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公开(公告)号：JP5500237B1
公开(公告)日：2014-05-21
申请号：JP2012266627
申请日：2012-12-05
Applicant: 住友金属鉱山株式会社
CPC classification number: B22F1/0003 , B22F1/0011 , B22F1/0096 , B22F9/24 , B22F2998/10 , C22C5/06 , H01B1/02 , H01B1/22 , H01B5/00 , H05K1/09 , H05K1/092 , H05K2201/02 , H05K2201/032 , B22F1/0085 , B22F9/04
Abstract: 【課題】ペースト製造時に適切な粘度範囲を有し、混練が容易でフレークの発生を抑制した銀粉とする。
【解決手段】ＪＩＳ−Ｋ６２１７−４法で測定したフタル酸ジブチルの吸収量が７．０〜９．５ｍｌ／１００ｇであり、及び吸収量測定時の吸油プロファイルに２個のピーク又は半値幅が１．５ｍｌ／１００ｇ以下の１個のピークを有する。
【選択図】図１-
Patent Agency Ranking52.发明专利Circuit board, conductive film formation method, and adhesion improvement agent 有权电路板，导电膜形成方法和粘合改进剂
公开(公告)号：JP2014011199A
公开(公告)日：2014-01-20
申请号：JP2012144747
申请日：2012-06-27
Applicant: Ishihara Chemical Co Ltd , 石原ケミカル株式会社
Inventor： KAWATO YUICHI , MITA MICHIHIRO , MAEDA YUSUKE , KUDO TOMIO
CPC classification number: H05K3/38 , H05K1/0296 , H05K1/0313 , H05K1/097 , H05K3/245 , H05K3/246 , H05K3/386 , H05K2201/0129 , H05K2201/0137 , H05K2201/0154 , H05K2201/032 , H05K2203/1126 , H05K2203/1131 , Y10T29/49163
Abstract: PROBLEM TO BE SOLVED: To improve the adhesion of a conductive film to a base material in the conductive film formed by optically burning a coating made of copper fine particles.SOLUTION: A circuit board 1 includes a circuit having a conductive film 2 and a substrate 3. The circuit board 1 further includes a resin layer 4 between the substrate 3 and the conductive film 2. The substrate 3 is formed by a non-thermoplastic base material 31. The resin layer 4 includes a thermoplastic resin. The conductive film 2 is formed by optically burning a coating made of copper fine particles 21. This structure improves the adhesion of the conductive film 2 to the base material 31 through the resin layer 4.
Abstract translation: 要解决的问题：提高导电膜与通过光刻烧制由铜微粒构成的涂层形成的导电膜中的基材的粘附性。解决方案：电路板1包括具有导电膜2和基板的电路 电路板1还包括在基板3和导电膜2之间的树脂层4.基板3由非热塑性基材31形成。树脂层4包括热塑性树脂。 导电膜2通过光刻烧制由铜微粒子21制成的涂层而形成。这种结构通过树脂层4改善了导电膜2与基材31的粘合性。
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53.发明专利Composition for forming silver-ion-diffusion inhibition layer, film for silver-ion diffusion inhibition layer, wiring board, electronic device, conductive film laminate, and touch panel 有权用于形成银离子抑制层的组合物，用于银离子扩散抑制层的膜，接线板，电子器件，导电膜层压板和触控面板
公开(公告)号：JP2013224397A
公开(公告)日：2013-10-31
申请号：JP2012167157
申请日：2012-07-27
Applicant: Fujifilm Corp , 富士フイルム株式会社
Inventor： MITAMURA YASUHIRO , NAKAYAMA MASAYA , MATSUNAMI YUKI
CPC classification number: H05K1/0256 , B32B3/08 , B32B5/024 , B32B7/12 , B32B15/08 , B32B27/20 , B32B27/281 , B32B27/283 , B32B27/30 , B32B27/308 , B32B27/32 , B32B27/322 , B32B27/36 , B32B27/38 , B32B27/42 , B32B2255/205 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2307/202 , B32B2307/412 , B32B2457/00 , C08K5/378 , C08K5/47 , H01B3/447 , H05K1/092 , H05K3/285 , H05K2201/0108 , H05K2201/0145 , H05K2201/0154 , H05K2201/0206 , H05K2201/032 , H05K2201/0769 , Y10T428/2804
Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming a silver-ion-diffusion inhibition layer, with which a silver-ion-diffusion inhibition layer can be formed that inhibits silver ion migration in silver-containing or silver alloy-containing metal wiring and that is capable of improving insulation reliability in the wiring.SOLUTION: A composition for forming a silver-ion-diffusion inhibition layer includes an insulating resin, and a compound having: a structure selected from the group consisting of a triazole structure, a thiadiazole structure, and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group that may contain heteroatoms, the total number of carbon atoms in the hydrocarbon group (or in each hydrocarbon group in cases when a plurality of hydrocarbon groups are present) being at least 5.
Abstract translation: 要解决的问题：提供一种用于形成银离子扩散抑制层的组合物，通过该组合物可以形成银离子扩散抑制层，其抑制含银或含银合金的金属布线中的银离子迁移， 能够提高布线中的绝缘可靠性。解决方案：用于形成银离子扩散抑制层的组合物包括绝缘树脂和具有选自三唑结构，噻二唑结构的结构的化合物 和苯并咪唑结构; 巯基; 和至少一个可以含有杂原子的烃基，烃基中的总碳原子数（或在存在多个烃基的情况下的每个烃基中）的碳原子数为5个以上。
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公开(公告)号：JP2013155410A
公开(公告)日：2013-08-15
申请号：JP2012017261
申请日：2012-01-30
Applicant: Toppan Printing Co Ltd , 凸版印刷株式会社 , Gunma Univ , 国立大学法人群馬大学
Inventor： TSUCHIDA TETSUYUKI , OKUBO RIICHI , SHOJI IKUO , KARINO TAKAHIRO
CPC classification number: H05K1/09 , C23C18/1651 , C23C18/36 , C23C18/44 , C23C18/50 , H05K3/243 , H05K3/244 , H05K2201/032 , H05K2201/0776 , H05K2203/072
Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which has excellent reflow resistance and aging resistance, and is high in mounting reliability, and a method for manufacturing the same.SOLUTION: The wiring board 1 includes: an electrode 12 composed of Cu or a Cu alloy; and a plating film 14 formed on the electrode 12, and the plating film 14 is composed of a laminate film in which an electroless nickel plating layer 18, an electroless palladium plating layer 20, and an electroless gold plating layer 22 are formed in order from the electrode 12 side. The electroless nickel plating layer 18 is formed by co-deposition of Ni, P, Bi and S, in which the content of P is 5 mass% or more but less than 10 mass%, the content of Bi is 1-1,000 ppm by mass, and the content of S is 1-2,000 ppm by mass, and the mass ratio (S/Bi) of the content of S to the content of Bi is more than 1.0.
Abstract translation: 要解决的问题：提供一种具有优异的耐回流性和耐老化性，并且安装可靠性高的布线板及其制造方法。解决方案：布线板1包括：由Cu或 铜合金; 以及形成在电极12上的镀膜14，镀膜14由层叠膜构成，其中依次形成化学镀镍层18，无电镀钯层20和无电镀金层22 电极12侧。 通过共沉积Ni，P，Bi和S形成化学镀镍层18，其中P的含量为5质量％以上且小于10质量％，Bi的含量为1-1000ppm，通过 质量，S含量为1-2000质量ppm，S含量与Bi含量的质量比（S / Bi）大于1.0。
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55.发明专利
公开(公告)号：JP2013516771A
公开(公告)日：2013-05-13
申请号：JP2012547261
申请日：2010-12-29
Inventor： マニカンタン ナイル クマラン , イー．ゴードン スコット , フレデリック マッコムズ マーク
CPC classification number: H05K3/0094 , H01B1/22 , H05K1/09 , H05K1/092 , H05K1/095 , H05K1/115 , H05K3/4061 , H05K2201/032 , H05K2201/09481 , H05K2201/09563 , H05K2203/1126
Abstract: 異種金属組成物間の電気的接続における界面の影響を最小限にするために、遷移ビアおよび遷移配線導体を形成するための組成物が、開示される。 この組成物は、（ａ）（ｉ）２０〜４５重量％の金および８０〜５５重量％の銀と、（ｉｉ）１００重量％の銀−金の固溶体合金とからなる群から選択される無機成分、および（ｂ）有機媒体を含む。 この組成物は、（ｃ）組成物の重量に対して１〜５重量％の、Ｃｕ、Ｃｏ、ＭｇおよびＡｌからなる群から選択される金属の酸化物または混合酸化物、および／または、主として高融点酸化物を含む高粘度ガラスをさらに含む。 この組成物は、ビア充填での多層膜組成物として使用され得る。 遷移ビアおよび遷移配線導体を形成するために、この組成物を使用して、ＬＴＣＣの回路およびデバイスなどの多層膜回路がさらに形成され得る。
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56.发明专利
公开(公告)号：JP2012230664A
公开(公告)日：2012-11-22
申请号：JP2012004278
申请日：2012-01-12
Applicant: Fujifilm Corp , 富士フイルム株式会社
Inventor： ICHIKI AKIRA
CPC classification number: H05K1/0274 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/03 , H05K3/106 , H05K2201/0108 , H05K2201/0317 , H05K2201/032
Abstract: PROBLEM TO BE SOLVED: To improve the visibility of a touch panel by reducing a difference between the hues of the front and back faces of a transparent electrode sheet.SOLUTION: In the transparent electrode sheet formed with electrodes whose patterning has been performed on a transparent support body, the absolute value of a difference between reflection chromaticity bof the electrode surface at a side far from the transparent support body and reflection chromaticity bof the electrode surface at a side near to the transparent support body is equal to or less than 2 (|▵b|=|b-b|≤2).
Abstract translation: 要解决的问题：通过减小透明电极片的正面和背面的色调之间的差异来提高触摸面板的可视性。 解决方案：在透明电极片上形成有在透明支撑体上进行图案化的电极，反射色度b
1 * 在远离透明支撑体的一侧的电极表面的反射色度b 2 靠近透明支撑体的一侧的电极表面的电位/ SP>等于或小于2（¾▵¾¾¾¾¾¾¾¾¾¾“”“”“”“”“”“”“”“ > 1 * -b 2 * ¾≤2 ）。 版权所有（C）2013，JPO＆INPIT
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