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公开(公告)号：JP6213585B2
公开(公告)日：2017-10-18
申请号：JP2016019158
申请日：2016-02-03
Applicant: 三菱ケミカル株式会社
CPC classification number: C09K11/7774 , C09K11/7721 , C09K11/7734 , C09K11/7735 , C09K11/7738 , C09K11/774 , C09K11/7775 , C09K11/7781 , C09K11/7789 , C09K11/7794 , C09K11/7795 , H01L24/17 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L23/24 , H01L23/293 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L33/507 , H01L33/54 , H01L33/58
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公开(公告)号：JP6060259B2
公开(公告)日：2017-01-11
申请号：JP2015523223
申请日：2013-07-17
Applicant: インテマティックス・コーポレーション , INTEMATIX CORPORATION
Inventor： デェジェ タオ , イー−チュイン リー
CPC classification number: C09K11/7734 , C09K11/774 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L33/504
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3.发明专利Member formation fluid for semiconductor device, member for semiconductor device and semiconductor light-emitting device 有权用于半导体器件的成员流体，半导体器件和半导体发光器件的部件
公开(公告)号：JP2014027295A
公开(公告)日：2014-02-06
申请号：JP2013206246
申请日：2013-10-01
Applicant: Mitsubishi Chemicals Corp , 三菱化学株式会社
Inventor： KATO HANAKO , MORI HIROSHI , KOBAYASHI HIROSHI , TOMURA TSUBASA
IPC: H01L33/56 , C08G77/14 , H01L23/08 , H01L23/29 , H01L23/31 , H01L33/32 , H01L33/48 , H01L33/50 , H01L33/62
CPC classification number: C09K11/7774 , C09K11/7721 , C09K11/7734 , C09K11/7735 , C09K11/7738 , C09K11/774 , C09K11/7775 , C09K11/7781 , C09K11/7789 , C09K11/7794 , C09K11/7795 , H01L23/24 , H01L23/293 , H01L24/17 , H01L33/507 , H01L33/54 , H01L33/58 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To provide a member for a semiconductor device which improves heat resistance, light resistance, film forming property and adhesion and is capable of sealing the semiconductor device without being cracked or exfoliated.SOLUTION: According to a method (I), heating weight reduction is 50 wt% or less and according to a method (II), an exfoliation rate is 30% or less. The method (I) includes: using 10 mg of fragments of the member; and measuring the weight reduction by means of a heating weight reduction/differential heat measuring device through heating from 35°C to 500°C under circulation of air at 200 ml/minute and at a temperature elevation speed of 10°C/minute. The method (II) includes: dripping and hardening a formation fluid into a copper cup in which the diameter is 9 mm and the depth of a recess is 1 mm and which has a surface plated with silver to obtain the member for the semiconductor device; absorbing moisture from the member for 20 hours in the temperature of 85°C and the humidity of 85%; holding the moisture absorbed member for 10 sec in the temperature of 260°C after the temperature is elevated from the room temperature to 260°C for 50 sec; cooling the member to the room temperature; observing whether the member is exfoliated from the cup; implementing such operations for each of ten members; and calculating an exfoliation rate.
Abstract translation: 要解决的问题：提供一种提高耐热性，耐光性，成膜性和粘合性的半导体装置的构件，能够密封半导体装置而不会破裂或剥离。解决方案：根据方法（I）， 加热重量减少为50重量％以下，根据方法（II），剥离率为30％以下。 方法（I）包括：使用10mg成员的片段; 并通过加热重量减少/差热测量装置通过以200ml /分钟的循环和10℃/分钟的升温速度在35℃至500℃下加热来测量重量减轻。 方法（II）包括：将地层流体滴加并硬化成直径为9mm的铜杯，凹槽的深度为1mm，并且具有镀银的表面以获得半导体器件的构件; 在85℃的温度和85％的湿度下从构件吸收湿气20小时; 在温度从室温升高到260℃后，保持吸湿构件在260℃的温度下持续10秒，持续50秒; 将构件冷却至室温; 观察成员是否从杯子脱落; 对十名成员中的每一名执行此类操作; 并计算剥脱率。
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公开(公告)号：JP2012235140A
公开(公告)日：2012-11-29
申请号：JP2012149687
申请日：2012-07-03
Applicant: Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh , パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツングPatent−Treuhand−Gesellschaft fuer elektrische Gluehlampen mbH , Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： DIETER BOKOR , ELLENS ANDRIES , HUBER GUENTHER DIPL ING , ZWASCHKA FRANZ , JERMANN FRANK , MANFRED KOBUSCH , MICHAEL OSTERTAG , ROSSNER WOLFGANG
IPC: C09K11/08 , H01L33/50 , C09K11/56 , C09K11/59 , C09K11/62 , C09K11/64 , C09K11/70 , C09K11/72 , C09K11/80 , C09K11/88 , F21S2/00 , F21Y101/02
CPC classification number: H01L33/504 , C09K11/0883 , C09K11/584 , C09K11/642 , C09K11/665 , C09K11/7733 , C09K11/7734 , C09K11/774 , C09K11/7774 , C09K11/778 , C09K11/7794 , C09K11/7796 , C09K11/886 , H01L33/502 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H05B33/14 , Y02B20/181 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an illumination unit comprising at least one LED as a light source which is distinguished by high efficiency.SOLUTION: An illumination unit is based on a luminescence conversion LED emitting primary radiation in the range from 370 to 430 nm of the optical spectral region (peak wavelength), this radiation being converted into radiation of a longer wavelength using three phosphors which emit blue, green and red light.
Abstract translation: 要解决的问题：提供一种包括至少一个LED作为光源的照明单元，其被高效率地区分开。 解决方案：照明单元基于发射光谱区域（峰值波长）的370至430nm范围内的主要辐射的发光转换LED，该辐射使用三种荧光体转换为更长波长的辐射，其中 发出蓝色，绿色和红色的光。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JPWO2009028656A1
公开(公告)日：2010-12-02
申请号：JP2009530201
申请日：2008-08-29
Applicant: 日亜化学工業株式会社
CPC classification number: H01L33/504 , C09K11/0883 , C09K11/7733 , C09K11/7734 , C09K11/774 , C09K11/7774 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H05B33/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 優れた色再性を有する発光装置を提供する。発光素子と、窒化物蛍光体より成る赤色蛍光体と、ハロシリケートより成る緑色蛍光体とを含み、発光スペクトルが440nm以上470nm以下の第1のピーク波長と、510nm以上550nm以下の第2のピーク波長と、630nm以上670nm以下の第3のピーク波長とを有し、前記第2のピーク波長と前記第3のピーク波長との間の最低相対発光強度値が、前記第2のピーク波長における相対発光強度値と前記第3のピーク波長における相対発光強度値とのいずれか低い方の値の80%以下であることを特徴とする発光装置である。
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Patent Agency Ranking
公开(公告)号：JP2010520334A
公开(公告)日：2010-06-10
申请号：JP2009552005
申请日：2008-02-13
Applicant: オスラム・シルバニア・インコーポレイテッド
Inventor： グレゴリー・エイ・マーキング , トーマス・エム・スナイダー
CPC classification number: C09K11/778 , C09K11/774
Abstract: 亜鉛、マグネシウム及びマンガンの水和六ホウ酸塩をＧｄ及びＣｅの酸化物群と一緒にして混合物を形成させ、この混合物を低還元性雰囲気中で焼成して蛍光体を生成させることを含む、赤色発光性のマンガン及びセリウム同時活性化ガドリニウムマグネシウム亜鉛五ホウ酸塩蛍光体の製造方法が記載される。 好ましくは、前記水和六ホウ酸塩は、(Ｚｎ，Ｍｇ，Ｍｎ)Ｂ
6 Ｏ
10 ・ＸＨ
2 Ｏ（ここで、Ｘは５．３〜６．２である）の近似組成を有する。-
7.发明专利
公开(公告)号：JP2009538387A
公开(公告)日：2009-11-05
申请号：JP2009512390
申请日：2007-05-25
Applicant: ダリアン ルーミングライト サイエンス アンド テクノロジー カンパニー リミテッド
Inventor： ウェイ シア， , ツィーグオ シャオ， , ジン シュー， , ギャンシュー リン， , シーフェン ワン，
CPC classification number: C09K11/774 , C09K11/7734 , C09K11/7792 , C09K11/7796 , C09K11/7797 , Y02B20/181
Abstract: The invention relates to an ultraviolet to green light region silicate phosphor capable of being excited by radiation light source and its manufacturing method, particularly to white and multicolor systems light-emitting device. The material has luminous color in the range from blue to red color system. The essential composition of the phosphor is aMO·bM'O·SiO 2 ·cR:xE·yLn·zLv·´Lm, wherein M is an element or a combination of elements selected from the group consisting of Sr, Ca, Ba and Zn; M' is an element or a combination of elements selected from the group consisting of Mg, Cd and Be; R is one or two of B 2 O 3 and P 2 O 5 ; Ln is an element or a combination of elements selected from the group consisting of Nd, Dy, Ho, Tm, La, Ce, Er, Pr, Bi, Sm, Sn, Y, Lu, Ga, Sb, Tb, Mn and Pb; Lv is an element or a combination of elements selected from the group consisting of Cl, F, Br, I and S; Lm is an element or a combination of elements selected from the group consisting of Li, Na and K
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8.发明专利Semiconductor device member, liquid for forming semiconductor device member, method of manufacturing semiconductor device member, and semiconductor light emitting device using the same, member formation liquid for semiconductor devices, and phosphor composition 审中-公开半导体器件部件，用于形成半导体器件部件的液体，制造半导体器件部件的方法和使用其的半导体发光器件，用于半导体器件的成员液体和磷光体组成
公开(公告)号：JP2009105432A
公开(公告)日：2009-05-14
申请号：JP2009003366
申请日：2009-01-09
Applicant: Mitsubishi Chemicals Corp , 三菱化学株式会社
Inventor： KATO HANAKO , MORI HIROSHI , KOBAYASHI HIROSHI , TONOMURA TASUKU
CPC classification number: C09K11/7774 , C09K11/7721 , C09K11/7734 , C09K11/7735 , C09K11/7738 , C09K11/774 , C09K11/7775 , C09K11/7781 , C09K11/7789 , C09K11/7794 , C09K11/7795 , H01L23/24 , H01L23/293 , H01L24/17 , H01L33/507 , H01L33/54 , H01L33/58 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device member that seals semiconductor devices without cracks and peeling and is excellent in heat-resistance, light-resistance, film formation, and adhesiveness. SOLUTION: The semiconductor device member has a heating weight reduction of ≤50 wt.% measured by the method (I) below and a peeling rate of ≤30% measured by the method (II) below. The method (I) measures weight reduction of 10 mg of crushed pieces of the member by thermogravimetric/differential thermal analyzer under 200 ml/min air flow with heating from 35°C to 500°C at 10°C/min of heat-up rate. The method (II) determines the peeling rate by performing on ten pieces of the member a series of steps of dropping liquid for curing semiconductor device member in a silver-plated copper cup of 9 mm diameter and 1 mm depth of a recess to make a semiconductor device member, and letting the member absorb moisture for 20 hours at 85°C and 85% of humidity, heating the moisturized member from room temperature to 260°C in 50 second, holding at 260°C for 10 seconds and cooling it down to room temperature, observing the existence of peeling, and determining the separation rate. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 解决的问题：提供一种密封半导体器件而没有裂纹和剥离并且耐热性，耐光性，成膜性和粘附性优异的半导体器件部件。 解决方案：半导体器件部件通过下述方法（I）测量的加热重量减少≤50重量％，通过下述方法（II）测量的剥离速率≤30％。 方法（I）通过热重/差热分析仪在200ml / min空气流下，以10℃/分钟的加热速率从35℃加热到500℃，测量10毫克粉碎片的重量减少 率。 方法（II）通过对10个构件进行一系列的步骤，通过在9mm直径和1mm深度的凹槽的镀银铜杯中滴加用于固化半导体器件部件的步骤来确定剥离速率，以使 半导体器件部件，并使部件在85℃和85％的湿度下吸湿20小时，将保湿部件从室温加热至260℃，持续50秒，保持在260℃10秒钟并冷却 到室温，观察剥离的存在，并确定分离速率。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP4244726B2
公开(公告)日：2009-03-25
申请号：JP2003186835
申请日：2003-06-30
Applicant: パナソニック株式会社
IPC: C09K11/08 , C09K11/64 , C09K11/78 , C09K11/80 , H01J11/22 , H01J11/24 , H01J11/34 , H01J11/42 , H01J11/50
CPC classification number: H01J11/42 , C09K11/642 , C09K11/645 , C09K11/7729 , C09K11/7734 , C09K11/774 , C09K11/7774 , C09K11/778 , H01J11/12
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公开(公告)号：JPWO2007026628A1
公开(公告)日：2009-03-05
申请号：JP2007533217
申请日：2006-08-28
Applicant: コニカミノルタエムジー株式会社
IPC: C09K11/08
CPC classification number: C09K11/662 , C09K11/57 , C09K11/584 , C09K11/623 , C09K11/643 , C09K11/663 , C09K11/7716 , C09K11/7721 , C09K11/7729 , C09K11/7734 , C09K11/7736 , C09K11/7737 , C09K11/774 , C09K11/7772 , C09K11/7774 , C09K11/778 , C09K11/7784 , C09K11/7792
Abstract: 蛍光体を構成する複数の母体構成成分及び賦活剤を共存させ、共沈を利用した液相反応で、共沈反応物である蛍光体を製造する蛍光体の製造方法であって、該液相反応に用いられる反応液の中での該母体構成成分の溶解度積が10-17〜10-27であることを特徴とし、特にナノサイズの蛍光体の輝度、耐久性が向上した蛍光体の製造方法及び蛍光体が提供できる。
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