公开(公告)号：EP2559717A1

公开(公告)日：2013-02-20

申请号：EP11768893.7

申请日：2011-04-13

申请人： Sony Chemical & Information Device Corporation

发明人： NAMIKI, Hidetsugu ,  ISHIGAMI, Akira ,  UMAKOSHI, Hideaki ,  KANISAWA, Shiyuki

IPC分类号： C08G59/18 ,  C08G59/42 ,  C09J7/00 ,  C09J9/02 ,  C09J11/06 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01B5/16

CPC分类号： C08G59/42 ,  C08F220/18 ,  C08L33/068 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01L2224/14 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  C08F2220/1808 ,  C08F2220/325 ,  H01L2924/00014

摘要： To provide a curable resin composition that can improve resistant properties such as thermal impact resistance even in a high-temperature and high-humidity environment and has a high adhesive property, high conduction reliability and superior crack resistant property. The curable resin composition contains an epoxy resin and an epoxy resin-use curing agent, and is characterized in that a difference between a maximum value of tan δ in a viscoelastic spectrum and a value of the tan δ at -40°C thereof is 0.1 or more.

摘要翻译： 提供一种可固化树脂组合物做了能提高耐性质：如即使在高温热的耐冲击性和高湿度环境，并具有高粘合性，高导通可靠性和优异的耐裂缝性能。 的固化性树脂组合物含有环氧树脂和环氧树脂使用的固化剂，并且其特征在于在-40℃下做“在粘弹性谱和tanδ的值”的黄褐色的最大值之间的差是其0.1 以上。

公开(公告)号：EP2560198A1

公开(公告)日：2013-02-20

申请号：EP11768894.5

申请日：2011-04-13

申请人： Sony Chemical & Information Device Corporation

发明人： NAMIKI, Hidetsugu ,  KANISAWA, Shiyuki ,  UMAKOSHI, Hideaki ,  ISHIGAMI, Akira

IPC分类号： H01L21/60 ,  C09J9/02 ,  C09J11/00 ,  C09J201/00 ,  H01L33/60 ,  H01L33/62

CPC分类号： C09J9/02 ,  C08K3/08 ,  C08K3/22 ,  C08K3/24 ,  C08K7/08 ,  C08K9/06 ,  C08K2003/0831 ,  C08K2003/2241 ,  C08K2003/2296 ,  C09J11/04 ,  H01L24/06 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/13339 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01081 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.

摘要翻译： 提供了能够保持发光元件的发光效率并防止发生裂缝以获得导通可靠性的光反射各向异性导电粘合剂和发光装置。 光反射各向异性导电粘合剂包含热固性树脂复合物，导电颗粒和反光针状绝缘颗粒。 这些光反射针状绝缘粒子是选自氧化钛，氧化锌，钛酸盐中的至少一种的无机粒子。

公开(公告)号：EP1993124A1

公开(公告)日：2008-11-19

申请号：EP07715235.3

申请日：2007-03-06

申请人： Sony Chemical & Information Device Corporation

发明人： FURUTA, Kazutaka ,  KANISAWA, Shiyuki ,  TANIGUCHI, Masaki

IPC分类号： H01L21/60 ,  H05K3/32

CPC分类号： H05K3/323 ,  H01L24/29 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electric device having high reliability is to be produced. An adhesive layer 20 includes a thermosetting resin and a radiation-curable resin, and a portion of the adhesive layer 20 is protruded outwardly from an edge of the electric part 15. Radiation rays 29 do not pass through the electric part 15, and the radiation-curable resin is cured in the protruding portion 26, while the radiation-curable resin in that portion of the adhesive layer 20 which is positioned right behind the electric part 15 is not polymerized. Since the electric part 15 is fixed with the polymerized radiation-curable type resin, the electric part 15 is not misaligned when the electric part 15 is pressed under heating.

摘要翻译： 制造出具有高可靠性的电气装置。 粘合剂层20包括热固性树脂和可辐射固化树脂，并且粘合剂层20的一部分从电气部件15的边缘向外突出。辐射线29不穿过电气部件15，并且辐射 可弯曲的树脂在突出部分26中固化，而位于电气部件15正后方的粘合剂层20的该部分中的辐射固化树脂没有聚合。 由于电气部件15用聚合的可辐射固化型树脂固定，所以当加热时电气部件15被按压时，电气部件15不会失准。

公开(公告)号：EP2302013A1

公开(公告)日：2011-03-30

申请号：EP09797745.8

申请日：2009-04-03

申请人： Sony Chemical & Information Device Corporation

发明人： NAMIKI, Hidetsugu ,  KANISAWA, Shiyuki ,  KATAYANAGI, Genki

IPC分类号： C09J163/00 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  H01B1/22 ,  H01R11/01 ,  H05K1/09 ,  H05K3/32

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L33/62 ,  H01L2924/07811 ,  H01L2924/12041 ,  H05K3/323 ,  H01L2924/00

摘要： An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35°C, 55°C, 95°C, and 150°C of a cured product of the anisotropic conductive adhesive are denoted by EM 35 , EM 55 , EM 95 , and EM 150 , respectively, and change rates in the elastic modulus between 55°C and 95°C and between 95°C and 150°C are denoted by ΔEM 55-95 and ΔEM 95 -150, respectively, the following expressions (1) to (5) are satisfied. 700 Mpa ≦ EM 35 ≦ 3000 MPa EM 150 EM 95 EM 55 EM 35 Δ ⁢ EM 55 - 95 Δ ⁢ EM 95 - 150 20 % ≦ Δ ⁢ EM 55 - 95 40 % ≦ Δ ⁢ EM 95 - 150

摘要翻译： 各向异性导电粘合剂包括含有环氧化合物和固化剂的环氧粘合剂和分散在环氧粘合剂中的导电颗粒。 在35℃，55℃，95℃和150℃下各向异性导电粘合剂的固化产物的弹性模量分别由EM 35，EM 55，EM 95和EM 150表示，并且变化率 在55℃至95℃之间和95℃至150℃之间的弹性模量分别由“EM 55-95”和“EM 95-150”表示，满足以下表达式（1）至（5） 。 700 Mpa‰| EM 35‰| 3000 MPa EM 150