公开(公告)号：JP2007264609A

公开(公告)日：2007-10-11

申请号：JP2007043512

申请日：2007-02-23

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： MORISUE MASAFUMI ,  JINBO YASUHIRO ,  FUJII ITSUKI ,  KIMURA HAJIME

IPC: G09F9/30 ,  G09F9/00 ,  H01L21/02 ,  H01L27/12

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in high yield without damaging a layered product, and a method for manufacturing an entirely thin, light-weight, and flexible semiconductor device in high yield. SOLUTION: The method for manufacturing a semiconductor device includes: forming a photocatalytic layer 102 and an organic compound layer 103 in contact with the photocatalytic layer, on a substrate having 101 a light transmitting property; forming an element forming layer on the substrate having the light transmitting property through the photocatalytic layer and the organic compound layer in contact with the photocatalytic layer; and separating the element forming layer from the substrate having the light transmitting property after the photocatalytic layer is irradiated with light through the substrate having the light transmitting property. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种以高产率制造半导体器件而不损坏层叠产品的方法，以及以高产率制造全部薄，重量轻且柔性的半导体器件的方法。 解决方案：制造半导体器件的方法包括：在具有101透光性的基板上形成光催化层102和与光催化层接触的有机化合物层103; 通过光催化层和与光催化层接触的有机化合物层在具有透光性的基板上形成元素形成层; 并且在通过具有透光性的基板用光照射光催化剂层之后，将元件形成层与具有透光性的基板分离。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007242604A

公开(公告)日：2007-09-20

申请号：JP2007029867

申请日：2007-02-09

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： YAMAZAKI SHUNPEI ,  FURUKAWA SHINOBU ,  MORISUE MASAFUMI ,  FUJII ITSUKI

IPC: H05B33/10 ,  H05B33/14

Abstract: PROBLEM TO BE SOLVED: To provide a display which exhibits high functionality including a lower power consumption and a higher light emitting efficiency, as well as high reliability. SOLUTION: The manufacturing method manufactures a light emitting element in a method of irradiating a light onto a luminous material, scattering the light irradiated luminous material into a solution containing a binder for forming a solution containing the light irradiated luminous material and the binder, forming a primary electrode layer, depositing the solution onto the primary electrode layer for forming a light emitting layer containing the light irradiated luminous material and the binder, and forming a secondary electrode layer on the light emitting layer. An insulating layer may be attached between the primary electrode layer and light emitting layer, or between the secondary electrode layer and light emitting layer. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有低功耗和更高发光效率以及高可靠性的高功能性的显示器。 解决方案：制造方法以将光照射到发光材料上的方法制造发光元件，将照射的光的发光体散射到含有用于形成包含光照射的发光材料和粘合剂的溶液的粘合剂的溶液中 形成初级电极层，将该溶液沉积在主电极层上，以形成含有照射光的发光材料和粘合剂的发光层，并在发光层上形成次级电极层。 绝缘层可以附着在主电极层和发光层之间，或者在次级电极层和发光层之间。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005311335A

公开(公告)日：2005-11-04

申请号：JP2005083179

申请日：2005-03-23

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： MORISUE MASAFUMI ,  FUJII ITSUKI

IPC: G02F1/1368 ,  H01L21/336 ,  H01L29/786 ,  H01L51/50 ,  H05B33/14

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film transistor in self-alignment by using a liquid drop discharging method regardless of the accuracy of the discharge position of a liquid drop discharging device. SOLUTION: An organic resin film 107 or the like are applied, and the organic resin film 107 is processed into a desired shape by using such a method as etch back, exposure, and development. A semiconductor layer 104 containing impurities of one conductive type is etched with the organic resin film having the desired shape as a mask. The organic resin film having the desired shape is used to form regions with different wettability. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种通过使用液滴排放方法制造自对准的薄膜晶体管的方法，而不管液滴排放装置的排放位置的精度如何。 解决方案：施加有机树脂膜107等，并且通过使用诸如回蚀，曝光和显影的方法将有机树脂膜107加工成所需的形状。 用具有所需形状的有机树脂膜作为掩模蚀刻包含一种导电类型的杂质的半导体层104。 使用具有所需形状的有机树脂膜形成具有不同润湿性的区域。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005136392A

公开(公告)日：2005-05-26

申请号：JP2004290571

申请日：2004-10-01

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： MARUYAMA JUNYA ,  TAKAYAMA TORU ,  MORISUE MASAFUMI ,  WATANABE RYOSUKE ,  SUGIYAMA EIJI ,  OKAZAKI SUSUMU ,  NISHI KAZUO ,  KOYAMA JUN ,  NAGATA TAKESHI ,  MATSUZAKI TAKANORI

IPC: H01L27/146 ,  H01L21/02 ,  H01L21/336 ,  H01L27/12 ,  H01L29/786 ,  H04N5/225 ,  H04N101/00

Abstract: PROBLEM TO BE SOLVED: To form multiple sensor elements in a limited amount of area and to reduce an area that the sensor elements occupy and accumulate so that higher output and smaller physical size of a sensor element can be realized in the future. SOLUTION: Higher output and smaller physical size are achieved by integrating an output amplifier circuit composed of TFT having a crystal structure semiconductor film (typically polysilicon film) with a sensor element using an amorphous semiconductor film (typically amorphous silicon film) on a heat-resistant plastic film substrate which can resist temperature at a time of packaging for solder reflow treatment and the like. Sensor elements strong against bending stress can be realized. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了在有限的面积上形成多个传感器元件并且减少传感器元件占据和积累的面积，使得将来可以实现传感器元件的更高输出和更小的物理尺寸。 解决方案：通过将由晶体结构半导体膜（通常为多晶硅膜）的TFT组成的输出放大器电路与使用非晶半导体膜（通常为非晶硅膜）的传感器元件集成在一起，实现更高的输出和更小的物理尺寸 可以抵抗用于焊料回流处理的包装时的温度等的耐热塑料膜基材。 可以实现抗弯曲应力的传感器元件。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2013084973A

公开(公告)日：2013-05-09

申请号：JP2012265200

申请日：2012-12-04

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： JINBO YASUHIRO ,  MORISUE MASAFUMI ,  KIMURA HAJIME ,  YAMAZAKI SHUNPEI

IPC: H01L21/02 ,  H01L21/20 ,  H01L21/336 ,  H01L27/12 ,  H01L29/786 ,  H01L51/50 ,  H05B33/02 ,  H05B33/10 ,  H05B33/14

CPC classification number: H01L21/6835 ,  G02F1/133305 ,  G02F1/133603 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/62 ,  H01L51/003 ,  H01L2221/68318 ,  H01L2221/68386

Abstract: PROBLEM TO BE SOLVED: To provide: a technique of manufacturing a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and a property before peeling are kept; and a technique of manufacturing even more reliable semiconductor devices and display devices with a high yield without complicating the devices or the processes.SOLUTION: An organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property. An element layer is formed over the organic compound layer including a photocatalyst substance. The organic compound layer including the photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate.

Abstract translation: 要解决的问题：提供：制造半导体器件的技术和使用剥离工艺的显示装置，其中可以以保持剥离之前的形状和性质保持的良好状态进行转印处理 ; 以及以高产率制造更可靠的半导体器件和显示器件而不使器件或工艺复杂化的技术。 解决方案：在具有透光性的第一基板上形成包含光催化剂物质的有机化合物层。 在包含光催化剂物质的有机化合物层上形成元件层。 对通过第一基板的光照射包含光催化剂物质的有机化合物层，从第一基板剥离元件层。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012234195A

公开(公告)日：2012-11-29

申请号：JP2012158299

申请日：2012-07-17

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： MORISUE MASAFUMI ,  JINBO YASUHIRO ,  FUJII ITSUKI ,  KIMURA HAJIME

IPC: G02F1/13357 ,  H01L33/62

CPC classification number: H01L51/56 ,  G02F1/133305 ,  G02F1/133345 ,  G02F1/133711 ,  G02F1/133734 ,  G02F1/133784 ,  G02F1/13394 ,  G02F1/167 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/3244 ,  H01L27/3272 ,  H01L29/78603 ,  H01L29/78633 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/1896 ,  H01L51/003 ,  H01L2227/326 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device with high yield without damaging a laminate, and provide a method for manufacturing an overall thin, lightweight, and flexible semiconductor device with high yield.SOLUTION: A manufacturing method for a semiconductor device includes: forming a photocatalyst layer and an organic compound layer in contact with the photocatalyst layer on a light-transmitting substrate; forming an element formation layer on the light-transmitting substrate via the photocatalyst layer and the organic compound layer in contact with the photocatalyst layer; irradiating the photocatalyst layer with light via the light-transmitting substrate; and separating the element formation layer from the light-transmitting substrate.

Abstract translation: 要解决的问题：提供一种半导体器件的制造方法，其高产率而不损坏层压体，并且提供一种以高产率制造整体薄，轻量且柔性的半导体器件的方法。 解决方案：半导体器件的制造方法包括：在透光性基板上形成与光催化剂层接触的光催化剂层和有机化合物层; 在所述光透射性基板上经由所述光催化剂层和与所述光催化剂层接触的有机化合物层形成元素形成层; 通过透光基板用光照射光催化剂层; 并且将元件形成层与透光衬底分离。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2008124445A

公开(公告)日：2008-05-29

申请号：JP2007267546

申请日：2007-10-15

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： MORISUE MASAFUMI

IPC: H01L29/786 ,  G02F1/1343 ,  G02F1/1368 ,  G09F9/00 ,  H01L21/28 ,  H01L21/288 ,  H01L21/3205 ,  H01L21/336 ,  H01L23/52 ,  H01L29/417 ,  H01L51/05 ,  H01L51/40 ,  H01L51/50 ,  H05B33/10 ,  H05B33/14

CPC classification number: H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01051

Abstract: PROBLEM TO BE SOLVED: To provide a method for easily forming a region with conductivity and high wettability without a step for removing a photocatalytic reaction layer, which is formed over a conductive layer. SOLUTION: The photocatalytic reaction layer is formed over a photocatalytic conductive layer, and the photocatalytic conductive layer is irradiated with ultraviolet light to form a region with conductivity and higher wettability than the photocatalytic reaction layer on a surface of the photocatalytic conductive layer which is irradiated with ultraviolet light, wherein as the photocatalytic conductive layer, a layer having a photocatalytic property of which resistivity is ≤1×10 -2 Ωcm can be used. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种容易地形成具有导电性和高润湿性的区域的方法，而没有除去形成在导电层上的光催化反应层的步骤。 解决方案：光催化反应层形成在光催化导电层上，光催化导电层用紫外光照射以形成具有比光催化反应层在光催化导电层表面的导电性和较高润湿性的区域， 用紫外线照射，其中作为光催化导电层，可以使用电阻率为≤1×10 -2 Ωcm的具有光催化性质的层。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007059925A

公开(公告)日：2007-03-08

申请号：JP2006260488

申请日：2006-09-26

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： ISA TOSHIYUKI ,  MORISUE MASAFUMI ,  KAWAMATA IKUKO

IPC: H01L21/3205 ,  G02F1/1343 ,  G02F1/1368 ,  H01L21/288 ,  H01L29/786 ,  H01L51/50

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device in which a pattern of wiring is manufactured by improving a use efficiency of a material and simplifying a manufacturing step, and a technique capable of forming the pattern of wiring in a desired shape and with good controllability. SOLUTION: There is provided a semiconductor device having a pattern formed by discharging a plurality of first droplets composed of a composition including a pattern material so as to have a center on a first line, and discharging a plurality of second droplets between the first droplets so as to have a center on a second line. The first line and the second line have a constant distance, and therefore a side edge of the pattern has a wave-like shape. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 解决的问题：提供一种半导体器件，其中通过提高材料的使用效率并简化制造步骤来制造布线图案，以及能够形成所需形状的布线图案的技术，以及 具有良好的可控性。 解决方案：提供了一种半导体器件，其具有通过将由包括图案材料的组合物组成的多个第一液滴排出以在第一线上具有中心而形成的图案，并且在多个第二液滴之间排出多个第二液滴 第一液滴，以便在第二线上具有中心。 第一行和第二行具有恒定的距离，因此图案的侧边缘具有波状形状。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006237586A

公开(公告)日：2006-09-07

申请号：JP2006017033

申请日：2006-01-26

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： ISA TOSHIYUKI ,  FUJII ITSUKI ,  MORISUE MASAFUMI ,  KAWAMATA IKUKO

IPC: H01L21/3205 ,  B05D1/26 ,  B05D7/00 ,  H01L21/288 ,  H01L21/336 ,  H01L29/417 ,  H01L29/423 ,  H01L29/49 ,  H01L29/786

CPC classification number: H01L29/7869

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which is manufactured by simplifying the manufacturing process while enhancing utilization efficiency of material, and also to provide a display, its manufacturing technology, and a technique for forming the wiring pattern constituting these semiconductor devices and the display with desired profile and high controllability. SOLUTION: Conductor layers having nodes are formed adjacently at a uniform interval. In the adjacent conductive layers, a liquid drop is ejected while shifting the central position in the length direction of wiring not to be aligned in the line width direction. Since the center of a liquid drop is shifted, maximum line width parts (maximum node) of the conductive layers do not adjoin and the conductive layers can be provided adjacently at a narrower interval. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决的问题：提供通过简化制造工艺同时提高材料的利用效率而制造的半导体器件，以及提供显示器，其制造技术和形成构成这些半导体的布线图案的技术 设备和具有所需轮廓和高可控性的显示器。 解决方案：具有节点的导体层以均匀的间隔相邻形成。 在相邻的导电层中，在沿着布线的长度方向的中心位置沿线宽方向偏移的同时排出液滴。 由于液滴的中心偏移，所以导电层的最大线宽部分（最大节点）不邻接，并且可以以更窄的间隔相邻地设置导电层。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006196883A

公开(公告)日：2006-07-27

申请号：JP2005361964

申请日：2005-12-15

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： FUJII ITSUKI ,  MORISUE MASAFUMI ,  SHOJI HIRONOBU ,  MARUYAMA JUNYA ,  ORIKI KOJI ,  AOKI TOMOYUKI

IPC: H01F41/04 ,  H01L21/3205

Abstract: PROBLEM TO BE SOLVED: To provide the method of forming a substrate which has a conductive layer capable of controlling a space between adjacent conductive layers, which is capable of controlling the width and the thickness of the conductive layer, and which has the thick conductive layer whose width is small in particular. SOLUTION: The method of manufacturing a substrate 100 having a conductive layer forms the conductive layer 121 by forming an inorganic insulating layer 101 on a substrate, forming an organic resin layer having a desired profile on the inorganic insulating layer 101, forming a layer 102 in which the wetness of a composition having a conductive particle is low on the first exposed portion of the inorganic insulating layer, removing the organic resin layer, and then applying and calcinating the composition having the conductive particle on the second exposed portion of the inorganic insulating layer. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种形成基板的方法，该基板具有能够控制相邻导电层之间的空间的导电层，其能够控制导电层的宽度和厚度，并且具有 特别是宽度小的厚导电层。 解决方案：制造具有导电层的基板100的方法通过在基板上形成无机绝缘层101形成导电层121，在无机绝缘层101上形成具有期望外形的有机树脂层，形成 层102，其中在无机绝缘层的第一暴露部分上具有导电颗粒的组合物的湿度低，去除有机树脂层，然后在第二暴露部分上施加和煅烧具有导电颗粒的组合物 无机绝缘层。 版权所有（C）2006，JPO＆NCIPI