公开(公告)号：EP2816590A3

公开(公告)日：2015-04-08

申请号：EP14169979.3

申请日：2014-05-27

申请人： Renesas Electronics Corporation

发明人： Oyachi, Kenji ,  Wada, Tamaki ,  Morinaga, Yuichi

IPC分类号： H01L23/31 ,  H01L21/48 ,  H01L23/49 ,  H01L23/498 ,  G06K19/077

CPC分类号： H01L24/48 ,  G06K19/07718 ,  G06K19/0772 ,  G06K19/07722 ,  G06K19/07743 ,  G06K19/07745 ,  H01L23/053 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1401 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/83862 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2224/4554

摘要： A semiconductor device has a base material (BS) comprised of insulating material having a through hole (SH), a terminal (TE) formed on a lower surface of the base material (BS), and a semiconductor chip mounted on an upper surface of the base material in a face-up manner. Further, the semiconductor device has a conductive member (BW) such as a wire, which electrically connects a pad of the semiconductor chip with an exposed surface of the terminal which is exposed from the through hole (SH) of the base material (BS), and has a sealing body (MR) for sealing the conductive member (BW), inside of the through hole (SH) of the base material (BS), and the semiconductor chip. An anchor (SB) means is provided in a region of the exposed surface (EX(TEa)) of the terminal (TE) which is exposed from the through hole (SH) of the base material (BS) except for a joint portion (BL) joined with the conductive member (BW) such as the wire. In this way the adhesiveness between the exposed surface (EX(TEa) of the terminal (TE) is increased so that the reliability of the semiconductor device may be improved.

摘要翻译： 半导体器件具有由绝缘材料构成的基体材料（BS），该绝缘材料具有通孔（SH），形成在基材（BS）的下表面上的端子（TE），以及安装在基材 基材正面朝上。 此外，半导体器件具有诸如导线的导电构件（BW），其将半导体芯片的焊盘与从基底材料（BS）的通孔（SH）暴露的端子的暴露表面电连接， 并且具有用于密封导电部件（BW）的密封体（MR），基体材料（BS）的通孔（SH）内部和半导体芯片。 在从基材（BS）的通孔（SH）露出的端子（TE）的暴露表面（EX（TEa））的区域中设置锚（SB）装置，除了接合部分 BL）与诸如导线的导电构件（BW）连接。 以这种方式，暴露表面（端子（TE）的EX（TE））之间的粘合性增加，从而可以提高半导体器件的可靠性。

公开(公告)号：EP2816590A2

公开(公告)日：2014-12-24

申请号：EP14169979.3

申请日：2014-05-27

申请人： Renesas Electronics Corporation

发明人： Oyachi, Kenji ,  Wada, Tamaki ,  Morinaga, Yuichi

IPC分类号： H01L23/31 ,  H01L21/48 ,  H01L23/49 ,  H01L23/498 ,  G06K19/077

CPC分类号： H01L24/48 ,  G06K19/07718 ,  G06K19/0772 ,  G06K19/07722 ,  G06K19/07743 ,  G06K19/07745 ,  H01L23/053 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1401 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/83862 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2224/4554

摘要： A semiconductor device has a base material (BS) comprised of insulating material having a through hole (SH), a terminal (TE) formed on a lower surface of the base material (BS), and a semiconductor chip mounted on an upper surface of the base material in a face-up manner. Further, the semiconductor device has a conductive member (BW) such as a wire, which electrically connects a pad of the semiconductor chip with an exposed surface of the terminal which is exposed from the through hole (SH) of the base material (BS), and has a sealing body (MR) for sealing the conductive member (BW), inside of the through hole (SH) of the base material (BS), and the semiconductor chip. An anchor (SB) means is provided in a region of the exposed surface (EX(TEa)) of the terminal (TE) which is exposed from the through hole (SH) of the base material (BS) except for a joint portion (BL) joined with the conductive member (BW) such as the wire. In this way the adhesiveness between the exposed surface (EX(TEa) of the terminal (TE) is increased so that the reliability of the semiconductor device may be improved.