公开(公告)号：EP1771881A1

公开(公告)日：2007-04-11

申请号：EP05756831.3

申请日：2005-06-27

申请人： ROBERT BOSCH GMBH

发明人： KOESTER, Thomas ,  HORNUNG, Stefan

IPC分类号： H01L25/07 ,  H01L23/498 ,  H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/49861 ,  H01L25/072 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/13091 ,  H05K1/0306 ,  H05K1/145 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/2036 ,  H01L2224/0401

摘要： The invention relates to an electronic module arrangement, particularly for use in a motor vehicle, comprising: a first substrate (S1) having a first front side (011) and a first rear side (021); a second substrate (S2) having a second front side (012) and a second rear side (022), and; at least one flat chip (C; C1, C2; C1', C2') mounted between the first and second front sides (011, 012) in a sandwich-like manner. An integrated spacing device is at least provided on at least one of the first and second front sides (011, 012), and has at least one spacing element (A1-A4; A1'-A4'; A1a-A1c, A2a, A2b; A01-A08; AG; AU; AL1, AL2;AQ1-AQ4) that is supported on the chip (C; C1, C2; C1', C1') or on the other of the first and second front sides (011, 012). The invention also relates to a corresponding production method.

公开(公告)号：EP2044627A1

公开(公告)日：2009-04-08

申请号：EP07730173.7

申请日：2007-06-14

申请人： Robert Bosch GmbH

发明人： RAICA, Thomas ,  KOESTER, Thomas

IPC分类号： H01L25/16

CPC分类号： H05K1/144 ,  H01L23/49861 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to an electronic arrangement (1) comprising a power element (2) and a logic element (3). Said arrangement consists of a single-component electronic module (5) into which the power element (2) and the logic element (3) are integrated. The power element (2) and the logic element (3) are at least partially embedded in a common mould housing (5).

公开(公告)号：EP1508168B1

公开(公告)日：2017-12-13

申请号：EP03704305.6

申请日：2003-02-10

申请人： ROBERT BOSCH GMBH

发明人： HAUENSTEIN, Henning ,  TOPP, Rainer ,  SEIBOLD, Jochen ,  BALSZUNAT, Dirk ,  ERNST, Stephan ,  FEILER, Wolfgang ,  KOESTER, Thomas ,  HORNUNG, Stefan ,  STREB, Dieter

IPC分类号： H01L23/482 ,  H01L23/488 ,  H01L25/07 ,  H01L23/373

CPC分类号： H01L23/488 ,  H01L23/3735 ,  H01L23/482 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2044627B1

公开(公告)日：2012-11-07

申请号：EP07730173.7

申请日：2007-06-14

申请人： Robert Bosch GmbH

发明人： RAICA, Thomas ,  KOESTER, Thomas

IPC分类号： H01L23/498 ,  H05K1/14 ,  H01L25/16

CPC分类号： H05K1/144 ,  H01L23/49861 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP1969626A1

公开(公告)日：2008-09-17

申请号：EP06819359.8

申请日：2006-11-09

申请人： Robert Bosch GmbH

发明人： WOLF, Kuno ,  FEILER, Wolfgang ,  KOESTER, Thomas ,  HORNUNG, Stefan

IPC分类号： H01L23/495 ,  H01L25/07

CPC分类号： H01L25/162 ,  H01L23/49531 ,  H01L23/49833 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/021 ,  H05K1/0306 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/10446 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

摘要： Electronic module (10), and an electric motor (12) containing one, and also a production method for one, having an electrically conductive first substrate (16) which has a basic body (54) and which has a second electrically conductive substrate (18) mounted on it, and having at least one power component which is arranged on a first substrate (16), and the second substrate (18) is fitted with further components (40) on a side (32) which is remote from the first substrate (16), where the second substrate (18) has a smaller base area (19) than the basic body (54) of the first substrate (16), and the power components (22) are mounted on the first substrate (16) outside the outer perimeter (70) of the second substrate (18) - next to the latter.

公开(公告)号：EP1508168A1

公开(公告)日：2005-02-23

申请号：EP03704305.6

申请日：2003-02-10

申请人： ROBERT BOSCH GMBH

发明人： HAUENSTEIN, Henning ,  TOPP, Rainer ,  SEIBOLD, Jochen ,  BALSZUNAT, Dirk ,  ERNST, Stephan ,  FEILER, Wolfgang ,  KOESTER, Thomas ,  HORNUNG, Stefan ,  STREB, Dieter

IPC分类号： H01L23/373 ,  H01L21/60 ,  H01L29/423

CPC分类号： H01L23/488 ,  H01L23/3735 ,  H01L23/482 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention relates to a semiconductor component, which can be produced in a simple, rapid, but nevertheless reliable manner and can be used in particular for power applications. The component comprises: a semiconductor chip (2, 12); a lower first primary electrode layer (3, 13) configured on a first side (2a) of the semiconductor chip (2, 12); a lower control electrode layer (4, 14) configured on said first side (2a); an isolation layer (5, 15), which partially covers the lower first primary electrode layer (3, 13) and is configured on the first side (2a) between the lower first primary electrode layer (3, 13) and the lower control electrode layer (4, 14); an upper first primary electrode layer (6, 16) configured on the lower first primary electrode layer (3, 13); an upper control electrode layer (7, 17), which is configured on the lower control electrode layer (4, 14) and the isolation layer (5, 15), extending over the isolation layer (5, 15) partly above the lower first primary electrode layer (3, 13); and a second primary electrode layer (9, 19) that is configured on a second side (2b) of the semiconductor chip (2, 12).

摘要翻译： 一种半导体元件那样能够被简单地制造，快速，并且还可靠地并且没有为功率应用中使用，并包括半导体芯片，低级，第一主电极形成于所述半导体芯片，一个下控制电极的第一侧层 层形成在所述第一侧上，以形成在所述下部第一主电极层和下控制电极层和部分地覆盖上部第一主电极层上的下侧的第一主电极层之间的第一侧绝缘层的所有其上所形成的 其上形成有下控制电极层和绝缘层上，并部分地在较低的第一主电极层上面的绝缘层上延伸下部第一主电极层到上控制电极层中的所有，以及形成在第二侧上的第二主电极层 的半导体芯片。