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    MULTI-WIDTH WAVEGUIDES
    1.
    发明公开
    MULTI-WIDTH WAVEGUIDES 审中-公开
    WELLENLEITER MIT MEHREREN BREITEN

    公开(公告)号：EP3096396A1

    公开(公告)日：2016-11-23

    申请号：EP16170674.2

    申请日：2016-05-20

    Applicant: Ciena Corporation

    Inventor： GHASSEMI, Nasser ,  TOURNIER, Hugues

    IPC: H01P5/02

    CPC classification number: H05K3/34 ,  H01P3/006 ,  H01P5/028 ,  H05K1/0237 ,  H05K1/18

    Abstract: A waveguide. The waveguide may include a first waveguide region that includes a signal trace with a first width. The waveguide may further include a second waveguide region that includes the signal trace with a second width. The first width may be different from the second width. The signal trace may be configured to transmit an electrical signal. The signal trace with the second width may be configured to couple with an integrated circuit.

    Abstract translation: 波导。 波导可以包括包括具有第一宽度的信号迹线的第一波导区域。 波导还可以包括第二波导区域，其包括具有第二宽度的信号迹线。 第一宽度可以不同于第二宽度。 信号迹线可以被配置为发送电信号。 具有第二宽度的信号迹线可以被配置为与集成电路耦合。

    Waveguide structure and printed-circuit board
    3.
    发明公开
    Waveguide structure and printed-circuit board 有权
    Wellenleiterstruktur und Leiterplatte

    公开(公告)号：EP2146556A1

    公开(公告)日：2010-01-20

    申请号：EP09163459.2

    申请日：2009-06-23

    Applicant: NEC CORPORATION

    Inventor： Toyao, Hiroshi

    IPC: H05K1/02 ,  H01P1/203 ,  H01Q15/00

    CPC classification number: H01P3/026 ,  H01P1/2005 ,  H01P1/2013 ,  H01P3/006 ,  H01P3/081 ,  H01P5/028 ,  H01P7/082 ,  H01Q9/04 ,  H05K1/0236 ,  H05K1/165 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09309

    Abstract: A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.

    Abstract translation: 使用以一维方式或二维方式重复对准的多个单位结构形成波导结构或印刷电路板。 单元结构包括彼此平行设置的第一和第二导电平面，具有开口端的传输线，该开口端形成在不同于第一和第二导电平面并且定位成面向第二导电平面的层中，以及 通过将传输线电连接到第一导电平面来导电。

    High-frequency circuit device and communication apparatus using the same
    4.
    发明公开
    High-frequency circuit device and communication apparatus using the same 有权
    高频电路和使用这种结构的通信装置，

    公开(公告)号：EP1058335A3

    公开(公告)日：2002-03-27

    申请号：EP00111496.6

    申请日：2000-05-29

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Iio, Keniki, c/o Murata Manufacturing Co., Ltd.

    IPC: H01P1/16 ,  H01P3/00 ,  H01P1/162

    CPC classification number: H01P3/006 ,  H01P1/16

    Abstract: A high-frequency circuit device solves problems caused by a spurious mode reflection generated at a part where propagation of a spurious mode wave is prevented, with the result that propagation of the spurious mode wave such as a parallel plate mode wave is blocked. In the arrangement of the high-frequency circuit device, a spurious mode wave radiated from a transmission line (1) including at least two parallel planar conductors (22) leaks, and the leaked spurious mode wave is reflected by a spurious-mode reflection circuit (3) disposed parallel to the transmission line (1). The distance (W) between the transmission line (1) and the spurious-mode reflection circuit (3) is equivalent to the length in which a wave reflected by the spurious-mode reflection circuit (3) is cancelled by the transmission line (1).

    A CARRIER LAYOUT FOR AN ELECTRO-OPTICAL MODULE, AN ELECTRO-OPTICAL MODULE USING THE SAME, AND INTERCONNECT STRUCTURE FOR COUPLING AN ELECTRONIC UNIT TO AN OPTICAL DEVICE
    5.
    发明公开
    A CARRIER LAYOUT FOR AN ELECTRO-OPTICAL MODULE, AN ELECTRO-OPTICAL MODULE USING THE SAME, AND INTERCONNECT STRUCTURE FOR COUPLING AN ELECTRONIC UNIT TO AN OPTICAL DEVICE 审中-公开
    用于电光模块的载体布局，使用该电光模块的电光模块以及用于将电子单元耦合到光器件的互连结构

    公开(公告)号：EP3220474A1

    公开(公告)日：2017-09-20

    申请号：EP16160425.1

    申请日：2016-03-15

    Applicant: Tyco Electronics Svenska Holdings AB ,  TE Connectivity Corporation

    Inventor： KAIKKONEN, Andrei ,  SMITH, Robert Monroe ,  LUNDQVIST, Lennart Per Olof ,  SVENSON, Lars-Goete ,  CHACINSKI, Marek Grzegorz

    IPC: H01P3/00 ,  H05K1/02 ,  H01P7/08

    CPC classification number: H01P3/006 ,  H01P7/08 ,  H05K1/0225

    Abstract: The present invention provides a carrier layout for an electro-optical module and respective electro-optical module, the carrier layout comprising a substrate (210) comprising a ground plane layer (212) and a coplanar waveguide interconnect (270; 280) disposed onto the substrate (210). The coplanar waveguide interconnect (270; 280) comprises a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The coplanar conductors of the pair are electrically connected to each other by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212). The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate (210) having a ground plane layer (212), the interconnect structure comprising a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The conductors of the pair are electrically connected by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212).

    Abstract translation: 本发明提供了一种用于电光模块和相应的电光模块的载体布局，该载体布局包括衬底（210），该衬底包括设置在所述衬底上的接地平面层（212）和共面波导互连（270; 280） 衬底（210）。 共面波导互连（270; 280）包括设置在该对共面导体（252,254; 262,264）之间的一对共面导体（252,254; 262,264）和中心导体（256; 266）。 该对的共面导体通过与接地平面层（212）隔离的至少一个导电岛（272-274; 282-283）彼此电连接。 本发明还提供一种用于将电子单元耦合到设置在具有接地平面层（212）的衬底（210）上的光学器件的互连结构，所述互连结构包括一对共面导体（252,254; 262,264 ）和设置在该对共面导体（252,254; 262,264）之间的中心导体（256; 266）。 该对导体通过至少一个与接地平面层（212）隔离的导电岛（272-274; 282-283）电连接。

    Vertical grounded coplanar waveguide H-bend interconnection apparatus
    8.
    发明公开
    Vertical grounded coplanar waveguide H-bend interconnection apparatus 失效
    H-geknickte Verbindungseinrichtungfürvertikale geerdete koplanare Wellenleiter

    公开(公告)号：EP0747987A1

    公开(公告)日：1996-12-11

    申请号：EP96108619.6

    申请日：1996-05-30

    Applicant: HE HOLDINGS, INC. dba HUGHES ELECTRONICS

    Inventor： Hoffmeister, Richard M. ,  Quan, Clifton

    IPC: H01P1/02 ,  H01P3/00

    CPC classification number: H01P3/006 ,  H01P1/02

    Abstract: An interconnection apparatus (50) providing a right angle H-plane bend in grounded coplanar waveguide GCPW transmission line media is disclosed. Respective first and second GCPW lines (60, 80) each include a dielectric substrate (62, 82), on which is formed on a bottom surface (62B, 82B) a bottom conductive ground plane (64, 84), and on a top surface (62A, 82A) is formed a center conductor strip (68, 88) sandwiched between first and second top ground plane strips (66A, 66B, 86A, 86B). The two GCPW lines (60, 80) are disposed orthogonally, forming a corner junction (100) at which corresponding bottom and top ground planes (66A, 86A, 64, 84), and the center conductor strips (68, 88) of the lines (60, 80) are electrically connected. The gaps (70A, 70B, 90A, 90B) between the top ground plane strips (66A, 66B, 86A, 86B) and the center conductor strips (68, 88) have regions (76A, 76B, 96A, 96B) of increased width at the corner junction (100) to compensate for the capacitance resulting from the junction (100).

    Abstract translation: 该端口包括第一垂直共面波导（CPW）传输线，其包含具有第一和第二相对表面的第一电介质基板。 第一中心导体条以第一和第二顶部导电接地平面条的空间关系限定在第二表面上。 第二CPW传输线具有带有第三和第四相对表面的第二电介质基片。 第二中心导体条以与第三和第四顶部导电接地平面条隔开的关系限定在第四表面上。 对齐并电接触。 第二衬底横向并且邻近第一衬底设置，使得第一和第二中心导体条被对准并且电接触。

    High-frequency circuit package and high-frequency circuit device
    10.
    发明公开
    High-frequency circuit package and high-frequency circuit device 审中-公开
    Hochfrequenzschaltungsgehäuseund Hochfrequenzschaltung

    公开(公告)号：EP2428989A2

    公开(公告)日：2012-03-14

    申请号：EP11169866.8

    申请日：2011-06-14

    Applicant: Fujitsu Limited

    Inventor： Masuda, Satoshi

    IPC: H01L23/057 ,  H01L23/66 ,  H01L23/498 ,  H01P1/04

    CPC classification number: H01L23/057 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/66 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/1903 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01P3/006 ,  H01P5/028 ,  H01L2924/00

    Abstract: A high-frequency circuit package including a dielectric substrate (10); a signal line (31), a first ground conductor layer (32), a second ground conductor layer (33), and a frame-shaped dielectric layer (16) formed on the dielectric substrate; a fourth ground conductor layer (35) formed on the frame-shaped dielectric layer; a first recess (29) formed in the frame-shaped dielectric layer and including a first (29b) surface and a second surface (29c) that are located above the first ground conductor layer (32) and the second ground conductor layer (33) and extend laterally at an oblique angle with respect to the length direction of the signal line; a first ground line (38a) formed on the first surface and electrically connecting the second ground conductor layer (33) with the fourth ground conductor layer (35); and a second ground line (38b) formed on the second surface and electrically connecting the third ground conductor layer (34) with the fourth ground conductor layer (35).

    Abstract translation: 一种包括电介质基板（10）的高频电路封装。 信号线（31），第一接地导体层（32），第二接地导体层（33）和形成在电介质基板上的框状电介质层（16） 形成在所述框状电介质层上的第四接地导体层（35） 形成在所述框状电介质层中并且包括位于所述第一接地导体层（32）和所述第二接地导体层（33）上方的第一（29b）表面和第二表面（29c）的第一凹部（29） 并相对于信号线的长度方向以倾斜角侧向延伸; 形成在所述第一表面上并将所述第二接地导体层（33）与所述第四接地导体层（35）电连接的第一接地线（38a）; 和形成在第二表面上并将第三接地导体层（34）与第四接地导体层（35）电连接的第二接地线（38b）。

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