公开(公告)号：EP2769412A1

公开(公告)日：2014-08-27

申请号：EP12788344.5

申请日：2012-10-17

申请人： Invensas Corporation

发明人： CASKEY, Terrence ,  MOHAMMED, Ilyas

IPC分类号： H01L25/10 ,  H01L21/56 ,  H01L21/60

CPC分类号： H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06155 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/852 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1076 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

摘要： A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metallized vias and traces formed in contact with the second chip contacts.

摘要翻译： 一种微电子封装可包括第一微电子单元包括具有第一芯片触点的半导体芯片，封装剂在所述半导体芯片的边缘接触，以及第一单元在接触所述密封剂的表面露出，并与第一芯片触点电连接。 该包装可包括第二微电子单元包括具有在其表面处的第二芯片触点的半导体芯片，和密封剂的接触在所述第二单元的所述芯片的边缘，并具有一个表面延伸远离边缘。 所述芯片和所述第二单元的密封剂的表面限定的面中的第二单元。 在面部封装端子可以是具有通过与第一单元触点电连接的键合引线的第一部接触，并通过与第二芯片触点接触而形成金属化通孔和迹线的第二芯片触点电连接。

公开(公告)号：EP3232466A1

公开(公告)日：2017-10-18

申请号：EP17166512.8

申请日：2017-04-13

申请人： Semiconductor Manufacturing International Corporation (Shanghai) ,  Semiconductor Manufacturing International Corporation (Beijing)

发明人： LIU, Qi

IPC分类号： H01L21/68

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K20/26 ,  B23K2201/40 ,  B23K2201/42 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48227 ,  H01L2224/78251 ,  H01L2224/78621 ,  H01L2224/78701 ,  H01L2224/78704 ,  H01L2224/78804 ,  H01L2224/85181 ,  H01L2224/852

摘要： A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.

摘要翻译： 提供了一种夹紧系统，引线接合机和接合线的方法。 示例性夹紧系统包括夹紧装置。 夹紧装置包括：至少一个线性导轨; 垂直于线性导轨布置的第一夹紧杆; 以及垂直于线性导轨并平行于第一夹紧杆布置的第二夹紧杆。