摘要:
A semiconductor device includes a first memory mat (1L) including a plurality of split type memory cells (250L), a second memory mat (1R) including a plurality of split type memory cells (250R), a first control gate line (CGL) connected to a control gate (CG) of a split type memory cell (100L), and a second control gate line (CGR) connected to a control gate (CG) of a split type memory cell (100R). The semiconductor device further includes a first memory gate line (MGL) connected to a memory gate (MG) of the split type memory cell (100L), and a second memory gate line (MGR) connected to a memory gate (MG) of the split type memory cell (100R).
摘要:
A non-volatile memory system utilizes partial block erasing during program operations to mitigate the effects of programming pass voltage disturbances. A programming request is received that is associated with a group of word lines from a block, such as all or a portion of the word lines. The system erases and soft programs the block prior to beginning programming. The system programs a subset of the word lines of the block for the programming request. After programming the subset of word lines, the system pauses the programming operation and performs an erase operation for the unprogrammed word lines of the block. The already programmed word lines and one or more optional buffer word lines may be inhibited from erasing during the erase operation. After erasing the unprogrammed word lines, the system completes the programming request by programming the remaining user data in the unprogrammed region of the block.
摘要:
A memory array (10) includes a plurality of memory pages (MP1 to MPM), each memory page (MP1 to MPM) includes a plurality of memory cells (100 1,1 to 100 M,N ), and each memory cell (100 1,1 to 100 M,N ) includes a floating gate module (110) including a floating gate transistor (112), a control transistor (120), and an erase transistor (130). The floating gate module (110) is disposed in a first well, the erase transistor (130) is disposed in a second well, and the control transistor (120) is disposed in a third well. The first well, the second well and the third well are disposed in a deep doped region, and memory cells (100 1,1 to 100 M,N ) of the plurality of memory pages (MP1 to MPM) are all disposed in the deep doped region. Therefore, the spacing rule between deep doped regions will not limit the circuit area of the memory array (10) and the circuit area can be reduced.
摘要:
A semiconductor device includes a first memory mat (1L) including a plurality of split type memory cells (250L), a second memory mat (1R) including a plurality of split type memory cells (250R), a first control gate line (CGL) connected to a control gate (CG) of a split type memory cell (100L), and a second control gate line (CGR) connected to a control gate (CG) of a split type memory cell (100R). The semiconductor device further includes a first memory gate line (MGL) connected to a memory gate (MG) of the split type memory cell (100L), and a second memory gate line (MGR) connected to a memory gate (MG) of the split type memory cell (100R).
摘要:
A control circuit (105) controls execution of first-stage processing for increasing a threshold voltage of both or one of a first storage element (102) and a second storage element (103) until the threshold voltage of the first storage element (102) and the second storage element (103) attains to a prescribed write verify level when a request for erase of twin cell data is received. The control circuit 105 controls execution of second-stage processing for lowering a threshold voltage of the first storage element (102) and the second storage element (103) until the threshold voltage of the first storage element (102) and the second storage element (103) attains to a prescribed erase verify level after the first-stage processing is performed.
摘要:
Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.
摘要:
Techniques are disclosed herein for erasing non-volatile storage elements. A sequence of increasing erase voltages may be applied to a substrate. The select line may be floated and many of the word lines may be held at a low voltage (e.g., close to OV). However, the voltage applied to an edge word may be increased in magnitude relative to a previous voltage applied to the edge word line for at least a portion of the sequence of erase voltages. The edge word line could be the word line that is immediately adjacent to the select line. The increasing voltage applied to the edge word line may prevent or reduce damage to oxides between the select line and edge word line. It may also help to regulate the e-field across a tunnel oxide of memory cells on the edge word line.
摘要:
Some embodiments include a memory device and methods of forming the memory device. One such memory device includes a first group of memory cells, each of the memory cells of the first group being formed in a cavity of a first control gate located in one device level of the memory device. The memory device also includes a second group of memory cells, each of the memory cells of the second group being formed in a cavity of a second control gate located in another device level of the memory device. Additional apparatus and methods are described.
摘要:
A dual-mode transistor structure comprises a semiconductor body. The semiconductor body of the device includes a channel region, a p-type terminal region (operable as a source or drain) adjacent a first side of the channel region and an n-type terminal region (operable as a source or drain) adjacent a second side of the channel region. A gate insulator is disposed on a surface of the semiconductor body over the channel region. A gate is disposed on the gate insulator over the channel region. A first assist gate is disposed on a first side of the gate, and a second assist gate is disposed on a second side of the gate. Optionally, a back gate can be included beneath the channel region. Biasing the assist gates can be used to select n-channel or p-channel modes in a single device.