摘要:
PROBLEM TO BE SOLVED: To obtain superb high speed signal characteristics of a connection terminal for connecting a multilayer substrate with a multilayer substrate. SOLUTION: A lead terminal 100 includes a signal lead pin 200 and a GND lead pin 250, and the signal lead pin 200 connects a signal pattern 310 of a flexible substrate 300 with a signal pattern 410 of a rigid substrate 400. The GND lead pin 250 connects a GND pattern 330 of the flexible substrate 300 with a GND pattern 420 of the rigid substrate 400. A holder 110 is insulative and holds the signal lead pin 200 and the GND lead pin 250 with a space as a pair. A main part 230 of the signal lead pin 200 and a main part 280 of the GND lead pin 250 forms a microstrip structure MS2. COPYRIGHT: (C)2011,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To make an optical device compact while keeping the high-frequency characteristics. SOLUTION: An optical transmitter 100 comprises a light output portion 112 and an electric input portion 111a which are disposed in a housing 110. A driving circuit 120 is disposed in correspondence to the electric input portion 111a in the housing 110, while a light emitting element 130 is disposed in correspondence to the light output portion 112 in the housing 110. A flexible substrate 140 has a signal line 140a for connecting the driving circuit 120 and the light emitting element 130 while maintaining the characteristic impedance. The flexible substrate 140 has a cutout portion between the driving circuit 120 and the light emitting element 130. COPYRIGHT: (C)2008,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To improve the characteristics of high speed signal transmissions between multilayer boards. SOLUTION: A relay board 120 is the board that carries out the connection of a flexible board 130 to a printed circuit board 110. The relay board 120 has a predetermined thickness. A signal channel is introduced from a surface of the relay board 120 to the other surface thereof. A first electrode formed on a surface of the relay board 120 is connected to a signal line of the printed circuit board 110. A second electrode, formed on the other surface of the relay board 120, is connected to a signal line of the flexible board 130. The signal channel has a width, corresponding to the distance to a ground surface that is formed in response thereto. COPYRIGHT: (C)2008,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a driving method of an optical modulator, which enables long-distance transmission by effectively suppressing transmission waveform deterioration due to a wavelength dispersion characteristic of a transmission path, and an optical transmitter and an optical transmission system using the driving method. SOLUTION: An optical transmitter to which a driving method of an optical modulator is applied, includes an optical modulator 1 which generates an optical signal modulated in accordance with a data signal Din to send out the optical signal to the transmission path, and a driving apparatus 10 therefor, and the driving apparatus 10 comprises: a pattern detection circuit 11 which detects a "011" and a "110" in the data signal Din; a 2-bit delay circuit 12 which delays the data signal Din by 2 bits; a pulse width expansion circuit 13 which expands each pulse width in a second bit in the "011" and in the second bit in the "110" in a data signal D1 outputted from the 2-bit delay circuit 12, according to the pattern detection result of the pattern detection circuit 11; and a driving circuit 14 which drives the optical modulator 1 in accordance with the data signal in which the pulse width is expanded. COPYRIGHT: (C)2006,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To attain stable burst optical transmission with a simple configuration with respect to a burst optical transmission circuit that converts burst data into an optical signal and transmits the converted signal. SOLUTION: The burst light transmission circuit is provided with a semiconductor laser 1, a photo diode 2 that monitors its optical output, a current/voltage conversion circuit 3 that converts an output current of the photo diode 2 into a voltage, an APC amplifier 4, a latch circuit 7 that latches an output signal from the APC amplifier 4 to obtain a current control signal, and a drive circuit 5 that supplies a drive current to the semiconductor laser 1 corresponding to the current control signal from the latch circuit 7 and data DATA received in terms of burst., and also with a data interruption detection circuit 6 that detects interruption of the data DATA to output a reset signal. The current control signal latched in the latch circuit 7 is reset by this reset signal.
摘要:
PURPOSE:To stabilize the optical output of a semiconductor laser element with a simple circuit, by controlling each driving current according to the emission light of any one of semiconductor laser elements. CONSTITUTION:A photodiode 2 receives the optical output of an element out of semiconductor elements 11, 12,..., 1n constitution an integrated type semiconductor laser array 1, and converts it into a photo current. A current-voltage conversion part 3 converts the photo current into a voltage, and generates a signal showing the optical output level of the semiconductor laser element 11. A voltage distribution part 4 distributes the optical output level signal to the respective semiconductor laser elements 11, 12,..., 1n. In a driving signal setting part 5, each of the driving signal setting unit 51, 52,Sv, 5n generates in accordance with a distributed voltage a control signal for setting a driving current for each semiconductor laser element. Corresponding with the control signal, driving circuits 61, 62,..., 6n generate the respective driving currents, and drive a plurality of the corresponding semiconductor laser elements.
摘要:
PROBLEM TO BE SOLVED: To provide a substrate and an IC socket such that connection places are decreased, an IC and substrate are connected without spoiling high frequency characteristics, and a mounting space is reduced.SOLUTION: A substrate includes an IC package and an IC socket on which the IC package is mounted, and the IC socket includes another substrate which has a step having a first surface and a second surface opposed to the substrate, and is positioned between the second surface and the substrate. The IC socket and the another substrate are connected together on the second surface and the IC socket and the substrate are connected together on the first surface.
摘要:
PROBLEM TO BE SOLVED: To effectively perform deskew without using any complicated encoding system even when great skew occurs. SOLUTION: A skew detection processing unit 205 of a reception apparatus 200 detects skew S between synchronizing symbols of two different wavelengths among synchronizing symbols included in reception signals, a skew rough adjustment amount calculation processing unit 206 calculates a delay compensation amount of the reception signals based on the detected skew S and delay characteristics of the signals in a transmission line, and a variable delay processing unit 207a performs deskew on the reception signals based on the calculated delay compensation amount. COPYRIGHT: (C)2008,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a surface mounting electronic component package capable of realizing signal transmission with less transmission loss and high cutoff frequency. SOLUTION: The electronic component package equipped with a dielectric substrate 11 provided on the top surface thereof with an electronic component 12 sealed therein, includes a first signal line 15 connected to the electronic component 12 and a first earth conductor 13 formed on the top surface of the dielectric substrate 11, and includes a second signal line 19 connected with an external connection electrode 20 and a second earth conductor 16 formed on the lower surface of the dielectric substrate 11. The first earth conductor 13 and the second earth conductor 16 are connected via an earth conductor via hole 26, and an in-substrate signal line 21 connected with the first signal line 15 and the second signal line 19 is surrounded by the first earth conductor 13 and the second earth conductor 16 vertically and by the earth conductor via hole 26 laterally, and is provided in the dielectric substrate 11. COPYRIGHT: (C)2008,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide an optical receiving circuit with an inexpensive configuration capable of demodulating a high-speed RZ-DPSK signal with high sensitivity. SOLUTION: The received RZ-DPSK signal is led to an interferometer 11. The interferometer 11 is provided at its upper arm 11a with a 1-bit delay element 11c. A balanced photodiode 12 converts a set of optical signals outputted from the interferometer 11 into electric signals. A high pass filter 13 has a cut-off frequency nearly equal to a value represented by a bit rate of transmission data and filters a signal outputted from the balanced photodiode 12. A BPSK demodulation circuit 14 demodulates an output signal from the high pass filter 13. COPYRIGHT: (C)2007,JPO&INPIT