SCHOTTKY BARRIER DIODE
    6.
    发明公开

    公开(公告)号:EP4354514A2

    公开(公告)日:2024-04-17

    申请号:EP23187310.0

    申请日:2023-07-24

    发明人: OTSUKA, Fumio

    摘要: A Schottky barrier diode includes a semiconductor layer of a first conductivity type including a wide-bandgap semiconductor and a trench defining a mesa portion on a first surface thereof, a high-resistance region under the trench of the semiconductor layer, the high-resistance region including an impurity of a second conductivity type different from the first conductivity type, an insulating film or a semiconductor film of the second conductivity type, the insulating film or semiconductor film covering at least a bottom surface among inner surfaces of the trench, an anode electrode on the semiconductor layer through the insulating film or the semiconductor film, the anode electrode being connected to the mesa portion, and a cathode electrode directly or through another layer on a second surface of the semiconductor layer on the opposite side to the first surface.

    TRANSISTOR WITH LOW PARASITIC CAPACITANCE
    9.
    发明公开

    公开(公告)号:EP4199115A1

    公开(公告)日:2023-06-21

    申请号:EP21215532.9

    申请日:2021-12-17

    申请人: IMEC VZW

    摘要: According to an aspect of the present inventive concept there is provided a 2D transistor device (100). The 2D transistor device (100) comprises: a 2D semiconductor layer (110) comprising a source-side extension portion (112), a drain-side extension portion (116) and a channel portion (114) extending between the extension portions (112, 116) along a channel direction (300); a gate electrode (120) arranged along and being coextensive with the channel portion (114); a source-side 2D metal contact (132) arranged in abutment with the source-side extension portion (112) and spaced apart from the gate electrode (120) along the channel direction (300); and a drain-side 2D metal contact (136) arranged in abutment with the drain-side extension portion (116) and spaced apart from the gate electrode (120) along the channel direction (300).
    A method (150) for forming such a device (100) and a system (200) comprising at least two such devices (100) are also provided.