Abstract:
PROBLEM TO BE SOLVED: To easily form a lead into an optional shape during bending of leads and to prevent separation of the surface of external plated lead or peeling thereof. SOLUTION: A lead forming apparatus 100 has a function of bending leads of a semiconductor device having leads into a gull wing shape. The lead forming apparatus 100 includes: lead bending dies (first lead bending die 102 and a second lead bending die 108), as a lower die, allowing thereon placement of the semiconductor device 200 and accepting the leads in the bending leads; a lead bending punch 150, as an upper die, descending towards the lead bending die so as to move the leads 202 of the semiconductor device 200 towards the lead bending die, to thereby bend the leads into a gull wing shape; and a first stopper 120 specifying the bottom dead center of the lead bending punch 150, so as to ensure a distance not smaller than thickness of the leads between the bottom surface of the lead bending punch 150 and the top surface of a portion, allowing thereon placement of the leads, of the lead bending die. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To execute a fine inspection of a highly integrated device by forming a guide hole with a narrower pitch than before in a support plate of the same area in a probe card and raising a flexibility of selection of an elastic member for energizing a probe pin. SOLUTION: The probe pin 11 having an elastic part 13 and a pin part 12 is inserted in a guide hole 5 of the support plate 3, the tip end of the pin part 12 projects downward the support plate 3 and the upper end of the elastic part 13 contacts the contact part 2a of a circuit board. The guide hole 5 has a horizontal cross section geometry of rectangular. As guide holes with narrower pitches than in the case of conventional guide holes with a circular horizontal cross section geometry can be formed in the same area of the support plate 3, the probe pins can be installed with narrower pitches. For the elastic member, it is not necessary to use a coil spring. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a male type terminal fitting, which can secure degree of flatness between a substrate part and a bent-and-folded part and has cheap material cost. SOLUTION: The male type terminal fitting 10 is constituted with a board-like contact part 11 connected with one side of the partner female type terminal fitting, a connection part 12 to which an electric wire terminal is connected at another side, a base plate part 14 of a shape of a long plate, which the plate-like contact part 11 has been extended from the connection part 12, and the bent-and-folded plate, which has been bent and folded on the base plate part 15, which has been extended from the one side of the width direction of this base plate part 14. Further, it has a flatness securing plate part 16, which secures the flatness condition of the base plate part 14 and the bent-and- folded plate part 15, by being extended from the another side of the width direction of the base plate part 14, and by being folded on between the base plate part 14 and the bent-and-folded plate part 15.
Abstract:
The present invention relates to a contact clip which may be attached to a ceramic or other type substrate and which may be plugged into a PCB and thereby provide electrical connections between the substrate and the conductive traces on the board. More particularly, the clip includes a receptacle for receiving the edge of a substrate for mechanical retention and electrical contact, a spring arm which protects the substrate from thermal and mechanical stresses, a low force pluggable pin section for insertion into a board's plated-through hole, and means establishing redundant short electrical paths between the pad on the substrate and the traces on the PCB.