公开(公告)号：EP1944802A3

公开(公告)日：2009-03-11

申请号：EP07025144.2

申请日：2007-12-27

申请人： MediaTek, Inc

发明人： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/50 ,  H01L25/065

CPC分类号： H01L23/49531 ,  H01L21/4832 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2224/85473 ,  H01L2224/85476 ,  H01L2224/85478 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19015 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

摘要翻译： 的引线框架封装包括具有四个整体的，向外延伸的细长条的垫; 沿管芯焊盘的外周布置引线的多元性; 从管芯焊盘分离并从引线的多个隔离的单独垫区段; 一个半导体安装在的垫的上侧，半导体worin的包含第一接合焊盘引线接合到引线respectivement的多元性和第二接合焊盘引线接合到焊盘分开段; 和模制化合物包封该半导体其中，管芯焊盘的上侧，所述第一悬浮垫段和引线的多个内部部分。

公开(公告)号：EP2109349A1

公开(公告)日：2009-10-14

申请号：EP08103866.3

申请日：2008-05-08

申请人： Mediatek Inc.

发明人： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC分类号： H05K1/02 ,  H01L23/66 ,  H05K3/46

CPC分类号： H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

摘要： A printed circuit board (500a-d) is disclosed. The printed circuit board comprises a substrate (200) having a top surface (202) and a bottom surface (203). A ground plane (228) is on the bottom surface. A first signal trace (212a) is on the top surface along a first direction. At least two isolated power planes (208, 210) are on the top surface adjacent to opposite sides of the first signal trace, respectively. A conductive connection (216) along a second direction couples to the two power planes, across the first signal trace (212a) without electrically connecting to the signal trace, wherein the first signal trace (212a) doesn't directly pass over any split of the ground plane (228).

摘要翻译： 公开了一种印刷电路板（500a-d）。 印刷电路板包括具有顶表面（202）和底表面（203）的基底（200）。 接地平面（228）位于底面。 第一信号迹线（212a）沿着第一方向在顶表面上。 至少两个隔离电源平面（208,210）分别位于与第一信号迹线的相对侧相邻的顶表面上。 沿着第二方向的导电连接（216）跨过第一信号迹线（212a）耦合到两个电源层，而不电连接到信号迹线，其中第一信号迹线（212a）不直接通过 地面（228）。

公开(公告)号：EP1944802B1

公开(公告)日：2018-02-14

申请号：EP07025144.2

申请日：2007-12-27

申请人： MediaTek Inc.

发明人： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/50 ,  H01L23/66 ,  H01L23/00 ,  H01L25/10 ,  H01L25/16

CPC分类号： H01L23/49531 ,  H01L21/4832 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2224/85473 ,  H01L2224/85476 ,  H01L2224/85478 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19015 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

公开(公告)号：EP2109349B1

公开(公告)日：2011-04-06

申请号：EP08103866.3

申请日：2008-05-08

申请人： Mediatek Inc.

发明人： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC分类号： H05K1/02 ,  H01L23/66 ,  H05K3/46

CPC分类号： H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

公开(公告)号：EP2104142B1

公开(公告)日：2016-11-02

申请号：EP08103752.5

申请日：2008-04-28

申请人： MediaTek Inc.

发明人： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2104142A3

公开(公告)日：2010-10-13

申请号：EP08103752.5

申请日：2008-04-28

申请人： MediaTek Inc.

发明人： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip package (500) is disclosed. The semiconductor chip package comprises a lead frame (200) having a chip carrier (206), wherein the chip carrier has a first surface (232) and an opposite second surface (234). A semiconductor chip (208) is mounted on the first surface (232), having a plurality of bonding pads (210) thereon, wherein the semiconductor clip (208) has an area larger than that of the chip carrier (206). A package substrate (218) comprises a central region (220) attached to the second surface (234), having an area larger than that of the semiconductor chip (208), wherein some of the bonding pads (210) of the semiconductor chip (208) are electrically connected to a marginal region (222) of the package substrate (218).

公开(公告)号：EP2104142A2

公开(公告)日：2009-09-23

申请号：EP08103752.5

申请日：2008-04-28

申请人： MediaTek Inc.

发明人： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip package (500) is disclosed. The semiconductor chip package comprises a lead frame (200) having a chip carrier (206), wherein the chip carrier has a first surface (232) and an opposite second surface (234). A semiconductor chip (208) is mounted on the first surface (232), having a plurality of bonding pads (210) thereon, wherein the semiconductor clip (208) has an area larger than that of the chip carrier (206). A package substrate (218) comprises a central region (220) attached to the second surface (234), having an area larger than that of the semiconductor chip (208), wherein some of the bonding pads (210) of the semiconductor chip (208) are electrically connected to a marginal region (222) of the package substrate (218).

摘要翻译： 公开了一种半导体芯片封装（500）。 该半导体芯片封装包括具有芯片载体（206）的引线框架（200），其中该芯片载体具有第一表面（232）和相对的第二表面（234）。 半导体芯片（208）安装在第一表面（232）上，其上具有多个接合焊盘（210），其中半导体夹（208）的面积大于芯片载体（206）的面积。 封装基板（218）包括附接到第二表面（234）的中心区域（220），其面积大于半导体芯片（208）的面积，其中半导体芯片（210）的一些键合焊盘（210） 208）电连接到封装衬底（218）的边缘区域（222）。

公开(公告)号：EP1944802A2

公开(公告)日：2008-07-16

申请号：EP07025144.2

申请日：2007-12-27

申请人： MediaTek, Inc

发明人： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/50 ,  H01L25/065

CPC分类号： H01L23/49531 ,  H01L21/4832 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2224/85473 ,  H01L2224/85476 ,  H01L2224/85478 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19015 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.