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公开(公告)号：JP5471870B2
公开(公告)日：2014-04-16
申请号：JP2010138127
申请日：2010-06-17
Applicant: 富士通株式会社
CPC classification number: H05K1/0248 , H05K1/024 , H05K1/0245 , H05K1/0269 , H05K1/0366 , H05K2201/029 , H05K2201/09272 , H05K2203/166 , H05K2203/167
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公开(公告)号：JP4500348B2
公开(公告)日：2010-07-14
申请号：JP2007503509
申请日：2005-02-15
Applicant: 富士通株式会社
Inventor： 義裕 森田
CPC classification number: H05K1/0271 , H01L23/16 , H01L24/81 , H01L2224/16 , H01L2224/16225 , H01L2224/8121 , H01L2224/81815 , H01L2924/01004 , H01L2924/01019 , H01L2924/01322 , H01L2924/15311 , H01L2924/3511 , H05K3/0061 , H05K2201/0338 , H05K2201/068 , H05K2201/10598 , H05K2201/10734 , H05K2201/2009
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公开(公告)号：JP5299201B2
公开(公告)日：2013-09-25
申请号：JP2009226189
申请日：2009-09-30
Applicant: 富士通株式会社
IPC: H05K1/02
CPC classification number: H05K1/025 , H05K1/024 , H05K1/0248 , H05K1/0366 , H05K3/0052 , H05K2201/029
Abstract: A printed board includes an insulating body (11) that has a flat surface and includes insulating cloth (111) including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring (12) including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body (11) and a predetermined delay-time difference between the signal lines.
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公开(公告)号：JPWO2004012488A1
公开(公告)日：2005-11-24
申请号：JP2004524078
申请日：2002-07-25
Applicant: 富士通株式会社
CPC classification number: H05K1/028 , H01L2224/16225 , H01L2924/00014 , H01R12/714 , H05K1/147 , H05K3/103 , H05K3/4691 , H05K2201/0394 , H05K2201/044 , H05K2201/10189 , H05K2201/10287 , Y10T29/49169 , Y10T29/49194 , H01L2224/0401
Abstract: 伝送損失の少ない新規かつ有効な回路基板及びその製造方法が提供される。第1及び第2の基板(110,130)と、前記第1及び第2の基板を電気的に接続し、外部に露出する複数のワイヤ(120)とを有することを特徴とするマルチワイヤ基板(100)が提供される。かかるマルチワイヤ基板は、ワイヤにおいて第1及び第2の基板が任意の角度に折り曲げ可能である。リジッドフレキシブル基板のフレックス部の配線よりも表面が滑らかなワイヤを使うので、表皮効果の影響を受けず、また、円は矩形よりも大きな断面積を得ることができるので高速伝送を達成することができる。
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Patent Agency Ranking
公开(公告)号：JP3634159B2
公开(公告)日：2005-03-30
申请号：JP22588398
申请日：1998-08-10
Applicant: 富士通株式会社
CPC classification number: H05K3/3494 , H05K1/0271 , H05K7/1461 , H05K2201/2009 , H05K2201/2018 , H05K2203/087
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公开(公告)号：JP4814035B2
公开(公告)日：2011-11-09
申请号：JP2006255083
申请日：2006-09-20
Applicant: 富士通株式会社
Inventor： 義裕 森田
IPC: H01R33/76
CPC classification number: H05K1/0231 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01R13/2414 , H05K3/0058 , H05K3/325 , H05K2201/0314 , H05K2201/10515 , H05K2201/10719 , H05K2201/2009 , H01L2924/00
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公开(公告)号：JP4500347B2
公开(公告)日：2010-07-14
申请号：JP2007501470
申请日：2005-02-02
Applicant: 富士通株式会社
Inventor： 義裕 森田
CPC classification number: H05K1/0271 , H01L2224/16225 , H01L2924/00014 , H01L2924/15311 , H05K3/0058 , H05K2201/10409 , H05K2201/10734 , H05K2201/2009 , H01L2224/0401
Abstract: A package mounted module wherein a package board on the topside surface of which a semiconductor chip such as an LSI is mounted is further mounted on the topside surface of the motherboard of a large-scale computing machine such as a large-sized computer, and a stiffener is provided on the underside surface of the motherboard. In order to improve the reliability of solder bonding, a stiffener is fixed to the motherboard with screws at plural locations on the periphery of the stiffener and is also fixed to the motherboard with a screw in the central part of the stiffener.
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