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14 条记录 (耗时 0.013 秒)

    Transmission line, impedance transformer, integrated circuit mounted device, and communication device module
    6.
    发明公开
    Transmission line, impedance transformer, integrated circuit mounted device, and communication device module 有权
    安装的集成电路器件和通信装置模块上传输线路匹配变压器，

    公开(公告)号：EP2493008A1

    公开(公告)日：2012-08-29

    申请号：EP11190255.7

    申请日：2011-11-23

    申请人： Fujitsu Limited

    发明人： Masuda, Satoshi

    IPC分类号： H01P5/12 ,  H03F3/60

    CPC分类号： H01P5/12 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2224/49175 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H03F3/602 ,  H03H7/38 ,  H01L2924/00

    摘要： A transmission line includes two tapered lines having a tapered planar shape and arranged in parallel, opposite lines provided in opposition to the narrower width sides of the two tapered lines, and a bonding wire for connecting the narrower width sides of the two tapered lines and the opposite lines, wherein the width between two outer edges on the narrower width sides of the two tapered lines arranged in parallel is greater than the width between outer edges on the opposite side of the opposite lines in opposition to the narrower width sides of the two tapered lines.

    摘要翻译： 的传输线包括一个具有锥形的平面形状，并且在反对提供给所述两个渐缩线的较窄宽度侧平行的相对线布置，并且用于连接两个锥形线和的较窄宽度侧上的接合线2条渐缩线 相对线，worin两个外边缘之间的宽度上平行设置在两个渐缩线的较窄宽度侧比在相对线的对立的相反侧的两个锥形的较窄宽度侧外边缘之间的宽度大 线。

    High-frequency circuit package and high-frequency circuit device
    8.
    发明公开
    High-frequency circuit package and high-frequency circuit device 审中-公开
    Hochfrequenzschaltungsgehäuseund Hochfrequenzschaltung

    公开(公告)号：EP2428989A2

    公开(公告)日：2012-03-14

    申请号：EP11169866.8

    申请日：2011-06-14

    申请人： Fujitsu Limited

    发明人： Masuda, Satoshi

    IPC分类号： H01L23/057 ,  H01L23/66 ,  H01L23/498 ,  H01P1/04

    CPC分类号： H01L23/057 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/66 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/1903 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01P3/006 ,  H01P5/028 ,  H01L2924/00

    摘要： A high-frequency circuit package including a dielectric substrate (10); a signal line (31), a first ground conductor layer (32), a second ground conductor layer (33), and a frame-shaped dielectric layer (16) formed on the dielectric substrate; a fourth ground conductor layer (35) formed on the frame-shaped dielectric layer; a first recess (29) formed in the frame-shaped dielectric layer and including a first (29b) surface and a second surface (29c) that are located above the first ground conductor layer (32) and the second ground conductor layer (33) and extend laterally at an oblique angle with respect to the length direction of the signal line; a first ground line (38a) formed on the first surface and electrically connecting the second ground conductor layer (33) with the fourth ground conductor layer (35); and a second ground line (38b) formed on the second surface and electrically connecting the third ground conductor layer (34) with the fourth ground conductor layer (35).

    摘要翻译： 一种包括电介质基板（10）的高频电路封装。 信号线（31），第一接地导体层（32），第二接地导体层（33）和形成在电介质基板上的框状电介质层（16） 形成在所述框状电介质层上的第四接地导体层（35） 形成在所述框状电介质层中并且包括位于所述第一接地导体层（32）和所述第二接地导体层（33）上方的第一（29b）表面和第二表面（29c）的第一凹部（29） 并相对于信号线的长度方向以倾斜角侧向延伸; 形成在所述第一表面上并将所述第二接地导体层（33）与所述第四接地导体层（35）电连接的第一接地线（38a）; 和形成在第二表面上并将第三接地导体层（34）与第四接地导体层（35）电连接的第二接地线（38b）。