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公开(公告)号：EP0595600A1
公开(公告)日：1994-05-04
申请号：EP93308532.6
申请日：1993-10-26
发明人： Nelson, Stephen R. , Davis, Dennis D. , Barnett, John , Carter, Buford H. , Lahutsky, Tammy J. , Haas, Glen R.,Jr.
IPC分类号： H01L23/66 , H01L23/495
CPC分类号： H01L24/06 , H01L23/49541 , H01L23/49575 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6644 , H01L2224/0401 , H01L2224/05553 , H01L2224/0603 , H01L2224/48137 , H01L2224/48195 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01072 , H01L2924/01077 , H01L2924/014 , H01L2924/10329 , H01L2924/1305 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0237 , H05K1/182 , H05K3/3421 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： This is a device package comprising: a leadframe 54 comprising a plurality of leads for effecting circuit connections to a device 30; and a metal ground piece 52 connected to the leadframe 12. Other devices and methods are also disclosed.
摘要翻译： 这是一种器件封装，其包括：引线框54，其包括用于实现到器件30的电路连接的多个引线; 以及连接到引线框架12的金属接地片52.还公开了其它装置和方法。
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公开(公告)号：EP0844664A3
公开(公告)日：2000-05-10
申请号：EP97120552.1
申请日：1997-11-24
IPC分类号： H01L23/485
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05001 , H01L2224/05073 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/4807 , H01L2224/48453 , H01L2224/48458 , H01L2224/48463 , H01L2224/4847 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85205 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/19043 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/2075 , H01L2924/20754
摘要： A bond pad (18, 58) may comprise a base (20, 60) of bondable material. The base (20, 60) may have a periphery (26, 66). A segment of an interconnect (24, 64) may contact an extended section (28, 68) of the periphery (26, 66) to electrically couple the interconnect (24, 64) to the bond pad (18, 58). The interconnect (24, 64) may comprise a material less resistive than the bondable material.
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公开(公告)号：EP0595600B1
公开(公告)日：1999-08-25
申请号：EP93308532.6
申请日：1993-10-26
发明人： Nelson, Stephen R. , Davis, Dennis D. , Barnett, John , Carter, Buford H. , Lahutsky, Tammy J. , Haas, Glen R.,Jr.
IPC分类号： H01L23/66 , H01L23/495
CPC分类号： H01L24/06 , H01L23/49541 , H01L23/49575 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6644 , H01L2224/0401 , H01L2224/05553 , H01L2224/0603 , H01L2224/48137 , H01L2224/48195 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01072 , H01L2924/01077 , H01L2924/014 , H01L2924/10329 , H01L2924/1305 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0237 , H05K1/182 , H05K3/3421 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
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公开(公告)号：EP0844664A2
公开(公告)日：1998-05-27
申请号：EP97120552.1
申请日：1997-11-24
IPC分类号： H01L23/485
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05001 , H01L2224/05073 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/4807 , H01L2224/48453 , H01L2224/48458 , H01L2224/48463 , H01L2224/4847 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/85205 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/19043 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/2075 , H01L2924/20754
摘要： A bond pad (18, 58) may comprise a base (20, 60) of bondable material. The base (20, 60) may have a periphery (26, 66). A segment of an interconnect (24, 64) may contact an extended section (28, 68) of the periphery (26, 66) to electrically couple the interconnect (24, 64) to the bond pad (18, 58). The interconnect (24, 64) may comprise a material less resistive than the bondable material.
摘要翻译： 接合垫（18,58）可以包括可结合材料的基底（20,60）。 基座（20,60）可以具有周边（26,66）。 互连部分（24,64）可以接触周边（26,66）的延伸部分（28,68），以将互连（24,64）电耦合到接合焊盘（18,58）。 互连（24,64）可以包括比可结合材料更小的电阻的材料。
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