-
1.CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD 审中-公开
Title translation: 电路基板与在电路板上安装元件的半导体器件公开(公告)号:EP2496061A4
公开(公告)日:2014-01-08
申请号:EP10826347
申请日:2010-10-28
Applicant: PANASONIC CORP
Inventor: YOSHIOKA SHINGO , FUJIWARA HIROAKI , TAKASHITA HIROMITSU , TAKEDA TSUYOSHI
CPC classification number: H05K1/111 , H01L21/4846 , H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/82385 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K3/107 , H05K3/184 , H05K3/38 , H05K2201/0373 , H05K2201/0391 , H05K2201/09736 , H05K2201/2072 , H05K2203/0307 , H05K2203/0565 , Y02P70/611 , Y10T29/49155 , H01L2924/00
-
2.
公开(公告)号:EP2671919A4
公开(公告)日:2014-12-10
申请号:EP11866389
申请日:2011-11-28
Applicant: PANASONIC CORP
Inventor: KONNO YUKO , TAKASHITA HIROMITSU , TAKEDA TSUYOSHI , FUJIWARA HIROAKI , YOSHIOKA SHINGO
IPC: C08L33/02 , C08K5/00 , C09D125/08 , C09D133/08 , H05K1/03 , H05K3/00 , H05K3/10 , H05K3/18
CPC classification number: C08K5/3475 , C08K5/005 , C08L33/02 , C09D125/08 , C09D133/08 , H05K1/0353 , H05K3/0014 , H05K3/0026 , H05K3/0032 , H05K3/107 , H05K3/184 , H05K2201/0112 , H05K2201/0209 , H05K2201/0239 , H05K2203/0264 , H05K2203/0565 , H05K2203/0571
-