公开(公告)号：EP3222124A1

公开(公告)日：2017-09-27

申请号：EP15795302.7

申请日：2015-11-05

申请人： TE Connectivity Corporation

发明人： SHOCKET, Abraham Louis ,  BRYAN, Lyle Stanley ,  COWAN, John Steven ,  PETERSON, Kevin John

IPC分类号： H05K1/02 ,  H01R12/00 ,  H05K7/20

CPC分类号： H05K1/181 ,  H01R12/515 ,  H05K1/0203 ,  H05K5/0069 ,  H05K7/20854 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10537

摘要： An electrical assembly (200) configured to be fixed in a housing of an electrical connector includes an electrical package (204) disposed on a substrate (202) and electrically connected to the substrate. The electrical assembly also includes a conductor (211) terminated to the substrate at a spaced apart location from the electrical package to provide at least one of power or control signals to the substrate. A terminating segment (218) of the conductor is thermally coupled to the electrical package to receive heat generated at the electrical package and dissipate the heat through the conductor away from the electrical package.

摘要翻译： 被配置成固定在电连接器的外壳中的电组件包括设置在基板上并电连接到基板的电封装。 该电气组件还包括在与电气封装间隔开的位置处终止于衬底的导体，以向衬底提供功率或控制信号中的至少一个。 导体的端接段被热耦合至电封装以接收在电封装处产生的热量并且通过导体散发热量远离电封装。

公开(公告)号：EP2248244A1

公开(公告)日：2010-11-10

申请号：EP09715622.8

申请日：2009-02-23

申请人： Delft University of Technology ,  Epyon B.V.

发明人： ROBERS, Egbert, Wouter, Joghum ,  MOLENAAR, Bastiaan, Arien, Maria ,  SMIT, Wouter ,  BECH, Lars, Peter ,  BOUMAN, Crijn

IPC分类号： H02J7/00

CPC分类号： H02J7/0029 ,  H05K1/0203 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10537

摘要： The invention relates to an electric charger for an accumulator or a battery or the like, which is adapted for rapid charging during an on-period and comprises for this purpose control means for starting and ending the on-period. The charger is provided with a circuit for converting a supply voltage to a charging current for the battery, and further with a heat-absorbing member in heat-conducting coupling with at least an electrical component of the circuit to be protected against overheating. The control means are adapted such that the on-period cannot be restarted during an off-period following the on-period. The electric charger can hereby comprise a heat-absorbing member with a relatively low heat loss, this saving space and cost.

公开(公告)号：EP0475565A2

公开(公告)日：1992-03-18

申请号：EP91305909.3

申请日：1991-06-28

申请人： AUE INSTITUTE LIMITED

发明人： Adachi, Yoshio

IPC分类号： B23K20/10 ,  H01L21/607

CPC分类号： H05K3/328 ,  B23K20/10 ,  H01L2224/10165 ,  H01L2224/81141 ,  H05K3/303 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0285 ,  H05K2203/166 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

摘要： At least one electronic element (12) is ultrasonically welded to a printed circuit board (10) to create the electronic circuit. Proper alignment between terminals of a conductive circuit pattern (14) on the circuit board and terminal units (20) on the connecting surface of the electronic element is ensured by a variety of techniques: (i) small protuberances (22) on the terminal units, (ii) raised section (26) on the bottom surface of the terminal units placed to engage indented portions of the board, and (iii) corresponding posts (36) (on the electronic elements) and holes (41) (formed on the circuit board). The ultrasonic welding of the element to the printed circuit board is typically conducted at a frequency range between 25-30 megahertz which produces a vibration which grinds the terminal units of the electronic element to the terminals of the circuit pattern while also welding the element and circuit board together. Electronic circuits formed in accordance with the inventive concept disclosed herein can be comprised of stacked or interlocking combinations of weldable electronic elements. Such structures can improve rigidity and vary spacial relationships of electronic circuits.

摘要翻译： 至少一个电子元件（12）被超声波焊接到印刷电路板（10）以形成电子电路。 通过各种技术确保电路板上的导电电路图案（14）的端子与电子元件的连接表面上的端子单元（20）之间的正确对准：（i）端子单元上的小突起（22） ，（ii）放置在接合板的凹陷部分的端子单元的底表面上的升高部分（26），和（iii）相应的柱（36）（在电子元件上）和孔（41） 电路板）。 元件对印刷电路板的超声波焊接通常在25-30兆赫兹的频率范围内进行，这产生了将电子元件的端子单元磨削到电路图案的端子的振动，同时也焊接元件和电路 在一起。 根据本文公开的发明构思形成的电子电路可以包括可焊接电子元件的堆叠或互锁组合。 这种结构可以改善电子电路的刚度和变化的空间关系。

公开(公告)号：EP0125780A1

公开(公告)日：1984-11-21

申请号：EP84302382.1

申请日：1984-04-06

申请人： AMP INCORPORATED (a New Jersey corporation)

发明人： Grabbe, Dimitry G. ,  Korsunsky, Iosif

IPC分类号： H01R23/68

CPC分类号： H05K3/303 ,  H01R12/716 ,  H05K3/305 ,  H05K2201/10189 ,  H05K2201/10537 ,  Y02P70/613

摘要： A modular connector (10) housing of relatively short length and having a coupling feature, such as a tab (14) at one end and a recess (12) atthe other end, is connected with other similar connector housings. A filler material (22) having a melting point lower than that of the particular soldering method chosen is then inserted into the portion where two housings are joined thereby forming a relatively rigid long connector housing assemblage (11). A hot-melt adhesive preform (28) is then placed on the bottom of the connector housing (10) with the entire connector housing assembly aligned with and attached to a printed circuit board (24). The hot-melt adhesive (28) bonds the connector housing (10) to the substrate (24) while the filler material (22) melts away from the filler openings (16), allowing the short incremental housing lengths to move relatively free with respect to each other.

摘要翻译： 具有较短长度并且具有耦合特征的模块化连接器（10）壳体，例如在一端处的突片（14）和在另一端的凹部（12），与其它类似的连接器壳体连接。 然后将熔点低于所选择的特定焊接方法的填充材料（22）插入到两个壳体接合的部分中，从而形成相对刚性的长连接器壳体组件（11）。 然后将热熔胶预成型件（28）放置在连接器壳体（10）的底部上，整个连接器壳体组件与印刷电路板（24）对准并连接到印刷电路板（24）。 热熔粘合剂（28）将连接器壳体（10）粘合到基底（24）上，同时填充材料（22）从填料开口（16）熔化，允许短的增量壳体长度相对自由地移动 对彼此。

公开(公告)号：EP3226269A2

公开(公告)日：2017-10-04

申请号：EP17157758.8

申请日：2017-02-24

申请人： SEMIKRON Elektronik GmbH & Co. KG

发明人： Frank, Thomas ,  Walter, Christian ,  Weiß, Stefan ,  Ziegler, Thomas

IPC分类号： H01G4/40 ,  H01G4/38 ,  H01G2/06 ,  H01G2/08 ,  H01L23/049 ,  H01L23/48

CPC分类号： H01G2/06 ,  H01G2/08 ,  H01G4/38 ,  H01G4/40 ,  H01L23/049 ,  H01L23/48 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/10015 ,  H05K2201/10537 ,  H05K2201/10651 ,  H05K2201/10757

摘要： Die Erfindung betrifft eine Leistungshalbleitereinrichtung (1) mit einem eine erste und eine zweite elektrisch leitende Kontaktfläche (2a und 2b) aufweisenden Substrat (3) auf dem Leistungshalbleiterbauelemente (4) angeordnet und mit dem Substrat (3) elektrisch leitend verbunden sind, und mit einem elektrischen Kondensator (5), der zum elektrischen Anschluss des Kondensators ein elektrisch leitendes erstes und ein elektrisch leitendes zweites Kondensatoranschlusselement (5a und 5b) aufweist, wobei die Kondensatoranschlusselemente mit dem Substrat elektrisch leitend druckkontaktiert sind. Die Erfindung schafft eine Leistungshalbleitereinrichtung, deren Kondensatoren zuverlässig elektrisch leitend mit dem Substrat der Leistungshalbleitereinrichtung verbunden sind.
Abbildung 2.

摘要翻译： 本发明涉及（1）布置成与第一和第二导电接触面积的功率半导体器件（2a和2b），其具有在衬底（3）上的功率半导体元件（4）和所述基板（3）的导电连接，并用 电电容器（5）包括导电的第一和第二电容器的导电连接元件（5a和5b），用于所述电容器的电性连接，其中所述电容器连接元件是压接与所述基板是导电的。 本发明提供了一种功率半导体器件，其电容器可靠地电连接到功率半导体器件的衬底。 图2。

公开(公告)号：EP2542037A1

公开(公告)日：2013-01-02

申请号：EP12173488.3

申请日：2012-06-25

申请人： Honeywell International Inc.

发明人： Liu, Chia-Ming

IPC分类号： H05K1/18 ,  H05K3/34 ,  H05K1/02

CPC分类号： H05K1/181 ,  B81C1/0023 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1461 ,  H05K1/0201 ,  H05K3/3431 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00

摘要： A sensing unit package (20) with reduced size and improved thermal sensing capabilities. An exemplary package includes a printed circuit board (24) with a plurality of electrical traces, an application-specific integrated circuit (Analog ASIC) chip (26), and a micromachined sensor (28) formed on a microelectromechanical system (MEMS) die. The Analog ASIC chip is electrically and mechanically attached to the printed circuit board. The MEMS die is in direct electrical communication with only a portion of the electrical traces of the printed circuit board and is mechanically and thermally attached directly to the Analog ASIC chip. A thermally conducting compound (36) is located between the MEMS die and the Analog ASIC chip. One or more solder balls (32) electrically attach the Analog ASIC chip to the printed circuit board and one or more solder traces electrically attach the MEMS die to the printed circuit board.

摘要翻译： 感测单元包（20）具有减小的尺寸和改进的热感测能力。 示例性封装包括：印刷电路板（24）与上应用特定的集成电路（模拟ASIC）芯片（26）电迹线的多个，以及形成的微机电系统上的微机械加工的传感器（28），（MEMS）这一点。 模拟ASIC芯片被电和机械地连接到印刷电路板。 MEMS管芯处于直接电连通与所述印刷电路板的电迹线的仅一部分，并且机械和热直接连接到模拟ASIC芯片。 热传导化合物（36）位于所述MEMS和模拟ASIC芯片之间。 一个或多个焊料球（32）的模拟ASIC芯片电连接到所述印刷电路板和一个或多个焊料迹线的MEMS电附上到印刷电路板。

公开(公告)号：EP1970932A3

公开(公告)日：2010-05-26

申请号：EP08100571.2

申请日：2008-01-17

申请人： Siemens Aktiengesellschaft

发明人： Cesnak, Lorand ,  Cyba, Edward

IPC分类号： H01H37/76

CPC分类号： H01H37/767 ,  H01H37/08 ,  H01H2037/763 ,  H05K1/0201 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/10537 ,  H05K2203/0271

摘要： Vorrichtung zur thermischen Überwachung eines Bauelementes (2) in einem elektrischen Strompfad (8), umfassend:
- ein mit dem Bauelement (2) wärmeleitend verbundenes Schmelzelement (3);
- eine mit dem Schmelzelement (3) in einer Wirkverbindung stehende Unterbrechungseinrichtung (14), die den Strompfad (8) unterbricht, für den Fall, dass die Temperatur des Bauelementes (2) einen vorgegebenen Schwellwert überschreitet, so dass das Schmelzelement (3) schmilzt;

dadurch gekennzeichnet,
- dass das Schmelzelement (3) am Bauelement (2) anliegend angeordnet ist, und
- dass ein Federsystem (5, 6) vorgesehen ist, mittels dessen das Schmelzelement (3) mit einer zum Bauelement (2) gerichteten Federkraft beaufschlagbar ist.

公开(公告)号：EP2012513A3

公开(公告)日：2010-02-24

申请号：EP08166908.7

申请日：2003-09-17

申请人： Epcos AG

发明人： Connett, David ,  Fellner, Siegfried ,  Huemer, Philipp ,  Morianz, Mike

IPC分类号： H04M3/18 ,  H01C1/02

CPC分类号： H05K3/301 ,  H01C1/022 ,  H04M3/18 ,  H05K2201/10022 ,  H05K2201/10537 ,  H05K2203/168

摘要： Die Erfindung betrifft eine elektrische Baugruppe mit einem Gehäuse (1), enthaltend wenigstens zwei gleichartige elektrische Bauelemente (21, 22), die in Bezug auf eine Kenngröße aneinander angepaßt sind, und mit Anschlüssen (311, 312, 321, 322) zur separaten Kontaktierung jedes einzelnen Bauelements (21, 22). Die Baugruppe kann vorteilhaft bei Telekomanwendungen verwendet werden, wo zwei Telefonleitungen mit Thermistoren derselben Widerstandsklasse bestückt werden müssen.

公开(公告)号：EP1079674B1

公开(公告)日：2002-10-09

申请号：EP99918316.3

申请日：1999-04-30

申请人： Rohm Co., Ltd.

发明人： NAGASHIMA, Mitsunori, Rohm Co. Ltd.

IPC分类号： H05K1/18 ,  H01H37/04 ,  H05K1/02

CPC分类号： H05K1/0201 ,  H01H37/04 ,  H01H2037/046 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10689

摘要： Electronic parts are mounted on a circuit board (1) on which interconnection patterns are formed. Of those parts, particular field-effect transistors (FET) (2) that are likely to become hot are adjacent to a temperature-sensitive fuse (4) that breaks a circuit when the temperature of the electronic part rises. The circuit board (1) includes A through hole (1a) in the area where the FETs (2) are mounted. The FETs (2) are laid over the through hole (1a) on the front side of the circuit board (1). The temperature-sensitive fuse (4) is partially inserted in the through hole (1a) on the backside of the FETs (2), which is filled with heat-conducting resin (3) such as silicone. This circuit board can be thin, including parts mounted on it, without using a thinner board. Therefore, such a board with a temperature-sensitive fuse can be used in notebook computers that usually have only a limited space. This circuit board also provides a mounting structure for a temperature-sensitive fuse that is sensitive to the temperature of parts to break circuits if abnormal temperature is detected.

公开(公告)号：EP1079674A4

公开(公告)日：2001-07-04

申请号：EP99918316

申请日：1999-04-30

申请人： ROHM CO LTD

发明人： NAGASHIMA MITSUNORI

IPC分类号： H05K7/20 ,  H01H37/04 ,  H05K1/02 ,  H05K1/18

CPC分类号： H05K1/0201 ,  H01H37/04 ,  H01H2037/046 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10689

摘要： Electronic parts are mounted on a circuit board (1) on which interconnection patterns are formed. Of those parts, particular field-effect transistors (FET) (2) that are likely to become hot are adjacent to a temperature-sensitive fuse (4) that breaks a circuit when the temperature of the electronic part rises. The circuit board (1) includes A through hole (1a) in the area where the FETs (2) are mounted. The FETs (2) are laid over the through hole (1a) on the front side of the circuit board (1). The temperature-sensitive fuse (4) is partially inserted in the through hole (1a) on the backside of the FETs (2), which is filled with heat-conducting resin (3) such as silicone. This circuit board can be thin, including parts mounted on it, without using a thinner board. Therefore, such a board with a temperature-sensitive fuse can be used in notebook computers that usually have only a limited space. This circuit board also provides a mounting structure for a temperature-sensitive fuse that is sensitive to the temperature of parts to break circuits if abnormal temperature is detected.