摘要:
Electrostatic capacitance measurements are used to detect chemical or biological analytes, or chemical interactions, with great sensitivity. A diaphragm is coated with a material capable of selectively interacting with an analyte of interest, and interaction of the analyte with the coating exerts stresses tangential to the diaphragm's surface. These stresses cause diaphragm displacements that are sensed as varying capacitance.
摘要:
The present invention relates to tissue engineered compositions and methods comprising nanotopographic surface topography ('nanotopography') for use in modulating the organization and/or function of multiple cell types.
摘要:
A microfluidic device for modeling a tumor-immune microenvironment can include a multiwell plate defining a plurality of microenvironment units fluidically coupled with a plurality of wells. Each microenvironment unit of the plurality of microenvironment units can include one or more compartments. Each microenvironment unit can include a trapping feature positioned within the one or more compartments. The trapping feature can be defined by a portion of at least one of a sidewall or a floor of the one or more compartments. The trapping feature can restrict movement of a tissue sample introduced into the one or more compartments and to allow fluid to flow past the tissue sample. The microfluidic device can include a plurality of micropumps each coupled with a respective well and configured to control movement of a respective fluid sample through each respective well.
摘要:
An adhesive article includes a biocompatible and at least partially biodegradable substrate having a surface; and a plurality of protrusions extending from the surface. The protrusions include a biocompatible and at least partially biodegradable material, and have an average height of less than approximately 1,000 micrometers.
摘要:
The invention provides a general fabrication method for producing MicroElectroMechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI). One first obtains an SOI wafer that has (i) a handle layer, (ii) a dielectric layer, and (iii) a device layer. A mesa etch has been made on the device layer of the SOI wafer and a structural etch has been made on the dielectric layer of the SOI wafer. One then obtains a substrate (such as glass or silicon), where a pattern has been etched onto the substrate. The SOI wafer and the substrate are bonded together. Then the handle layer of the SOI wafer is removed, followed by the dielectric layer of the SOI wafer.