公开(公告)号：EP2506295A3

公开(公告)日：2015-07-01

申请号：EP11250676.1

申请日：2011-07-27

申请人： Apic Yamada Corporation

发明人： Kobayashi, Kazuhiko, Apic Yamada Corporation

IPC分类号： H01L21/67 ,  H01L21/60

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/75704 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2224/81048 ,  H01L2224/8109 ,  H01L2224/81093 ,  H01L2224/83048 ,  H01L2224/8309 ,  H01L2224/83093 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/95093 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00

摘要： The bonding apparatus comprises: a substrate supporting section (5) for supporting a substrate (1), on which semiconductor devices (3) have been adhered, in a state where the substrate (1) is separated from a clamping face (6a, 17a) of a second die (6, 17); and a heating/pressing section (10, 28) for heating and pressing the substrate (1) supported by the substrate supporting section (5) onto a clamping face (10a, 28b) of a first die (8, 24). The heating/pressing section (10, 28) moves the substrate (1) toward the clamping face (10a, 28b) of the first die (8, 24) so as to preheat the substrate (1) and the semiconductor devices (3). The semiconductor devices (3) are pressed onto the clamping face (10a, 28b) so as to cure the non-conductive adhesive (2) and bond the bumps (3a) of the semiconductor devices (3) to terminal sections (1a) of the substrate (1).

摘要翻译： 接合装置包括：基板支撑部（5），用于在基板（1）与夹紧面（6a，17a）分离的状态下支撑已经粘附有半导体器件（3）的基板（1） ）第二模具（6,17）; 以及用于将由基板支撑部分（5）支撑的基板（1）加热并按压到第一模具（8,24）的夹紧面（10a，28b）上的加热/加压部分（10,28）。 加热/加压部分（10,28）将基板（1）朝向第一模具（8,24）的夹紧面（10a，28b）移动，以便预热基板（1）和半导体器件（3） 。 半导体器件（3）被压到夹持面（10a，28b）上，以固化非导电粘合剂（2）并将半导体器件（3）的凸块（3a）接合到半导体器件（3）的端子部分 基板（1）。

公开(公告)号：EP1434261B1

公开(公告)日：2010-03-31

申请号：EP02765504.2

申请日：2002-09-12

申请人： NIKKISO CO., LTD.

发明人： MATSUNO, Hisao, c/o NIKKISO CO., LTD. ,  OSUGI, Kenjiro, c/o NIKKISO CO., LTD.

IPC分类号： H01L21/60 ,  H05K3/32

CPC分类号： B30B15/024 ,  B30B5/02 ,  B30B15/065 ,  H01L24/29 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2203/0278 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/0401

摘要： An anisotropic conductive film (14) and circuit devices (16) are superimposedly overlaid on a substrate (10). The circuit devices are pressed isostatically by a press die having a soft layer (22) on the surface to be brought into contact with the circuit devices and heated simultaneously to compression-bond the circuit devices to the substrate. Since the soft layer absorbs the differences in the thickness of the circuit devices, the circuit device can be pressed simultaneously. Furhter, since the circuit devices are heated simultaneously, it is unnecessary to consider the influence of the heat on the unheated adjacent circuit devices. The isotropic conductive film does not overlap sideways because of the isostatic press. As a result, the spaces between the circuit devices can be small.

公开(公告)号：EP1993132B1

公开(公告)日：2018-07-11

申请号：EP08008713.3

申请日：2008-05-09

申请人： SEMIKRON Elektronik GmbH & Co. KG

发明人： Göbl, Christian ,  Braml, Heiko, Dr.

IPC分类号： H01L23/498 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H01L25/07 ,  H05K3/06 ,  H05K1/03 ,  H05K3/12 ,  H05K3/24 ,  C04B37/02 ,  C04B35/645

CPC分类号： H01L21/4867 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/05644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/75317 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/1283 ,  H05K3/247 ,  H05K2201/0133 ,  H05K2201/035 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

公开(公告)号：EP2826064B1

公开(公告)日：2015-10-21

申请号：EP12715611.5

申请日：2012-03-16

申请人： Ev Group E. Thallner GmbH

发明人： WIMPLINGER, Markus ,  SIGL, Alfred

IPC分类号： H01L21/67

CPC分类号： H01L21/67144 ,  H01L21/68771 ,  H01L21/68778 ,  H01L24/75 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75316 ,  H01L2224/75317 ,  H01L2224/75318 ,  H01L2224/7532 ,  H01L2224/757 ,  H01L2224/75704 ,  H01L2224/75724 ,  H01L2224/75744 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/9205 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/351 ,  H01L2924/00

公开(公告)号：EP2843692A1

公开(公告)日：2015-03-04

申请号：EP13782144.3

申请日：2013-04-24

申请人： Nissan Motor Co., Ltd

发明人： TANIMOTO, Satoshi ,  ZUSHI, Yusuke ,  MURAKAMI, Yoshinori ,  MATSUI, Kohei ,  SATO, Shinji ,  FUKUSHIMA, Yu

IPC分类号： H01L21/52 ,  H05K13/04

CPC分类号： H01L24/83 ,  B23K37/0426 ,  H01L24/05 ,  H01L24/29 ,  H01L24/75 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29118 ,  H01L2224/29144 ,  H01L2224/75101 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/75981 ,  H01L2224/83022 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83101 ,  H01L2224/832 ,  H01L2224/83211 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1037 ,  H01L2924/1067 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/3656 ,  H05K3/34 ,  H05K3/3431 ,  H05K13/0465 ,  H05K2203/0195 ,  H05K2203/0278 ,  H01L2924/00 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2924/01042 ,  H01L2924/01032 ,  H01L2924/01014 ,  H01L2924/01013 ,  H01L2224/05655 ,  H01L2224/83 ,  H01L2924/00012

摘要： In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100°C below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.

摘要翻译： 在本发明中，具有在半导体芯片13的热电阻温度和温度100℃以下的热电阻温度之间的范围内的熔点或固相线温度的焊料材料14的热绝缘负荷夹具11夹 一电路板12和半导体芯片13之间; 隔热体17在这种状态下，半导体芯片13的上侧被置于; 金属重物16设置在绝热体17; 并且在焊接材料14被熔融固化负载被施加到半导体芯片13。

公开(公告)号：EP1983564A4

公开(公告)日：2012-07-04

申请号：EP07713933

申请日：2007-02-08

申请人： SONY CHEM & INF DEVICE CORP

发明人： MATSUMURA TAKASHI

IPC分类号： B30B15/02 ,  B30B5/02 ,  B30B15/06 ,  H01L21/603 ,  H05K3/30

CPC分类号： H05K3/303 ,  B30B5/02 ,  B30B15/024 ,  B30B15/065 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32157 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/753 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/8323 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/8388 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/0401

摘要： A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device 1 includes first and second pressing rubbers 15, 25. Electric components 32, 33 can be simultaneously packaged on the front face and the rear face of a substrate 31 by sandwiching the substrate 31 between the first and second pressing rubbers 15, 25. The electric components 32, 33 are not subjected to a force for horizontally moving them because the first and second pressing rubbers 15, 25 are prevented from horizontal extension by a first dam member 16. Thus, the electric components 32, 33 are connected to the substrate 31 without misalignment, thereby obtaining a highly reliable electric device 30a.

公开(公告)号：EP2626894B1

公开(公告)日：2017-07-26

申请号：EP11830472.4

申请日：2011-09-12

申请人： Dexerials Corporation

发明人： ISHIGAMI Akira ,  KANISAWA Shiyuki ,  NAMIKI Hidetsugu ,  UMAKOSHI Hideaki ,  AOKI Masaharu

IPC分类号： H01L21/60 ,  H01L25/075 ,  B32B27/00 ,  H01L23/00 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  H01L33/62 ,  H01L33/60

CPC分类号： H01L24/29 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/304 ,  B32B27/32 ,  B32B27/36 ,  B32B2307/306 ,  B32B2307/416 ,  B32B2307/536 ,  B32B2457/00 ,  C08L27/06 ,  C08L67/00 ,  C08L79/08 ,  C08L83/04 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/7598 ,  H01L2224/75985 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/9211 ,  H01L2224/92143 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T156/10 ,  Y10T428/24967 ,  Y10T428/31544 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

公开(公告)号：EP1796137B1

公开(公告)日：2015-01-07

申请号：EP06023023.2

申请日：2006-11-06

申请人： Semikron Elektronik GmbH & Co. KG Patentabteilung

发明人： Göbl, Christian

IPC分类号： H01L23/00 ,  H01L21/683 ,  H01L25/00 ,  H05K1/09 ,  H05K3/10 ,  H05K3/32

CPC分类号： H01L24/75 ,  H01L21/6835 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2221/6834 ,  H01L2224/32225 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/83048 ,  H01L2224/83209 ,  H01L2224/8384 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/15787 ,  H05K1/092 ,  H05K3/102 ,  H05K3/321 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1131 ,  Y10T29/5313 ,  Y10T29/53187 ,  Y10T156/1089 ,  H01L2924/00

公开(公告)号：EP2506295A2

公开(公告)日：2012-10-03

申请号：EP11250676.1

申请日：2011-07-27

申请人： Apic Yamada Corporation

发明人： Kobayashi, Kazuhiko, Apic Yamada Corporation

IPC分类号： H01L21/67

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/75704 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2224/81048 ,  H01L2224/8109 ,  H01L2224/81093 ,  H01L2224/83048 ,  H01L2224/8309 ,  H01L2224/83093 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/95093 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00

摘要： The bonding apparatus comprises: a substrate supporting section (5) for supporting a substrate (1), on which semiconductor devices (3) have been adhered, in a state where the substrate (1) is separated from a clamping face (6a, 17a) of a second die (6, 17); and a heating/pressing section (10, 28) for heating and pressing the substrate (1) supported by the substrate supporting section (5) onto a clamping face (10a, 28b) of a first die (8, 24). The heating/pressing section (10, 28) moves the substrate (1) toward the clamping face (10a, 28b) of the first die (8, 24) so as to preheat the substrate (1) and the semiconductor devices (3). The semiconductor devices (3) are pressed onto the clamping face (10a, 28b) so as to cure the non-conductive adhesive (2) and bond the bumps (3a) of the semiconductor devices (3) to terminal sections (1a) of the substrate (1).

公开(公告)号：EP1975994A4

公开(公告)日：2010-02-17

申请号：EP07706649

申请日：2007-01-12

申请人： SONY CHEM & INF DEVICE CORP

发明人： MATSUMURA TAKASHI

IPC分类号： H01L21/60 ,  H05K3/32

CPC分类号： H05K3/303 ,  B30B5/02 ,  B30B15/024 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/753 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75754 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/19105 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/0278 ,  Y02P70/613 ,  Y10T156/16 ,  H01L2924/00 ,  H01L2224/0401

摘要： A compression bonding device 1 of the present invention has a dam member 24 so that when a pressing head 20 is pressed against an object to be pressed 10, the bonding part 22 is surrounded by the dam member 24. Thus, even if the surface of the bonding part 22 bulges by pressing, the bulging part is stopped by the dam member 24 and the surface of the bonding part 22 does not horizontally extend. As a result of the absence of horizontal extension of the bonding part 22, electric components 16, 18 of the object to be pressed 10 are not subjected to a force that horizontally moves them and the electric components 16, 18 are vertically pressed downward and connected to the terminals 12 of the substrate 11. Thus, an electric device 10a having high connection reliability is obtained.