SEMICONDUCTOR DEVICE
    2.
    发明公开

    公开(公告)号:EP3182415A4

    公开(公告)日:2018-03-14

    申请号:EP14899852

    申请日:2014-08-14

    发明人: KASHIHARA YOJI

    摘要: A semiconductor device includes a first memory mat (1L) including a plurality of split type memory cells (250L), a second memory mat (1R) including a plurality of split type memory cells (250R), a first control gate line (CGL) connected to a control gate (CG) of a split type memory cell (100L), and a second control gate line (CGR) connected to a control gate (CG) of a split type memory cell (100R). The semiconductor device further includes a first memory gate line (MGL) connected to a memory gate (MG) of the split type memory cell (100L), and a second memory gate line (MGR) connected to a memory gate (MG) of the split type memory cell (100R).

    SEMICONDUCTOR DEVICE
    5.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:EP3182415A1

    公开(公告)日:2017-06-21

    申请号:EP14899852.9

    申请日:2014-08-14

    发明人: KASHIHARA, Yoji

    IPC分类号: G11C16/04 G11C16/02 G11C16/06

    摘要: A semiconductor device includes a first memory mat (1L) including a plurality of split type memory cells (250L), a second memory mat (1R) including a plurality of split type memory cells (250R), a first control gate line (CGL) connected to a control gate (CG) of a split type memory cell (100L), and a second control gate line (CGR) connected to a control gate (CG) of a split type memory cell (100R). The semiconductor device further includes a first memory gate line (MGL) connected to a memory gate (MG) of the split type memory cell (100L), and a second memory gate line (MGR) connected to a memory gate (MG) of the split type memory cell (100R).

    摘要翻译: 一种半导体器件包括:包括多个分离式存储器单元(250L)的第一存储器垫(1L),包括多个分离式存储器单元(250R)的第二存储器垫(1R),第一控制栅极线(CGL) 连接到分离型存储单元(100L)的控制栅极(CG),以及连接到分离型存储单元(100R)的控制栅极(CG)的第二控制栅极线(CGR)。 半导体器件还包括连接到分离式存储单元(100L)的存储器栅极(MG)的第一存储器栅极线(MGL)和连接到分离式存储器单元(100L)的存储器栅极(MG)的第二存储器栅极线 分体式存储单元(100R)。

    SEMICONDUCTOR DEVICE
    6.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:EP3035337A1

    公开(公告)日:2016-06-22

    申请号:EP13891587.1

    申请日:2013-08-15

    IPC分类号: G11C16/02 G11C16/04 G11C16/06

    摘要: A control circuit (105) controls execution of first-stage processing for increasing a threshold voltage of both or one of a first storage element (102) and a second storage element (103) until the threshold voltage of the first storage element (102) and the second storage element (103) attains to a prescribed write verify level when a request for erase of twin cell data is received. The control circuit 105 controls execution of second-stage processing for lowering a threshold voltage of the first storage element (102) and the second storage element (103) until the threshold voltage of the first storage element (102) and the second storage element (103) attains to a prescribed erase verify level after the first-stage processing is performed.

    摘要翻译: 控制电路(105)控制用于增加第一存储元件(102)和第二存储元件(103)两者或一者的阈值电压直到第一存储元件(102)的阈值电压的第一级处理的执行, 和第二存储元件(103)在接收到擦除双单元数据的请求时达到规定的写验证电平。 控制电路105控制用于降低第一存储元件(102)和第二存储元件(103)的阈值电压的第二阶段处理的执行,直到第一存储元件(102)和第二存储元件(103)的阈值电压 103)在执行第一阶段处理之后达到规定的擦除验证电平。

    ERASE FOR NON-VOLATILE STORAGE
    8.
    发明公开
    ERASE FOR NON-VOLATILE STORAGE 有权
    对消非易失性存储器

    公开(公告)号:EP2941773A1

    公开(公告)日:2015-11-11

    申请号:EP13821341.8

    申请日:2013-12-20

    摘要: Techniques are disclosed herein for erasing non-volatile storage elements. A sequence of increasing erase voltages may be applied to a substrate. The select line may be floated and many of the word lines may be held at a low voltage (e.g., close to OV). However, the voltage applied to an edge word may be increased in magnitude relative to a previous voltage applied to the edge word line for at least a portion of the sequence of erase voltages. The edge word line could be the word line that is immediately adjacent to the select line. The increasing voltage applied to the edge word line may prevent or reduce damage to oxides between the select line and edge word line. It may also help to regulate the e-field across a tunnel oxide of memory cells on the edge word line.

    Dual-mode transistor devices and methods for operating same
    10.
    发明公开
    Dual-mode transistor devices and methods for operating same 有权
    Transistorvorrichtungen mit Zweifachmodus und Verfahren zu seinem Betrieb

    公开(公告)号:EP2811527A2

    公开(公告)日:2014-12-10

    申请号:EP14153020.4

    申请日:2014-01-29

    IPC分类号: H01L29/739 H01L29/423

    摘要: A dual-mode transistor structure comprises a semiconductor body. The semiconductor body of the device includes a channel region, a p-type terminal region (operable as a source or drain) adjacent a first side of the channel region and an n-type terminal region (operable as a source or drain) adjacent a second side of the channel region. A gate insulator is disposed on a surface of the semiconductor body over the channel region. A gate is disposed on the gate insulator over the channel region. A first assist gate is disposed on a first side of the gate, and a second assist gate is disposed on a second side of the gate. Optionally, a back gate can be included beneath the channel region. Biasing the assist gates can be used to select n-channel or p-channel modes in a single device.

    摘要翻译: 双模式晶体管结构包括半导体本体。 器件的半导体本体包括与沟道区的第一侧相邻的沟道区,p型端子区(可作为源极或漏极),以及邻近沟道区的n型端子区域(可用作源极或漏极) 通道区域的第二侧。 栅极绝缘体设置在沟道区域上的半导体本体的表面上。 栅极设置在沟道区域上的栅极绝缘体上。 第一辅助栅极设置在栅极的第一侧上,第二辅助栅极设置在栅极的第二侧上。 可选地,可以在通道区域下方包括背栅。 可以使用偏置辅助门来在单个设备中选择n通道或p通道模式。