摘要:
The present invention provides a method for producing an SiC single crystal, enabling obtaining an SiC single crystal substrate in which a screw dislocation-reduced region is ensured in a wide range, and an SiC single crystal substrate. The SiC single crystal substrate is produced using a seed crystal having an off angle in the off orientation from a {0001} plane by a production method wherein in advance of a growth main step of performing crystal growth to form a facet {0001} plane in the crystal peripheral part on the crystal end face having grown thereon the bulk silicon carbide single crystal and obtain more than 50% of the thickness of the obtained SiC single crystal, a growth sub-step of growing the crystal at a higher nitrogen concentration than in the growth main step and at a growth atmosphere pressure of 3.9 to 39.9 kPa and a seed crystal temperature of 2,100°C to less than 2,300°C is included.
摘要:
Provided is a silicon carbide powder which, when used as a raw material in a sublimation recrystallization method, enables an improvement in productivity of a silicon carbide single crystal by virtue of exhibiting a high sublimation rate and allowing a small amount of silicon carbide to remain without being sublimated, and enables an increase in size of the silicon carbide single crystal (for example, a single crystal wafer). The silicon carbide powder has a Blaine specific surface area of from 250 cm 2 /g to 1, 000 cm 2 /g and has a ratio of a silicon carbide powder having a particle size of more than 0.70 mm and 3.00 mm or less of 50 vol% or more with respect to a total amount of the silicon carbide powder. When a silicon carbide powder (5) accommodated in a crucible (1) is heated to be sublimated, a silicon carbide single crystal (6) is formed on a seed crystal (4) provided on an undersurface of a lid (3).
摘要:
An object is to provide a nonpolar or semipolar GaN substrate having improved size and crystal quality. A self-standing GaN substrate has an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; and when an a-axis length is measured on an intersection line between the principal surface and an A-plane, a low distortion section with a section length of 6 mm or more and with an a-axis length variation within the section of 10.0 × 10 -5 Å or less is observed.
摘要:
A method for depositing a magnesium oxide thin film on a substrate by a laser abrasion method using a sintered body or single crystal of magnesium oxide as a target. In this method, a flat processed film made of magnesium oxide having a (111) plane as its front surface is prepared, using a substrate made of strontium titanate having a (111) plane as its principal surface or yttria-stabilized zirconia having a (111) plane as its principal surface, by directly depositing a film on the principal surface of the substrate and epitaxially growing the film.
摘要:
The present invention concerns a substrate comprising a continuous or discontinuous layer of silicon and/or germanium consisting of one or a plurality of monocrystalline grains, and on said layer, one or a plurality of nanowires of which the longitudinal axis is oriented perpendicular to the surface of the substrate. The invention also concerns a method for producing such a substrate.