Abstract:
The present disclosure relates to a solid-state image pickup device and an electronic apparatus that are capable of preventing leakage of charges between adjacent pixels. A plurality of pixels perform photoelectric conversion on light incident from a back surface via different on-chip lenses for each pixel. A pixel separation wall is formed between pixels adjacent to each other, and includes a front-side trench formed from a front surface and a backside trench formed from the back surface. A wiring layer is provided on the front surface. The present disclosure is applicable to, for example, a backside illuminated CMOS image sensor.
Abstract:
In a related image sensor, here is a problem that the SN ratio of the image signal becomes unstable. According to one exemplary embodiment, an image sensor includes a first chip A and a second chip B configured to transmit and receive signals to and from the first chip through a micro-bump, the first chip being stacked on top of the second chip, wherein on the first chip, pixel circuits 31 - 3n are arranged in a lattice structure, each of the pixel circuits including a photoelectric conversion element 41, a transfer transistor 42, a reset transistor 43, and an amplification transistor 44, and on the second chip, at least an input stage circuit COMP of an analog-to-digital converter circuit configured to convert a dark level signal and an imaging signal output from the pixel circuits 31 - 3n into a digital value is formed, and the number of input stage circuits COMP is at least two times the number of lines of the pixel circuits.
Abstract:
A CMOS compatible photodiode device comprises a substrate (1) of semiconductor material with a main surface (10) and a plurality of doped wells (3) of a first type of conductivity constituting one pixel of an array of pixels for image detection. The doped wells (3) are spaced apart at the main surface (10). The device further has a guard ring (7) comprising a doped region of a second type of conductivity, which is opposite to the first type of conductivity. The guard ring (7) surrounds an area of the main surface (10) including the plurality of doped wells (3) without dividing this area. Conductor tracks (4) are electrically connected with the doped wells (3), which are thus interconnected, and further conductor tracks (5) are electrically connected with a region of the second type of conductivity. A doped surface region (2) of the second type of conductivity is present at the main surface (10) and covers the entire area between the guard ring (7) and the doped wells (3). The photodiode of the pixel is radiation-hard, has high speed, low capacitance, low leakage current and a low temperature coefficient of the responsivity.
Abstract:
A solid-state imaging device includes a layout in which one sharing unit includes an array of photodiodes of 2 pixels by 4xn pixels (where, n is a positive integer), respectively, in horizontal and vertical directions.
Abstract:
L'invention porte sur un dispositif de photo-détection comportant un substrat et un réseau de diodes, le substrat comprenant une couche d'absorption (1) et chaque diode comportant dans la couche d'absorption une région de collection (2) qui présente un premier type de dopage. Le dispositif comporte, sous la surface du substrat, un maillage de conduction (7) comprenant au moins un canal de conduction intercalé entre les régions de collection (2) de deux diodes adjacentes, l'au moins un canal de conduction (7) présentant un deuxième type de dopage opposé au premier type et une plus grande densité de dopage que la couche d'absorption. La densité de dopage de l'au moins un canal de conduction (7) est issue d'une diffusion de métal dans la couche d'absorption depuis un maillage métallique présent en surface du substrat. La couche d'absorption présente le premier type de dopage. L'invention porte également sur un procédé de fabrication d'un tel dispositif.
Abstract:
A solid-state imaging device includes a layout in which one sharing unit includes an array of photodiodes of 2 pixels by 4xn pixels (where, n is a positive integer), respectively, in horizontal and vertical directions.
Abstract:
L'invention concerne un pixel (40) de détection de temps de vol comprenant une zone photosensible (PD) comportant une première couche (43) dopée N 1 ; une zone de collection de charges (47) s'étendant dans la première couche et étant plus fortement dopée N 2 que la première couche ; au moins deux zones de stockage de charges (mem 1 , mem 2 , mem 3 , mem 4 ) s'étendant à partir de la zone de collection et comprenant chacune un premier caisson (51) plus fortement dopé N 3 que la zone de collection et séparé de ladite zone de collection par une première portion (59) de la première couche revêtue d'une première grille (61), chaque zone de stockage de charges étant délimitée latéralement par deux électrodes conductrices isolées (53), parallèles et en vis-à-vis ; et une deuxième couche (45) fortement dopée P + revêtant le pixel à l'exception de chaque portion (59, 65) de la première couche revêtue d'une grille (61, 67).
Abstract:
A means for correcting tilts and positional deviations from a stereo image is rendered unnecessary. The present invention has a solid-state imaging element 2 on which a plurality of light receiving sections for photoelectrically converting and imaging an image light from a subject are arranged in a matrix pattern and a lens means 3 with a single focal point on an imaging surface of the solid-state imaging element 2 . The present invention is configured to simultaneously or chronologically expose and image each imaging light from a subject entering different positions of the lens means 3 as a plurality of images in a plurality of imaging regions for each predetermined imaging regions of the solid-state imaging element 2 .