Abstract:
PROBLEM TO BE SOLVED: To provide a method of properly connecting respective shields of a plurality of extra fine coaxial wires via a common conductive member. SOLUTION: The coaxial wires 1 having the shields 13 that are partially exposed are arranged in parallel. A metal piece 4 is mounted on the respective shields 13 of the coaxial wires 1 and the metal piece 4 is melted by being irradiated with laser light L. Then, the respective shields 13 are connected electrically via the common conductive member 3 by mounting a common conductive member 3 on the melted metal piece 4. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing motor, capable of preventing the brush slide-contact portion side in a rectifier piece from floating outward in the peripheral direction of an insulator. SOLUTION: This method of manufacturing motor includes a "winding connection process" for electrically connecting a winding 4a to a rectifier 3 which is formed by disposing the plurality of rectifier pieces 8 in the circumferential direction on the outer peripheral side of the cylindrical insulator 7. In the rectifier pieces 8, a brush slide-contact portion 8a with which the brush is brought into slide contact on one side in the axial direction is formed; a claw portion 8b, which is engaged with the winding 4a, is formed on the other side in the axial direction; and a bending fulcrum portion 8d where the claw portion 8b is bent inward in the radial direction when pressed, is formed closer to the claw portion 8b side than the brush slide-contact portion 8a (located between the brush slide-contact portion 8a and a thin portion 8c). Additionally, the "winding connection process" performs welding, while pressing the claw portion 8b engaged with the winding 4a, inward in the radial direction with an electrode D for welding, thus bending the bending fulcrum portion 8d by the pressing force of the electrode D for welding. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring material having uniform connectivity for the connection of a single wire conductor and a connecting terminal, and having high connecting reliability. SOLUTION: This wiring material formed by electrically connecting the connecting terminal 4 with two single wire conductors 2, 2 provided in parallel is manufactured by a process to form a tubular portion 5 for storing the two single wire conductors 2, 2 in the connecting terminal 4 and to insert the two single wire conductors 2, 2 into the tubular portion 5, a process to electrically connect the connecting terminal 4 with the two single wire conductors 2, 2 by applying resistance welding by energizing from the periphery of the tubular portion 5 with the inner periphery of the tubular portion 5 brought into mutual contact with the two single wire conductors 2, 2, and a process to form a crushingly processed part 8 by crushingly processing the tubular portion 5 of the connecting terminal 4 when applying resistance welding and to bring the inner periphery of the tubular portion 5 into mutual contact with the two single wire conductors 2, 2. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To suppress adhesion of a metal ball to an electrode other than a desired one. SOLUTION: A plurality of conductors 48 are formed on the upper surface of a base film 49. Assuming the bottom face width of a hole 45 in the upper surface of the base film 49 is d, the inclination angle between the upper surface of the base film 49 and a line connecting the bottom face edge of the hole 45 in the upper surface of the base film 49 and the opening edge of the hole 45 in the lower surface of the base film 49 is θ, the distance between the center of the hole 45 and the circumferential edge of a land part 36 facing other hole 45 adjacent to that hole 45 is R, and the thickness of the base film 49 is t, the hole 45 having a bottom face width d and an inclination angle θ is formed to satisfy a relation R>d/2+t/tanθ. A solder ball 80 is then bonded through the hole 45 to the conductor 48 exposed by the hole 45. Thereafter, while fusing the solder ball 80 thermally, the land part 36 of each individual electrode 35 and the conductor 48 are boded through the fused solder ball 80. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation:要解决的问题:抑制金属球对除了期望的电极之外的电极的粘附。 解决方案:在基膜49的上表面上形成多个导体48.假设基膜49的上表面中的孔45的底面宽度为d,则上表面 并且在基膜49的上表面中连接孔45的底面边缘和底膜49的下表面中的孔45的开口边缘的线为θ, 孔45的中心和与该孔45相邻的其他孔45的脊部36的周缘部为R,基膜49的厚度为t,孔45的底面宽度d和倾斜角 形成θ满足R> d / 2 + t /tanθ的关系。 然后通过孔45将焊球80接合到由孔45暴露的导体48中。之后,在焊球80热熔融的同时,每个单独电极35的接地部分36和导体48通过熔融焊料 球80.版权所有(C)2006年,JPO&NCIPI
Abstract:
In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream-and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead-with the bumps formed on a die or other printhead component, and nozzles formed through the base.