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1.发明公开PHENOXY CYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USE THEREOF 审中-公开AKTIVER PHENOXYCLOTRIPHOSPHAZENESTER，HALOGENFREIE HARZZUSAMMENSETZUNG UND VERWENDUNG DAVON
公开(公告)号：EP3037475A4
公开(公告)日：2017-06-07
申请号：EP14894791
申请日：2014-06-13
发明人： HE YUESHAN
IPC分类号： C08L63/00 , C07F9/6581 , C07F9/6593 , C08G59/30 , C08G63/692 , C08J5/24 , C08K5/5399 , C08L79/02 , C09K21/14 , H01B3/40 , H05K1/03
CPC分类号： C07F9/65812 , C07F9/65815 , C08G59/304 , C08J5/043 , C08J5/24 , C08J2363/00 , C08J2363/08 , C08J2371/00 , C08J2375/00 , C08J2379/00 , C08J2379/02 , C08J2435/06 , C08J2463/08 , C08K5/5399 , C08L63/08 , C08L71/00 , C08L75/00 , C08L79/02 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , C09K21/12 , C09K21/14 , H05K1/0373 , H05K2201/012 , H05K2201/0145 , H05K2201/0209
摘要： The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol.% of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.
摘要翻译： 本发明公开了一种苯氧基环三磷腈活性酯，一种无卤树脂组合物及其用途。 苯氧基环三磷腈活性酯包含至少65摩尔％的具有以下结构式的物质。 该无卤树脂组合物包含5-50重量份苯氧基环三磷腈活性酯，15-85重量份热固性树脂，1-35重量份固化剂，0-5重量份固化 促进剂和0-100重量份的无机填料。 本发明公开了将苯氧基环三磷腈活性酯引入到热固性树脂中，使活性酯与环氧树脂等热固性树脂反应而不产生羟基，这不仅满足了无卤素和阻燃性的要求，而且还改善了电气 使系统的性能（降低和稳定Dk和Df），从而使高频和高速衬底材料成为可能的非卤化。
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2.发明公开HALOGEN-FREE RESIN COMPOSITION, AND PREPREG AND LAMINATED BOARD FOR PRINTED CIRCUIT USING SAME 审中-公开HALOGENFREIE HARZZUSAMMENSETZUNG SOWIE PREPREG UND LAMINATPLATTEFÜRGEDRUCKTE SCHALTUNG DAMIT
公开(公告)号：EP3156451A1
公开(公告)日：2017-04-19
申请号：EP14894564.5
申请日：2014-06-10
发明人： YOU, Jiang
IPC分类号： C08L63/00
CPC分类号： C08L63/00 , B32B27/38 , B32B27/42 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2264/104 , B32B2307/204 , B32B2307/306 , B32B2307/3065 , B32B2307/714 , B32B2307/726 , B32B2307/7265 , B32B2307/734 , B32B2457/08 , C08G14/06 , C08G59/3218 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2379/02 , C08J2379/04 , C08J2461/06 , C08J2463/00 , C08J2479/02 , C08J2479/04 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K5/49 , C08L61/04 , C08L61/06 , C08L61/34 , C08L63/04 , C08L79/02 , C08L79/04 , C08L79/06 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , H05K1/0373 , H05K2201/012 , H05K2201/015
摘要： The present invention discloses a halogen-free resin composition, and a prepreg and a laminate used for printed circuit. The halogen-free resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin; alkyl phenol novolac curing agent; phosphorus-containing flame retardant. The alkyl phenol epoxy resin used in the present invention has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties while it has higher glass transition temperature, low water absorption and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With alkyl phenol novolac being used as curing agent, the advantages that the molecular structure thereof has many alkyls and thus the dielectric properties are excellent and the water absorption is low are fully played. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.
摘要翻译： 本发明公开了一种无卤树脂组合物，以及用于印刷电路的预浸料和层压材料。 无卤树脂组合物包括：烷基酚环氧树脂; 苯并恶嗪树脂; 烷基苯酚酚醛清漆固化剂; 含磷阻燃剂。 本发明中使用的烷基酚环氧树脂在其分子结构中具有许多烷基支链，使组合物具有优异的介电性能，同时具有较高的玻璃化转变温度，低吸水性和良好的耐热性。 将苯并恶嗪树脂混合到组合物中可以进一步降低固化产物的介电常数，介电损耗值和吸水率。 使用烷基苯酚酚醛清漆作为固化剂，其分子结构具有许多烷基，因此介电性能优异且吸水率低的优点得到充分发挥。 用于使用该树脂组合物制备的印刷电路板的预浸料和层压材料具有低介电常数，低介电损耗因子，低吸水率，高尺寸稳定性，高耐热性，良好的阻燃性，加工性和耐化学性。
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公开(公告)号：EP3024888A1
公开(公告)日：2016-06-01
申请号：EP13739996.0
申请日：2013-07-22
申请人： Actega DS GmbH
CPC分类号： C08L23/06 , B65D53/06 , C08K3/30 , C08L23/0815 , C08L23/0853 , C08L23/22 , C08L53/00 , C08L2201/08 , C08L2201/14 , C08L2201/22 , C08L2203/10 , C08L2205/025 , C08L2205/03 , C08L2205/035 , C08L2207/062 , C08L2207/066
摘要： The invention relates to polymer compound for a PVC-free sealing system for container closures, which is equipped with at least one oxygen-consuming compound, in which the Shore D hardness of the polymer compound is at least 20 and the polymer compound has a melt flow index (190°C, 5 kg) of at least 5.
摘要翻译： 本发明涉及一种用于容器封闭件的无PVC密封系统的高分子化合物，其具有至少一种耗氧化合物，其中高分子化合物的肖氏D硬度至少为20，高分子化合物具有 熔体流动指数（190℃，5kg）至少为5。
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4.发明公开HALOGEN-FREE FLAME RETARDANT TYPE RESIN COMPOSITION 审中-公开HALOGENFREIE FLAMMHEMMENDE HARZZUSAMMENSETZUNG
公开(公告)号：EP3112422A4
公开(公告)日：2017-08-16
申请号：EP15755556
申请日：2015-02-11
发明人： XI LONG , HE YUESHAN , WANG BIWU
IPC分类号： C08L79/04 , B32B15/08 , B32B15/092 , B32B27/04 , B32B27/16 , B32B27/18 , B32B27/20 , B32B27/38 , B32B27/42 , C08J5/24 , C08K5/521 , C08K5/523 , C08K5/5399 , C08K13/02 , C08L63/00 , C08L79/08 , H05K1/03
CPC分类号： C08L79/04 , B32B15/08 , B32B15/092 , B32B27/16 , B32B27/18 , B32B27/20 , B32B27/38 , B32B27/42 , B32B2264/102 , B32B2307/3065 , B32B2307/558 , B32B2457/08 , C08J5/24 , C08J2379/04 , C08J2463/00 , C08J2479/04 , C08J2479/08 , C08K3/22 , C08K3/36 , C08K5/3445 , C08K5/521 , C08K5/5399 , C08L61/06 , C08L61/34 , C08L63/00 , C08L79/085 , C08L2201/02 , C08L2201/08 , C08L2201/22 , C08L2203/20 , C08L2205/03 , H05K1/0326 , H05K1/0366 , H05K1/0373 , H05K2201/012
摘要： The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.
摘要翻译： 本发明涉及基于有机固体的重量份的无卤阻燃树脂组合物，其包含（A）1至10重量份的双马来酰亚胺树脂，（B）30至60重量份的 （C）10至40重量份的聚环氧化合物，（D）5至25重量份的含磷阻燃剂，和（E）1至25重量份的固化剂，其中 是胺固化剂和/或酚醛树脂固化剂。 本发明还提供了由所述树脂组合物制备的用于印刷电路的预浸料，层压板，层压板。
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5.发明公开WATER REPELLENT, SOIL RESISTANT, FLUORINE-FREE COMPOSITIONS 审中-公开WASSERABWEISENDE，SCHMUTZABWEISENDE，FLUORFREIE ZUSAMMENSETZUNGEN
公开(公告)号：EP3068943A4
公开(公告)日：2017-06-28
申请号：EP14861641
申请日：2014-11-12
申请人： INVISTA TECH S À R L
发明人： BAUMANN MARKUS
IPC分类号： D06M15/263 , B05D1/02 , C09D183/08 , D06M15/643
CPC分类号： D06M15/643 , B05D1/02 , C08G77/26 , C08L83/04 , C08L83/08 , C08L2201/22 , C08L2205/025 , C09D183/08 , D06M15/6436 , D06M23/04 , D06M23/06 , D06M2200/01 , D06M2200/12 , C08K5/544
摘要： The present invention pertains to a fluorine-free composition for treating textile articles being water repellant, sol resistant and stain resistant, especially carpets comprising a first composition comprising an aqueous silicone emulsion, an aqueous dispersion of a silane quaternary ammonium salt and water and a second composition comprising a soil repellency component that is an aqueous dispersion of colloidal organosiloxane copolymers.
摘要翻译： 本发明涉及一种用于处理织物制品的无氟组合物，所述织物制品是防水的，抗溶解的和防污的，特别是包含第一组合物的地毯，所述第一组合物包含水性硅氧烷乳液，硅烷季铵盐的水分散体和水， 包含作为胶体有机硅氧烷共聚物的水分散体的防污组分的组合物。
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6.发明公开HALOGEN-FREE FLAME RETARDANT TYPE RESIN COMPOSITION 审中-公开HALOGENFREIE FLAMMHEMMENDE HARZZUSAMMENSETZUNG
公开(公告)号：EP3112422A1
公开(公告)日：2017-01-04
申请号：EP15755556.6
申请日：2015-02-11
发明人： XI, Long , HE, Yueshan , WANG, Biwu
IPC分类号： C08L79/04 , C08L79/08 , C08L63/00 , C08K13/02 , C08K5/523 , C08K5/521 , C08K5/5399 , B32B27/04 , B32B15/08 , H05K1/03
CPC分类号： C08L79/04 , B32B15/08 , B32B15/092 , B32B27/16 , B32B27/18 , B32B27/20 , B32B27/38 , B32B27/42 , B32B2264/102 , B32B2307/3065 , B32B2307/558 , B32B2457/08 , C08J5/24 , C08J2379/04 , C08J2463/00 , C08J2479/04 , C08J2479/08 , C08K3/22 , C08K3/36 , C08K5/3445 , C08K5/521 , C08K5/5399 , C08L61/06 , C08L61/34 , C08L63/00 , C08L79/085 , C08L2201/02 , C08L2201/08 , C08L2201/22 , C08L2203/20 , C08L2205/03 , H05K1/0326 , H05K1/0366 , H05K1/0373 , H05K2201/012
摘要： The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.
摘要翻译： 本发明涉及一种基于有机固体重量份的无卤阻燃树脂组合物，其包含（A）1至10重量份的双马来酰亚胺树脂，（B）30至60重量份的 苯并恶嗪树脂，（C）10〜40重量份聚环氧化合物，（D）5〜25重量份含磷阻燃剂，（E）1〜25重量份固化剂， 是胺固化剂和/或酚醛树脂固化剂。 本发明还提供由所述树脂组合物制备的用于印刷电路的预浸料，层压材料，层压材料。
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公开(公告)号：EP2186860B1
公开(公告)日：2011-08-24
申请号：EP08169226.1
申请日：2008-11-17
发明人： Furusawa, Tatsuo , Furusawa, Koichi , Ishihara, Noriyuki , Hirano, Yoshihiro , Ariyoshi, Tsuneyasu , Kanadani, Teruhisa , Matsuda, Daisuke
CPC分类号： G21F1/12 , C08K3/08 , C08K3/36 , C08K5/34922 , C08L67/025 , C08L83/04 , C08L2201/22 , G21F1/10 , C08L83/00
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8.发明授权
公开(公告)号：EP3080203B1
公开(公告)日：2017-11-08
申请号：EP13823983.5
申请日：2013-12-12
发明人： ZUCCHELLI, Ugo
IPC分类号： C08L77/02 , C08L77/06 , C08K3/32 , C08K5/3492 , C08K5/5313 , C08L23/08
CPC分类号： C08L77/02 , C08K3/32 , C08K5/34924 , C08K5/5313 , C08L23/0861 , C08L77/06 , C08L2201/02 , C08L2201/22 , C08L2207/04
摘要： The present invention relates to halogen-free flame retardant compositions essentially comprising polyamide polymers (preferred is PA6), at least an Hypophosphorous acid metal salt (preferred is Aluminium hypophosphite), at least an organic phosphinate metal salt (preferred is Aluminium Di Ethyl Phosphinate), at least a Nitrogen based flame retardant agent (preferred is Melamine Cyanurate), at least an organic polyhydric polymer (preferred is EVOH) and optionally further conventional components. Such compositions are highly flame retarded at low thickness and have high Glow Wire temperature resistance.
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9.发明公开HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE USING SAME 审中-公开HALOGENFREIE EPOXIDHARZZUSAMMENSETZUNG，PREPREG UND LAMINAT DAMIT
公开(公告)号：EP3093315A4
公开(公告)日：2017-08-16
申请号：EP15871615
申请日：2015-06-01
发明人： ZENG XIANPING , HE LIEXIANG
CPC分类号： C08L63/04 , C08G59/4071 , C08G59/4215 , C08G59/4238 , C08G59/4284 , C08G59/621 , C08G59/685 , C08G59/686 , C08J5/043 , C08J5/10 , C08J5/24 , C08J2363/04 , C08J2425/08 , C08J2461/14 , C08L63/00 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/05 , H05K1/0373 , C08L61/14 , C08L61/12 , C08L61/32
摘要： Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.
摘要翻译： 本发明提供一种无卤环氧树脂组合物，半固化片以及使用该无卤环氧树脂组合物的层压体，所述无卤环氧树脂组合物包含：（A）不含卤素的环氧树脂; （B）交联剂; （C）含磷酚醛树脂，该含磷酚醛树脂通过苯酚和甲醛与二环戊二烯酚的合成而形成，并被9,10-二氢-9-氧杂-10-磷杂菲-10- 氧化物或其衍生物。由无卤环氧树脂组合物制备的预浸料坯和层压板具有高耐热性，低介电常数，低介电损耗因子和低吸水率，并且实现无卤阻燃性。
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10.发明公开HALOGEN-FREE FLAME RETARDANT POLYAMIDE MOULDING COMPOSITIONS WITH INCREASED GLOW WIRE AND FIRE RESISTANCE 有权AL IT IT E IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT
公开(公告)号：EP3080203A1
公开(公告)日：2016-10-19
申请号：EP13823983.5
申请日：2013-12-12
发明人： ZUCCHELLI, Ugo
IPC分类号： C08L77/02 , C08L77/06 , C08K3/32 , C08K5/3492 , C08K5/5313 , C08L23/08
CPC分类号： C08L77/02 , C08K3/32 , C08K5/34924 , C08K5/5313 , C08L23/0861 , C08L77/06 , C08L2201/02 , C08L2201/22 , C08L2207/04
摘要： The present invention relates to halogen-free flame retardant compositions essentially comprising polyamide polymers (preferred is PA6), at least an Hypophosphorous acid metal salt (preferred is Aluminium hypophosphite), at least an organic phosphinate metal salt (preferred is Aluminium Di Ethyl Phosphinate), at least a Nitrogen based flame retardant agent (preferred is Melamine Cyanurate), at least an organic polyhydric polymer (preferred is EVOH) and optionally further conventional components. Such compositions are highly flame retarded at low thickness and have high Glow Wire temperature resistance.
摘要翻译： 本发明涉及至少一种次磷酸金属盐（优选次磷酸铝），至少一种有机次膦酸盐金属盐（优选为二乙基铝磷酸盐）的聚酰胺聚合物（优选为PA6），无机阻燃剂组合物 ，至少一种氮基阻燃剂（优选三聚氰胺氰尿酸酯），至少一种有机多羟基聚合物（优选EVOH）和任选的其它常规组分。 这种组合物在低厚度下是高度阻燃的并且具有高辉光线耐温性。
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