRUKTUR EINES SCHALTKREISELEMENTS
公开(公告)号：EP1967564A1
公开(公告)日：2008-09-10
申请号：EP06834683.2
申请日：2006-12-14
IPC分类号： C09J201/00 , C09J7/00 , H01B1/22 , H01L21/60 , H05K1/14
CPC分类号： H05K3/323 , C08K3/04 , C08K3/08 , C09J9/02 , C09J11/04 , H01B1/22 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/29499 , H01L2224/32225 , H01L2224/83101 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K2201/0209 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive composition comprising: an adhesive component, conductive particles and insulating particles, wherein the ratio of the mean particle size of the insulating particles Ri to the mean particle size of the conductive particles Rc (Ri/Rc) is 120 to 300%.
摘要翻译： 一种粘合剂组合物，包括：粘合剂组分，导电颗粒和绝缘颗粒，其中绝缘颗粒Ri的平均粒度与导电颗粒Rc（R i / R c）的平均粒度之比为120至300％。
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