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公开(公告)号：EP2064731A1
公开(公告)日：2009-06-03
申请号：EP07828876.8
申请日：2007-09-21
CPC分类号： H01L29/7802 , H01L21/046 , H01L29/1608 , H01L29/45 , H01L29/78 , Y10S438/931
摘要： A method is set forth of forming an ohmic electrode having good characteristics on a SiC semiconductor layer. In the method, a Ti-layer and an Al-layer are formed on a surface of the SiC substrate. The SiC substrate having the Ti-layer and the Al-layer is maintained at a temperature that is higher than or equal to a first temperature and lower than a second temperature until all Ti in the Ti-layer has reacted with Al. The first temperature is the minimum temperature of a temperature zone at which the Ti reacts with the Al to form Al3Ti, and the second temperature is the minimum temperature of a temperature zone at which the Al3Ti reacts with SiC to form Ti3SiC2. As a result of this maintaining of temperature step, an Al3Ti-layer is formed on the surface of the SiC substrate. The method also comprises further heating the SiC substrate having the Al3Ti-layer to a temperature that is higher than the second temperature. As a result of this step of further heating the SiC substrate reacts with Al3Ti of the Al3Ti-layer to form a Ti3SiC2-layer on the surface of the SiC substrate.
摘要翻译： 阐述了在SiC半导体层上形成具有良好特性的欧姆电极的方法。 在该方法中，在SiC衬底的表面上形成Ti层和Al层。 具有Ti层和Al层的SiC衬底保持在高于或等于第一温度且低于第二温度的温度，直到Ti层中的全部Ti与Al反应。 第一温度是Ti与Al反应形成Al 3 Ti的温度区的最低温度，第二温度是Al 3 Ti与SiC反应形成Ti 3 SiC 2的温度区的最低温度。 作为温度步骤的维持的结果，在SiC衬底的表面上形成Al 3 Ti层。 该方法还包括将具有Al 3 Ti层的SiC衬底进一步加热至高于第二温度的温度。 作为进一步加热的这一步骤的结果，SiC衬底与Al3Ti层的Al3Ti反应以在SiC衬底的表面上形成Ti3SiC2层。
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公开(公告)号：EP2064731B1
公开(公告)日：2010-04-07
申请号：EP07828876.8
申请日：2007-09-21
CPC分类号： H01L29/7802 , H01L21/046 , H01L29/1608 , H01L29/45 , H01L29/78 , Y10S438/931
摘要： A method is set forth of forming an ohmic electrode having good characteristics on a SiC semiconductor layer. In the method, a Ti-layer and an Al-layer are formed on a surface of the SiC substrate. The SiC substrate having the Ti-layer and the Al-layer is maintained at a temperature that is higher than or equal to a first temperature and lower than a second temperature until all Ti in the Ti-layer has reacted with Al. The first temperature is the minimum temperature of a temperature zone at which the Ti reacts with the Al to form Al3Ti, and the second temperature is the minimum temperature of a temperature zone at which the Al3Ti reacts with SiC to form Ti3SiC2. As a result of this maintaining of temperature step, an Al3Ti-layer is formed on the surface of the SiC substrate. The method also comprises further heating the SiC substrate having the Al3Ti-layer to a temperature that is higher than the second temperature. As a result of this step of further heating the SiC substrate reacts with Al3Ti of the Al3Ti-layer to form a Ti3SiC2-layer on the surface of the SiC substrate.
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公开(公告)号：EP2863440A1
公开(公告)日：2015-04-22
申请号：EP13804906.9
申请日：2013-06-06
发明人： TAKEUCHI, Yuichi , SUZUKI, Naohiro , SOEJIMA, Narumasa , WATANABE, Yukihiko , SUGIMOTO, Masahiro , TAKAYA, Hidefumi , SOENO, Akitaka , MORIMOTO, Jun
IPC分类号： H01L29/78 , H01L21/28 , H01L21/336 , H01L27/04 , H01L29/06 , H01L29/12 , H01L29/47 , H01L29/861 , H01L29/868 , H01L29/872
CPC分类号： H01L29/7811 , H01L21/046 , H01L21/0475 , H01L21/30604 , H01L21/308 , H01L21/761 , H01L21/8213 , H01L29/0615 , H01L29/063 , H01L29/0634 , H01L29/0661 , H01L29/0696 , H01L29/0878 , H01L29/1095 , H01L29/157 , H01L29/158 , H01L29/1608 , H01L29/41766 , H01L29/4236 , H01L29/66068 , H01L29/66727 , H01L29/66734 , H01L29/7806 , H01L29/7813 , H01L29/861 , H01L29/872
摘要： An SiC semiconductor device has a p type region (5) including a low concentration region (5b) and a high concentration region (5c) filled in a trench (5a) formed in a cell region. A p type column is provided by the low concentration region (5b), and a p + type deep layer is provided by the high concentration region (5c). Thus, since a SJ structure can be made by the p type column provided by the low concentration region (5b) and the n type column provided by the n type drift layer (2), an on-state resistance can be reduced. Since a drain potential can be blocked by the p + type deep layer provided by the high concentration region (5c), at a time of turning off, an electric field applied to the gate insulation film (8) can be alleviated and thus breakage of the gate insulation film (8) can be restricted. Therefore, the SiC semiconductor device can realize the reduction of the on-state resistance and the restriction of breakage of the gate insulation film (8).
摘要翻译： SiC半导体器件具有包括填充在单元区域中形成的沟槽（5a）中的低浓度区域（5b）和高浓度区域（5c）的p型区域（5）。 低浓度区（5b）提供p型柱，高浓度区（5c）提供p +型深层。 因此，由于可以通过由低浓度区域（5b）提供的p型列和由n型漂移层（2）提供的n型列来形成SJ结构，所以可以降低导通电阻。 由于漏极电位能够被高浓度区域（5c）提供的p +型深层阻挡，所以在关断时，可以减轻施加到栅极绝缘膜（8）的电场，并因此破坏 栅绝缘膜（8）可以被限制。 因此，SiC半导体器件可以实现导通电阻的降低和栅极绝缘膜（8）的断裂限制。
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公开(公告)号：EP1779438B2
公开(公告)日：2019-07-31
申请号：EP05755884.3
申请日：2005-06-22
发明人： SUGIMOTO, Masahiro , KACHI, Tetsu , NAKANO, Yoshitaka , UESUGI, Tsutomu , UEDA, Hiroyuki , SOEJIMA, Narumasa
IPC分类号： H01L29/778 , H01L21/335
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公开(公告)号：EP1815523B1
公开(公告)日：2016-09-14
申请号：EP05828962.0
申请日：2005-11-14
IPC分类号： H01L29/812 , H01L29/78 , H01L29/778 , H01L29/06 , H01L29/08 , H01L29/20 , H01L29/41
CPC分类号： H01L29/7802 , H01L29/0649 , H01L29/0653 , H01L29/0692 , H01L29/0696 , H01L29/0843 , H01L29/0847 , H01L29/0891 , H01L29/2003 , H01L29/41 , H01L29/778 , H01L29/7788 , H01L29/8122
摘要： A semiconductor device is provided with a drain electrode 22, a semiconductor base plate 32, an electric current regulation layer 42 covering a part of a surface of the semiconductor base plate 32 and leaving a non-covered surface 55 at the surface of the semiconductor base plate 32, a semiconductor layer 50 covering a surface of the electric current regulation layer 42, and a source electrode 62 formed at a surface of the semiconductor layer 50. A drift region 56, a channel forming region 54, and a source region 52 are formed within the semiconductor layer 50. The drain electrode 22 is connected to a first terminal of a power source, and the source electrode 62 is connected to a second terminal of the power source. With this semiconductor layer 50, it is possible to increase withstand voltage or reduce the occurrence of current leakage.
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6.发明公开NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开VERFAHREN ZU SEINER HERSTELLUNG的NITRID-HALBLEITERBAUEMENT
公开(公告)号：EP2405467A1
公开(公告)日：2012-01-11
申请号：EP09841075.6
申请日：2009-03-02
IPC分类号： H01L21/338 , H01L29/778 , H01L29/812
CPC分类号： H01L29/7787 , H01L29/2003 , H01L29/41766 , H01L29/66462 , H01L29/7788
摘要： Provided are a vertical nitride semiconductor device in which occurrence of leak currents can be suppressed, and a method for manufacturing such nitride semiconductor device. A nitride semiconductor device (100), which is a vertical HEMT, is provided with an n - type GaN first nitride semiconductor layer (2), p + type GaN second nitride semiconductor layers (6a, 6b), an n - type GaN third nitride semiconductor layer (9), and an n - type AIGaN fourth nitride semiconductor layer (8) that is in hetero junction with a front surface of the third nitride semiconductor layer (9). Openings (11a, 11b) that penetrate the third nitride semiconductor layer (9) and reach front surfaces of the second nitride semiconductor layers (6a, 6b) are provided at positions isolated from the peripheral edge of the third nitride semiconductor layer (9). Source electrodes (12a, 12b) are provided in the openings (11a, 11b). Etching damage (7b) that is in contact with the source electrodes (12a, 12b) is surrounded by a region where no etching damage is formed.
摘要翻译： 提供了可以抑制泄漏电流的发生的垂直氮化物半导体器件，以及这种氮化物半导体器件的制造方法。 作为垂直HEMT的氮化物半导体器件（100）具有n型GaN第一氮化物半导体层（2），p +型GaN第二氮化物半导体层（6a，6b），n型GaN第三 氮化物半导体层（9）和与第三氮化物半导体层（9）的前表面异质结的n型AIGaN第四氮化物半导体层（8）。 穿过第三氮化物半导体层（9）并到达第二氮化物半导体层（6a，6b）的前表面的开口（11a，11b）设置在与第三氮化物半导体层（9）的周边隔离的位置。 源电极（12a，12b）设置在开口（11a，11b）中。 与源电极（12a，12b）接触的蚀刻损伤（7b）被没有形成蚀刻损伤的区域包围。
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公开(公告)号：EP1842238B1
公开(公告)日：2010-07-21
申请号：EP06701454.8
申请日：2006-01-20
IPC分类号： H01L29/778 , H01L29/45 , H01L29/423 , H01L21/335 , H01L29/20
CPC分类号： H01L29/452 , H01L29/2003 , H01L29/42316 , H01L29/66462 , H01L29/7787
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公开(公告)号：EP1842238A2
公开(公告)日：2007-10-10
申请号：EP06701454.8
申请日：2006-01-20
IPC分类号： H01L29/778
CPC分类号： H01L29/452 , H01L29/2003 , H01L29/42316 , H01L29/66462 , H01L29/7787
摘要： A semiconductor device 10 comprises a heterojunction between a lower semiconductor layer 26 made of p-type gallium nitride and an upper semiconductor layer 28 made of n-type AlGaN, wherein the upper semiconductor layer 28 has a larger band gap than the lower semiconductor layer 26. The semiconductor device 10 further comprises a drain electrode 32 formed on a portion of a top surface of the upper semiconductor layer 28, a source electrode 34 formed on a different portion of the top surface of the upper semiconductor layer 28, and a gate electrode 36 electrically connected to the lower semiconductor layer 26. The semiconductor device 10 can operate as normally-off.
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