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公开(公告)号：JP2018191011A
公开(公告)日：2018-11-29
申请号：JP2018166209
申请日：2018-09-05
申请人： ローム株式会社
IPC分类号： H01L25/07 , H01L25/18 , H01L25/065
CPC分类号： H01L23/49568 , H01L21/4825 , H01L21/4842 , H01L21/4882 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/3142 , H01L23/36 , H01L23/3675 , H01L23/4334 , H01L23/49503 , H01L23/4952 , H01L23/49541 , H01L23/49551 , H01L23/49555 , H01L23/49575 , H01L23/49586 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L25/0655 , H01L25/50 , H01L2224/05599 , H01L2224/291 , H01L2224/32245 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/49173 , H01L2224/49175 , H01L2224/49177 , H01L2224/73265 , H01L2224/83192 , H01L2224/8385 , H01L2224/85 , H01L2224/85399 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/18301 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： 【課題】 平面視において小型化を図ることができる半導体装置を提供すること。 【解決手段】 本開示の半導体装置は、第1面と、前記第1面と反対側を向く第2面と、を有する第1の電極と、前記第1の電極の前記第1面上に形成された第1のMOSチップと、前記第1の電極の前記第2面上に形成された前記第1のMOSチップの動作を制御する制御ICと、前記第1のMOSチップと、前記制御ICと、前記第1の電極の少なくとも一部と、を覆い、且つ前記第1の電極の前記一部とは異なる他の部分を露出させる樹脂と、を有する。 【選択図】 図56
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公开(公告)号：JP2018186312A
公开(公告)日：2018-11-22
申请号：JP2018164721
申请日：2018-09-03
申请人： ローム株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , B23K20/005 , B23K20/10 , B23K20/24 , H01L21/56 , H01L23/3107 , H01L23/49503 , H01L23/49513 , H01L23/4952 , H01L23/49548 , H01L23/49582 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/83 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48451 , H01L2224/48453 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48507 , H01L2224/48624 , H01L2224/48639 , H01L2224/48724 , H01L2224/48739 , H01L2224/48747 , H01L2224/48824 , H01L2224/48839 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/78303 , H01L2224/78307 , H01L2224/78309 , H01L2224/83 , H01L2224/8314 , H01L2224/83192 , H01L2224/83439 , H01L2224/838 , H01L2224/85 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85439 , H01L2224/8592 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00012 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01066 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01204 , H01L2924/01205 , H01L2924/01206 , H01L2924/013 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/05442 , H01L2924/0665 , H01L2924/10162 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19107 , H01L2924/20752 , H01L2924/20757 , H01L2924/3512 , H01L2924/01026 , H01L2924/00 , H01L2924/2076 , H01L2924/207 , H01L2924/20753 , H01L2924/20756 , H01L2924/20758 , H01L2924/00015
摘要： 【課題】パッドに対する銅ワイヤの良好な接合を達成することができる、ワイヤボンディング方法を提供する。 【解決手段】半導体装置は、配線層と、前記配線層を覆う層間絶縁層と、前記層間絶縁層を覆うアルミ電極パッドと、前記アルミ電極パッドの周縁端部を覆う保護膜と、平面視において、前記アルミ電極パッドの周縁端部の内方に位置し、当該周縁端部に沿って前記アルミ電極パッドの表面に形成された複数の凹部と、前記アルミ電極パッドに接続された銅ボンディングワイヤと、を備え、前記銅ボンディングワイヤと前記アルミ電極パッドの接触界面の終端が、平面視において前記複数の凹部の内方に位置する箇所と、前記凹部の外方に位置する箇所とを備える。 【選択図】図133
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公开(公告)号：JP6418625B2
公开(公告)日：2018-11-07
申请号：JP2013258660
申请日：2013-12-13
申请人： 東芝メモリ株式会社
CPC分类号： H01L23/552 , H01L21/561 , H01L23/295 , H01L23/3128 , H01L23/544 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06537 , H01L2225/06562 , H01L2924/00014 , H01L2924/12042 , H01L2924/1438 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/1815 , H01L2224/85 , H01L2224/32225 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号：JP6391930B2
公开(公告)日：2018-09-19
申请号：JP2013234825
申请日：2013-11-13
发明人： デイビッド・クン , ディビッド・マイケル・ヒュー・マシューズ , バル・バラクリシュナン
IPC分类号： H01L23/50
CPC分类号： H01L23/552 , H01L23/3114 , H01L23/48 , H01L23/49503 , H01L23/4952 , H01L23/49541 , H01L23/49575 , H01L23/5227 , H01L24/48 , H01L27/0248 , H01L28/10 , H01L2224/05554 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014 , H04B15/005 , H05K7/14 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号：JP6380561B2
公开(公告)日：2018-08-29
申请号：JP2016573313
申请日：2016-01-28
申请人： 株式会社村田製作所
CPC分类号： H01L23/28 , H01L23/3735 , H01L23/49531 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L23/49811 , H01L23/5385 , H01L24/29 , H01L24/33 , H01L24/45 , H01L24/48 , H01L25/07 , H01L25/18 , H01L2224/29101 , H01L2224/33 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/014 , H01L2924/00012 , H01L2924/00
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公开(公告)号：JP6377981B2
公开(公告)日：2018-08-22
申请号：JP2014143164
申请日：2014-07-11
申请人： ローム株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/05 , H01L23/3171 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2224/02166 , H01L2224/04042 , H01L2224/05083 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/05664 , H01L2224/32245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48451 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/78306 , H01L2224/85181 , H01L2224/85439 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
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公开(公告)号：JP6368646B2
公开(公告)日：2018-08-01
申请号：JP2014536839
申请日：2013-09-13
申请人： ローム株式会社
发明人： 花田 俊雄
IPC分类号： H01L25/18 , H01L23/48 , H01L21/56 , H01L23/29 , H01L23/31 , B29C33/12 , B29C45/02 , H01L25/07
CPC分类号： H01L23/482 , H01L21/50 , H01L21/565 , H01L23/3107 , H01L23/3735 , H01L23/49811 , H01L23/49844 , H01L23/538 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/07 , H01L25/072 , H01L25/115 , H01L25/18 , H01L2224/04042 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45015 , H01L2224/48227 , H01L2224/49113 , H01L2224/73215 , H01L2224/73265 , H01L2224/92247 , H01L2924/00012 , H01L2924/00014 , H01L2924/10272 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/207 , H01L2924/30107 , H02M7/003 , H01L2924/00 , H01L2224/45099
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公开(公告)号：JP6361560B2
公开(公告)日：2018-07-25
申请号：JP2015080354
申请日：2015-04-09
申请人： 豊田合成株式会社
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L33/486 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/78301 , H01L2224/85181 , H01L2224/85424 , H01L2224/85447 , H01L2924/00014 , H01L2924/12041 , H01L2924/15724 , H01L2924/15747 , H01L2933/0066 , H01L2224/45099 , H01L2924/20752 , H01L2924/00012 , H01L2224/05599 , H01L2924/00
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公开(公告)号：JP6330658B2
公开(公告)日：2018-05-30
申请号：JP2014506003
申请日：2013-03-12
申请人： 住友ベークライト株式会社
发明人： 伊藤 慎吾
IPC分类号： H01L21/60
CPC分类号： H01L23/49575 , H01L21/56 , H01L23/293 , H01L23/3107 , H01L23/4952 , H01L23/49582 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05166 , H01L2224/05624 , H01L2224/32245 , H01L2224/4321 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48451 , H01L2224/48465 , H01L2224/48624 , H01L2224/48824 , H01L2224/73265 , H01L2224/83101 , H01L2224/83862 , H01L2224/85205 , H01L2224/85948 , H01L2224/92247 , H01L2924/00011 , H01L2924/181 , H01L2924/00012 , H01L2924/20106 , H01L2924/01201 , H01L2924/01203 , H01L2924/01202 , H01L2924/01046 , H01L2924/01078 , H01L2924/078 , H01L2924/00014 , H01L2924/01029 , H01L2924/01014 , H01L2924/01056 , H01L2924/0102 , H01L2924/01038 , H01L2924/01004 , H01L2924/01013 , H01L2924/01105 , H01L2924/00 , H01L2924/00015 , H01L2924/013 , H01L2224/45664 , H01L2924/01005 , H01L2924/01033
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公开(公告)号：JP2018078297A
公开(公告)日：2018-05-17
申请号：JP2017228996
申请日：2017-11-29
申请人： 日鉄住金マイクロメタル株式会社 , 新日鉄住金マテリアルズ株式会社
CPC分类号： B23K35/0227 , B23K35/3013 , B23K35/302 , B23K2101/40 , B32B15/00 , B32B15/01 , B32B15/018 , C22C5/04 , C22C9/00 , C22C9/04 , C22C9/06 , C23C30/00 , C23C30/005 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/43 , H01L2224/4312 , H01L2224/43125 , H01L2224/4321 , H01L2224/4382 , H01L2224/43848 , H01L2224/43986 , H01L2224/45 , H01L2224/45005 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45118 , H01L2224/4512 , H01L2224/45147 , H01L2224/45155 , H01L2224/45169 , H01L2224/45173 , H01L2224/45178 , H01L2224/45541 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48824 , H01L2224/78 , H01L2224/78251 , H01L2224/85 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85444 , H01L2224/85464 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/0102 , H01L2924/01032 , H01L2924/01033 , H01L2924/01034 , H01L2924/01052 , H01L2924/01057 , H01L2924/0665 , H01L2924/0705 , H01L2924/10253 , H01L2924/186 , Y10T428/12868 , Y10T428/12875 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/2495 , Y10T428/24967 , Y10T428/265 , H01L2924/01028 , H01L2924/0103 , H01L2924/01045 , H01L2924/01049 , H01L2924/01077 , H01L2924/01078 , H01L2924/01031 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/01079 , H01L2924/01046 , H01L2924/01029 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204 , H01L2924/00015 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/20752 , H01L2924/00014 , H01L2924/01014 , H01L2924/013 , H01L2924/00013 , H01L2924/20105 , H01L2924/01001 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/01027 , H01L2924/01047 , H01L2924/01013
摘要： 【課題】Cu合金芯材とその表面に形成されたPd被覆層とを有する半導体装置用ボンディングワイヤにおいて、高温におけるボール接合部の接合信頼性向上と、耐力比(=最大耐力/0.2%耐力):1.1〜1.6の両立を図る。 【解決手段】ワイヤ中に高温環境下における接続信頼性を付与する元素を含むことによって高温におけるボール接合部の接合信頼性を向上し、さらにボンディングワイヤのワイヤ軸に垂直方向の芯材断面に対して結晶方位を測定した結果において、ワイヤ長手方向の結晶方位のうち、ワイヤ長手方向に対して角度差が15度以下である結晶方位 の方位比率を30%以上とし、ボンディングワイヤのワイヤ軸に垂直方向の芯材断面における平均結晶粒径を0.9〜1.5μmとすることにより、耐力比を1.6以下とする。 【選択図】なし
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4890 条记录 (耗时 0.045 秒)
