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公开(公告)号：EP2945189A4
公开(公告)日：2016-11-16
申请号：EP13870456
申请日：2013-01-09
申请人： HITACHI LTD
发明人： TANIE HISASHI , IKEDA OSAMU
IPC分类号： H01L23/488 , H01L21/60 , H01L23/367
CPC分类号： H01L24/09 , H01L21/563 , H01L21/78 , H01L23/5382 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L24/94 , H01L2224/033 , H01L2224/0345 , H01L2224/0346 , H01L2224/0383 , H01L2224/0401 , H01L2224/04026 , H01L2224/05655 , H01L2224/06181 , H01L2224/0901 , H01L2224/0905 , H01L2224/091 , H01L2224/095 , H01L2224/1145 , H01L2224/13012 , H01L2224/13016 , H01L2224/13147 , H01L2224/13155 , H01L2224/1411 , H01L2224/14181 , H01L2224/17107 , H01L2224/2745 , H01L2224/29078 , H01L2224/2908 , H01L2224/29082 , H01L2224/29083 , H01L2224/291 , H01L2224/29111 , H01L2224/29118 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/30181 , H01L2224/32245 , H01L2224/32501 , H01L2224/33181 , H01L2224/73103 , H01L2224/73204 , H01L2224/75301 , H01L2224/75755 , H01L2224/75756 , H01L2224/83121 , H01L2224/83203 , H01L2224/83447 , H01L2224/83815 , H01L2224/94 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2224/11 , H01L2224/27 , H01L2924/00
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公开(公告)号：EP2945189A1
公开(公告)日：2015-11-18
申请号：EP13870456.4
申请日：2013-01-09
申请人： Hitachi, Ltd.
发明人： TANIE, Hisashi , IKEDA, Osamu
CPC分类号： H01L24/09 , H01L21/563 , H01L21/78 , H01L23/5382 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L24/94 , H01L2224/033 , H01L2224/0345 , H01L2224/0346 , H01L2224/0383 , H01L2224/0401 , H01L2224/04026 , H01L2224/05655 , H01L2224/06181 , H01L2224/0901 , H01L2224/0905 , H01L2224/091 , H01L2224/095 , H01L2224/1145 , H01L2224/13012 , H01L2224/13016 , H01L2224/13147 , H01L2224/13155 , H01L2224/1411 , H01L2224/14181 , H01L2224/17107 , H01L2224/2745 , H01L2224/29078 , H01L2224/2908 , H01L2224/29082 , H01L2224/29083 , H01L2224/291 , H01L2224/29111 , H01L2224/29118 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/30181 , H01L2224/32245 , H01L2224/32501 , H01L2224/33181 , H01L2224/73103 , H01L2224/73204 , H01L2224/75301 , H01L2224/75755 , H01L2224/75756 , H01L2224/83121 , H01L2224/83203 , H01L2224/83447 , H01L2224/83815 , H01L2224/94 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2224/11 , H01L2224/27 , H01L2924/00
摘要： In order to achieve both a reduction in thermal resistance and an improvement in thermal deformation absorbing property of a semiconductor device having a packaging structure in which a semiconductor chip 1 is electrically connected to conductive members 3a and 3b via bonding members 2a and 2b, the bonding members 2a and 2b each includes a stacked structure provided with, in the order from the side close to the semiconductor chip 1, a nanospring layer 4 configured from a plurality of springs having a nano-order size, a planar layer 5 supporting the plurality of springs, and a bonding layer 6. The thickness of the nanospring layer 4 is larger than the thickness of the bonding layer 6, and the thickness of the bonding layer 6 is larger than the thickness of the planar layer 5.
摘要翻译： 为了同时实现具有半导体芯片1经由接合构件2a和2b与导电构件3a和3b电连接的封装结构的半导体器件的热阻降低和热变形吸收性能的提高， 构件2a和2b各自包括从靠近半导体芯片1的一侧开始依次设置由多个具有纳米级尺寸的弹簧构成的纳米弹簧层4的层叠结构，支撑多个 弹簧和粘合层6.纳米弹簧层4的厚度大于粘合层6的厚度，并且粘合层6的厚度大于平面层5的厚度。
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公开(公告)号：EP2506295A3
公开(公告)日：2015-07-01
申请号：EP11250676.1
申请日：2011-07-27
CPC分类号： H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75102 , H01L2224/75252 , H01L2224/753 , H01L2224/75313 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/755 , H01L2224/75502 , H01L2224/75704 , H01L2224/75755 , H01L2224/75756 , H01L2224/75804 , H01L2224/7598 , H01L2224/75984 , H01L2224/81048 , H01L2224/8109 , H01L2224/81093 , H01L2224/83048 , H01L2224/8309 , H01L2224/83093 , H01L2224/83855 , H01L2224/9211 , H01L2224/95093 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/15787 , H01L2924/00
摘要： The bonding apparatus comprises: a substrate supporting section (5) for supporting a substrate (1), on which semiconductor devices (3) have been adhered, in a state where the substrate (1) is separated from a clamping face (6a, 17a) of a second die (6, 17); and a heating/pressing section (10, 28) for heating and pressing the substrate (1) supported by the substrate supporting section (5) onto a clamping face (10a, 28b) of a first die (8, 24). The heating/pressing section (10, 28) moves the substrate (1) toward the clamping face (10a, 28b) of the first die (8, 24) so as to preheat the substrate (1) and the semiconductor devices (3). The semiconductor devices (3) are pressed onto the clamping face (10a, 28b) so as to cure the non-conductive adhesive (2) and bond the bumps (3a) of the semiconductor devices (3) to terminal sections (1a) of the substrate (1).
摘要翻译： 接合装置包括：基板支撑部（5），用于在基板（1）与夹紧面（6a，17a）分离的状态下支撑已经粘附有半导体器件（3）的基板（1） ）第二模具（6,17）; 以及用于将由基板支撑部分（5）支撑的基板（1）加热并按压到第一模具（8,24）的夹紧面（10a，28b）上的加热/加压部分（10,28）。 加热/加压部分（10,28）将基板（1）朝向第一模具（8,24）的夹紧面（10a，28b）移动，以便预热基板（1）和半导体器件（3） 。 半导体器件（3）被压到夹持面（10a，28b）上，以固化非导电粘合剂（2）并将半导体器件（3）的凸块（3a）接合到半导体器件（3）的端子部分 基板（1）。
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公开(公告)号：EP2506295A2
公开(公告)日：2012-10-03
申请号：EP11250676.1
申请日：2011-07-27
IPC分类号： H01L21/67
CPC分类号： H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75102 , H01L2224/75252 , H01L2224/753 , H01L2224/75313 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/755 , H01L2224/75502 , H01L2224/75704 , H01L2224/75755 , H01L2224/75756 , H01L2224/75804 , H01L2224/7598 , H01L2224/75984 , H01L2224/81048 , H01L2224/8109 , H01L2224/81093 , H01L2224/83048 , H01L2224/8309 , H01L2224/83093 , H01L2224/83855 , H01L2224/9211 , H01L2224/95093 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/15787 , H01L2924/00
摘要： The bonding apparatus comprises: a substrate supporting section (5) for supporting a substrate (1), on which semiconductor devices (3) have been adhered, in a state where the substrate (1) is separated from a clamping face (6a, 17a) of a second die (6, 17); and a heating/pressing section (10, 28) for heating and pressing the substrate (1) supported by the substrate supporting section (5) onto a clamping face (10a, 28b) of a first die (8, 24). The heating/pressing section (10, 28) moves the substrate (1) toward the clamping face (10a, 28b) of the first die (8, 24) so as to preheat the substrate (1) and the semiconductor devices (3). The semiconductor devices (3) are pressed onto the clamping face (10a, 28b) so as to cure the non-conductive adhesive (2) and bond the bumps (3a) of the semiconductor devices (3) to terminal sections (1a) of the substrate (1).
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公开(公告)号：EP1975994A4
公开(公告)日：2010-02-17
申请号：EP07706649
申请日：2007-01-12
发明人： MATSUMURA TAKASHI
CPC分类号： H05K3/303 , B30B5/02 , B30B15/024 , H01L21/568 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/753 , H01L2224/75314 , H01L2224/75315 , H01L2224/75317 , H01L2224/75754 , H01L2224/75755 , H01L2224/7598 , H01L2224/81005 , H01L2224/83101 , H01L2224/838 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/19105 , H05K2201/0133 , H05K2203/0191 , H05K2203/0278 , Y02P70/613 , Y10T156/16 , H01L2924/00 , H01L2224/0401
摘要： A compression bonding device 1 of the present invention has a dam member 24 so that when a pressing head 20 is pressed against an object to be pressed 10, the bonding part 22 is surrounded by the dam member 24. Thus, even if the surface of the bonding part 22 bulges by pressing, the bulging part is stopped by the dam member 24 and the surface of the bonding part 22 does not horizontally extend. As a result of the absence of horizontal extension of the bonding part 22, electric components 16, 18 of the object to be pressed 10 are not subjected to a force that horizontally moves them and the electric components 16, 18 are vertically pressed downward and connected to the terminals 12 of the substrate 11. Thus, an electric device 10a having high connection reliability is obtained.
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公开(公告)号：EP1511075A3
公开(公告)日：2008-06-04
申请号：EP04020299.6
申请日：2004-08-26
发明人： Osanai, Hideyo
IPC分类号： H01L21/48 , H01L21/60 , H01L23/373 , H01L21/58
CPC分类号： H01L23/3735 , H01L21/4871 , H01L24/45 , H01L24/48 , H01L24/75 , H01L24/83 , H01L25/072 , H01L2224/08225 , H01L2224/32238 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/75755 , H01L2224/75756 , H01L2224/7598 , H01L2224/83104 , H01L2224/83801 , H01L2224/83886 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10272 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K1/0306 , H05K1/053 , H05K3/101 , H05K2203/128 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2224/83205
摘要： In a method for producing an electronic part mounting substrate wherein a heat sinking metal base plate 12 is bonded to one side of a ceramic substrate 10, and one side of a circuit forming metal plate 14 is bonded to the other side thereof, an electronic part 16 being mounted on the other side of the circuit forming metal plate 14, the ceramic substrate 10 and the electronic part 16 are arranged in a mold so that the ceramic substrate 10 is spaced from the electronic part 16, and then, a molten metal is injected into the mold so that the molten metal contacts both sides of the ceramic substrate 10 and the electronic part 16. Then, the mold is cooled to solidify the molten metal, to form a heat sinking metal base plate on one side of the ceramic substrate 10 so that the heat sinking metal base plate is bonded directly to the one side of the ceramic substrate 10, and to form a circuit forming metal plate on the other side of the ceramic substrate 10 so that one side of the circuit forming metal plate is bonded directly to the other side of the ceramic substrate 10. When the circuit forming metal plate is formed, the electronic part is bonded directly to the other side of the circuit forming metal plate.
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公开(公告)号：EP1511075B1
公开(公告)日：2018-10-10
申请号：EP04020299.6
申请日：2004-08-26
发明人： Osanai, Hideyo
IPC分类号： H01L25/07 , H01L21/48 , H01L23/373 , H01L21/60
CPC分类号： H01L23/3735 , H01L21/4871 , H01L24/45 , H01L24/48 , H01L24/75 , H01L24/83 , H01L25/072 , H01L2224/08225 , H01L2224/32238 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/75755 , H01L2224/75756 , H01L2224/7598 , H01L2224/83104 , H01L2224/83801 , H01L2224/83886 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10272 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K1/0306 , H05K1/053 , H05K3/101 , H05K2203/128 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2224/83205
摘要： In a method for producing an electronic part mounting substrate wherein a heat sinking metal base plate 12 is bonded to one side of a ceramic substrate 10, and one side of a circuit forming metal plate 14 is bonded to the other side thereof, an electronic part 16 being mounted on the other side of the circuit forming metal plate 14, the ceramic substrate 10 and the electronic part 16 are arranged in a mold so that the ceramic substrate 10 is spaced from the electronic part 16, and then, a molten metal is injected into the mold so that the molten metal contacts both sides of the ceramic substrate 10 and the electronic part 16. Then, the mold is cooled to solidify the molten metal, to form a heat sinking metal base plate on one side of the ceramic substrate 10 so that the heat sinking metal base plate is bonded directly to the one side of the ceramic substrate 10, and to form a circuit forming metal plate on the other side of the ceramic substrate 10 so that one side of the circuit forming metal plate is bonded directly to the other side of the ceramic substrate 10. When the circuit forming metal plate is formed, the electronic part is bonded directly to the other side of the circuit forming metal plate.
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8.发明公开
公开(公告)号：EP1975994A1
公开(公告)日：2008-10-01
申请号：EP07706649.6
申请日：2007-01-12
发明人： MATSUMURA, Takashi
CPC分类号： H05K3/303 , B30B5/02 , B30B15/024 , H01L21/568 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/753 , H01L2224/75314 , H01L2224/75315 , H01L2224/75317 , H01L2224/75754 , H01L2224/75755 , H01L2224/7598 , H01L2224/81005 , H01L2224/83101 , H01L2224/838 , H01L2224/83907 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/19105 , H05K2201/0133 , H05K2203/0191 , H05K2203/0278 , Y02P70/613 , Y10T156/16 , H01L2924/00 , H01L2224/0401
摘要： A compression bonding device 1 of the present invention has a dam member 24 so that when a pressing head 20 is pressed against an object to be pressed 10, the bonding part 22 is surrounded by the dam member 24. Thus, even if the surface of the bonding part 22 bulges by pressing, the bulging part is stopped by the dam member 24 and the surface of the bonding part 22 does not horizontally extend. As a result of the absence of horizontal extension of the bonding part 22, electric components 16, 18 of the object to be pressed 10 are not subjected to a force that horizontally moves them and the electric components 16, 18 are vertically pressed downward and connected to the terminals 12 of the substrate 11. Thus, an electric device 10a having high connection reliability is obtained.
摘要翻译： 本发明的压接装置1具有阻挡构件24，使得当按压头20被压靠在待挤压物体10上时，接合部22被阻挡构件24包围。因此，即使 接合部22通过按压而膨胀，凸出部被阻挡构件24阻止，接合部22的表面不水平延伸。 作为接合部22的水平延伸的结果，待按压物体10的电气部件16,18不受到水平移动的力，电气部件16,18被垂直向下压下并连接 到达基板11的端子12.因此，获得具有高连接可靠性的电气设备10a。
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公开(公告)号：EP1511075A2
公开(公告)日：2005-03-02
申请号：EP04020299.6
申请日：2004-08-26
发明人： Osanai, Hideyo
IPC分类号： H01L21/48
CPC分类号： H01L23/3735 , H01L21/4871 , H01L24/45 , H01L24/48 , H01L24/75 , H01L24/83 , H01L25/072 , H01L2224/08225 , H01L2224/32238 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/75755 , H01L2224/75756 , H01L2224/7598 , H01L2224/83104 , H01L2224/83801 , H01L2224/83886 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10272 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K1/0306 , H05K1/053 , H05K3/101 , H05K2203/128 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2224/83205
摘要： In a method for producing an electronic part mounting substrate wherein a heat sinking metal base plate 12 is bonded to one side of a ceramic substrate 10, and one side of a circuit forming metal plate 14 is bonded to the other side thereof, an electronic part 16 being mounted on the other side of the circuit forming metal plate 14, the ceramic substrate 10 and the electronic part 16 are arranged in a mold so that the ceramic substrate 10 is spaced from the electronic part 16, and then, a molten metal is injected into the mold so that the molten metal contacts both sides of the ceramic substrate 10 and the electronic part 16. Then, the mold is cooled to solidify the molten metal, to form a heat sinking metal base plate on one side of the ceramic substrate 10 so that the heat sinking metal base plate is bonded directly to the one side of the ceramic substrate 10, and to form a circuit forming metal plate on the other side of the ceramic substrate 10 so that one side of the circuit forming metal plate is bonded directly to the other side of the ceramic substrate 10. When the circuit forming metal plate is formed, the electronic part is bonded directly to the other side of the circuit forming metal plate.
摘要翻译： 在制造电子部件安装基板的方法中，散热金属基板12接合在陶瓷基板10的一侧，电路形成用金属板14的一侧与其另一侧接合，电子部件 16安装在电路形成金属板14的另一侧上，陶瓷基板10和电子部件16布置在模具中，使得陶瓷基板10与电子部件16间隔开，然后熔融金属 注入到模具中，使得熔融金属接触陶瓷基板10和电子部件16的两侧。然后，将模具冷却以固化熔融金属，以在陶瓷基板的一侧上形成散热金属基板 10，使得散热金属基板直接接合到陶瓷基板10的一侧，并且在陶瓷基板10的另一侧上形成电路形成金属板，使得电路的一侧 金属板直接接合到陶瓷基板10的另一侧。当形成电路形成金属板时，电子部件直接接合到电路形成金属板的另一侧。
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