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1.发明公开CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件的连接结构及方法将电路连接链接
公开(公告)号：EP2046104A1
公开(公告)日：2009-04-08
申请号：EP06768353.2
申请日：2006-07-21
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , NAKAZAWA, Takashi , KOBAYASHI, Kouji , FUJINAWA, Tohru , TATSUZAWA, Takashi
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译： 用于电路部件各自具有一个基板和形成在所述基板的主表面上的电路电极，响应于光或热，以及含有氨基甲酸乙酯基团和酯有机化合物的粘合剂组合物，其包含没固化之间连接的电路连接材料 组。
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2.发明公开CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER 审中-公开的电路连接材料，电路构件和方法，连接结构产生电路连接的连接结构
公开(公告)号：EP2055757A1
公开(公告)日：2009-05-06
申请号：EP07792745.7
申请日：2007-08-20
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , KOBAYASHI, Kouji , NAKAZAWA, Takashi , TATSUZAWA, Takashi , MASUDA, Katsuyuki , EJIRI, Takako
CPC分类号： H05K3/323 , C08G73/1039 , C08K9/02 , C08L2666/28 , C09J9/02 , C09J11/08 , C09J163/00 , C09J179/08 , H01B1/22 , H01B1/24 , H01B3/004 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/07811 , H01L2924/10253 , H01L2924/12044 , H01R4/04 , H05K3/361 , H05K2201/015 , H05K2203/122 , Y10T29/49117 , H01L2924/00
摘要： The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.
摘要翻译： 本发明提供一种连接材料，用于电连接具有形成在第一电路基板的主表面上的第一电路电极的第一电路部件的电路，和在第二电路的一个主表面上形成具有第二电路电极的第二电路部件 基板，与所述第一和相对的海誓山盟第二电路电极，其特征在于粘接剂成分含有含氟有机化合物，worin粘接剂成分的含有0.10％或小于由含有机硅的化合物的质量，在硅原子计 的基础上，粘接剂成分的总量。
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3.发明授权CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件的连接结构及方法将电路连接链接
公开(公告)号：EP2046104B1
公开(公告)日：2012-01-18
申请号：EP06768353.2
申请日：2006-07-21
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , NAKAZAWA, Takashi , KOBAYASHI, Kouji , FUJINAWA, Tohru , TATSUZAWA, Takashi
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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4.发明公开CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME 审中-公开VERBINDUNGSSTRUKTUR UND VERFAHREN ZU IHRER HERSTELLUNG SCHALTKREISVERBINDUNGSMATERIAL
公开(公告)号：EP2206756A1
公开(公告)日：2010-07-14
申请号：EP08845115.8
申请日：2008-08-29
CPC分类号： H05K3/323 , H01B1/22 , H01B1/24 , H01L24/29 , H01L24/83 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/16 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/8388 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/361 , H05K2203/122 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability.
摘要翻译： 本发明的电路连接材料是一种电路连接材料，用于在具有形成在第一板的主侧上的第一电路电极的第一电路部件与形成在第一电路板主侧的第二电路电极的第二电路部件 第二电路板，第一电路电极和第二电路电极彼此面对，电路连接材料包含产生自由基的固化剂，自由基聚合物质和含有仲硫醇基团的化合物。 本发明的电路连接材料能够进行低温快速固化，并且具有优良的储存稳定性。
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