公开(公告)号：EP2946408A4

公开(公告)日：2016-12-07

申请号：EP14768355

申请日：2014-03-14

申请人： SEMPRIUS INC

发明人： MEITL MATTHEW ,  MENARD ETIENNE ,  BOWER CHRISTOPHER

IPC分类号： H01L31/042 ,  H01L31/04

CPC分类号： H01L31/1876 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/043 ,  H01L31/054 ,  H01L31/06875 ,  H01L31/1892 ,  Y02E10/52 ,  Y02E10/544

公开(公告)号：EP2457250A4

公开(公告)日：2012-11-28

申请号：EP10802608

申请日：2010-06-22

申请人： SEMPRIUS INC

发明人： MENARD ETIENNE

IPC分类号： H01L21/28 ,  B05C1/02 ,  B05D1/18 ,  B82Y10/00 ,  G03F7/00 ,  H01L21/67

CPC分类号： H01L21/67092 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/187 ,  H01L21/67282 ,  H01L24/74 ,  H01L2224/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/00

公开(公告)号：EP2104954A4

公开(公告)日：2016-02-17

申请号：EP07874095

申请日：2007-10-31

申请人： UNIV ILLINOIS ,  SEMPRIUS INC

发明人： ROGERS JOHN ,  NUZZO RALPH ,  MEITL MATTHEW ,  MENARD ETIENNE ,  BACA ALFRED J ,  MOTALA MICHAEL ,  AHN JONG-HYUN ,  PARK SANG-IL ,  YU CHANG-JAE ,  KO HEUNG CHO ,  STOYKOVICH MARK ,  YOON JONGSEUNG

IPC分类号： H01L27/12 ,  B82Y10/00 ,  H01L25/075 ,  H01L29/786 ,  H01L31/054 ,  H01L31/0725 ,  H01L31/18 ,  H01S5/42

CPC分类号： H01L21/00 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

摘要翻译： 提供的是至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，其显示与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的器件功能的打印访问的器件几何形状和配置，诸如形状因子，部件密度和部件位置。 本发明的光学系统包括显示一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适应性和可伸长性。

公开(公告)号：EP2351068A4

公开(公告)日：2013-06-19

申请号：EP09828196

申请日：2009-11-19

申请人： SEMPRIUS INC

发明人： MENARD ETIENNE

IPC分类号： H01L21/20 ,  H01L21/58 ,  H01L21/683

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/75303 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01049 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/00

摘要： Provided are methods and devices for transfer printing of semiconductor elements to a receiving surface. In an aspect, the printing is by conformal contact between an elastomeric stamp inked with the semiconductor elements and a receiving surface, and during stamp removal, a shear offset is applied between the stamp and the receiving surface. The shear-offset printing process achieves high printing transfer yields with good placement accuracy. Process parameter selection during transfer printing, including time varying stamp-backing pressure application and vertical displacement, yields substantially constant delamination rates with attendant transfer printing improvement.

公开(公告)号：EP2311073A4

公开(公告)日：2012-06-06

申请号：EP09800920

申请日：2009-07-22

申请人： SEMPRIUS INC

发明人： MENARD ETIENNE

IPC分类号： G03F7/00 ,  H01L21/302

CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00