公开(公告)号：EP2104954A4

公开(公告)日：2016-02-17

申请号：EP07874095

申请日：2007-10-31

Applicant: UNIV ILLINOIS ,  SEMPRIUS INC

Inventor： ROGERS JOHN ,  NUZZO RALPH ,  MEITL MATTHEW ,  MENARD ETIENNE ,  BACA ALFRED J ,  MOTALA MICHAEL ,  AHN JONG-HYUN ,  PARK SANG-IL ,  YU CHANG-JAE ,  KO HEUNG CHO ,  STOYKOVICH MARK ,  YOON JONGSEUNG

IPC: H01L27/12 ,  B82Y10/00 ,  H01L25/075 ,  H01L29/786 ,  H01L31/054 ,  H01L31/0725 ,  H01L31/18 ,  H01S5/42

CPC classification number: H01L21/00 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

Abstract translation: 提供的是至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，其显示与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的器件功能的打印访问的器件几何形状和配置，诸如形状因子，部件密度和部件位置。 本发明的光学系统包括显示一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适应性和可伸长性。

公开(公告)号：EP1759422A4

公开(公告)日：2011-04-06

申请号：EP05755193

申请日：2005-06-02

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/20 ,  B81C1/00 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L21/77 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18

CPC classification number: H01L23/02 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/76 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。 方法，设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。 本发明因此提供了可拉伸的半导体结构，并且能够在拉伸构型良好的性能可拉伸电子器件。

公开(公告)号：EP1039995A4

公开(公告)日：2006-04-26

申请号：EP98959577

申请日：1998-11-23

Applicant: CALIPER LIFE SCIENCES INC

Inventor： KENNEDY COLIN

IPC: B32B3/00 ,  B01L3/00 ,  B32B3/30 ,  B32B38/14 ,  B41M3/00

CPC classification number: B32B38/14 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2400/0415 ,  B32B3/30 ,  B41M3/006 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0184 ,  B81C2201/0185 ,  B81C2201/019 ,  Y10T428/24744 ,  Y10T428/24826 ,  Y10T428/24876 ,  Y10T428/24893 ,  Y10T428/24926 ,  Y10T436/2575

Abstract: Laminates (600) having microfluidic structures (615-635) disposed between sheets (605-610) of the laminate (600) are provided. The microfluidic structures (615-635) are raised on a sheet (605, 610) of the laminate (600), typically by printing the structure (615-635) on the sheet (605, 610). Printing methods include Serigraph, ink-jet, intaligo, offset printing and thermal laser printing.

公开(公告)号：EP2482981A1

公开(公告)日：2012-08-08

申请号：EP09748846.4

申请日：2009-09-28

Applicant: Universitat Rovira I Virgili

Inventor： KATAKIS, Ioannis ,  BEJARANO, Diego ,  LOZANO SANCHEZ, Pablo

IPC: B01L3/00

CPC classification number: B41J2/135 ,  B01L3/502707 ,  B01L2300/0645 ,  B01L2300/0887 ,  B33Y80/00 ,  B81C1/00071 ,  B81C2201/0184 ,  B81C2201/0185

Abstract: Micro fluidic devices comprising three dimensional elements fabricated onto a substrate using thick film printing technology, e.g., screen printing, wherein the three dimensional elements possess both structural and functional properties.

Abstract translation: 微流体装置包括使用厚膜印刷技术（例如丝网印刷）制造在基底上的三维元件，其中三维元件具有结构和功能性质。

公开(公告)号：EP1759422A2

公开(公告)日：2007-03-07

申请号：EP05755193.9

申请日：2005-06-02

Applicant: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS

Inventor： NUZZO, Ralph, G. ,  ROGERS, John, A. ,  MENARD, Etienne ,  LEE, Keon Jae ,  KHANG, Dahl-Young ,  SUN, Yugang ,  MEITL, Matthew ,  ZHU, Zhengtao

IPC: H01L31/0312

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：EP1039995A1

公开(公告)日：2000-10-04

申请号：EP98959577.2

申请日：1998-11-23

Applicant: Caliper Technologies Corporation

Inventor： KENNEDY, Colin

IPC: B32B3/00 ,  B32B31/00

CPC classification number: B32B38/14 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2400/0415 ,  B32B3/30 ,  B41M3/006 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0184 ,  B81C2201/0185 ,  B81C2201/019 ,  Y10T428/24744 ,  Y10T428/24826 ,  Y10T428/24876 ,  Y10T428/24893 ,  Y10T428/24926 ,  Y10T436/2575

Abstract: Laminates (600) having microfluidic structures (615-635) disposed between sheets (605-610) of the laminate (600) are provided. The microfluidic structures (615-635) are raised on a sheet (605, 610) of the laminate (600), typically by printing the structure (615-635) on the sheet (605, 610). Printing methods include Serigraph, ink-jet, intaligo, offset printing and thermal laser printing.

公开(公告)号：EP2650905A3

公开(公告)日：2014-10-01

申请号：EP13003426.7

申请日：2005-06-02

Applicant: The Board of Trustees of the University of Illinois

Inventor： Nuzzo, Ralph G. ,  Rogers, John, A. ,  Menard, Etienne ,  Lee, Keon Jae ,  Khang, Dahl-Young ,  Sun, Yugang ,  Meitl, Matthew ,  Zhu, Zhengtao

IPC: H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L21/02

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：EP2461159A1

公开(公告)日：2012-06-06

申请号：EP10193535.1

申请日：2010-12-02

Applicant: Honeywell Romania S.R.L.

Inventor： Cobianu, Cornel. P.

IPC: G01N29/02 ,  G01N29/22 ,  B01L3/00 ,  G01N33/00 ,  H03H9/24 ,  B81C1/00

CPC classification number: G01N29/022 ,  B01L3/502707 ,  B81B2201/0214 ,  B81B2203/0118 ,  B81B2207/015 ,  B81C1/00214 ,  B81C2201/0185 ,  B81C2203/0118 ,  B81C2203/0714 ,  B81C2203/0735 ,  B82Y40/00 ,  G01N29/036 ,  G01N29/222 ,  G01N2291/021 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0427

Abstract: A carbon dioxide sensor comprising a first beam that includes a functionalized surface and a second beam that includes a functionalized surface such that reduced-drift differential sensing of carbon dioxide may be performed by monitoring changes in the resonant frequency of the first beam relative to the resonant frequency of second beam.

Abstract translation: 一种二氧化碳传感器，其包括包括官能化表面的第一光束和包括功能化表面的第二光束，使得可以通过监测第一光束相对于谐振的谐振频率的变化来执行二氧化碳的减少漂移差分感测 第二光束的频率。

公开(公告)号：EP2200930A2

公开(公告)日：2010-06-30

申请号：EP08786315.5

申请日：2008-07-22

Applicant: Robert Bosch GmbH

Inventor： MAY, Johanna

IPC: B81C1/00

CPC classification number: B81C1/0046 ,  B81C2201/0185 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: The invention relates to a method for printing a nanostructure and/or microstructure (5) on a substrate (1) having a three-dimensional macro-surface (6). The method is characterized in that a substance (12, 13) is applied having a three-dimensional stamp macro-surface (10), the shape of which matches the macro-surface (2) of the substrate (1) at least in some sections and which is provided with a stamp nanostructure and/or microstructure (10), and the stamp (4) is positioned relative to a substrate (1), and the stamp (4) and substrate (1) are brought together, thus printing the substance (12, 13) as a nanostructure and/or microstructure (5) onto the substrate (1). The invention further relates to a stamp (4) for carrying out the method, and to a substrate (1) produced with said method.

公开(公告)号：EP2461159B1

公开(公告)日：2017-10-25

申请号：EP10193535.1

申请日：2010-12-02

Applicant: Honeywell Romania S.R.L.

Inventor： Cobianu, Cornel. P.

IPC: G01N29/036

CPC classification number: G01N29/022 ,  B01L3/502707 ,  B81B2201/0214 ,  B81B2203/0118 ,  B81B2207/015 ,  B81C1/00214 ,  B81C2201/0185 ,  B81C2203/0118 ,  B81C2203/0714 ,  B81C2203/0735 ,  B82Y40/00 ,  G01N29/036 ,  G01N29/222 ,  G01N2291/021 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0427