摘要:
PROBLEM TO BE SOLVED: To provide a method for producing a fine structure with high precision and in a high yield by simplifying a production process.SOLUTION: A method for producing a structure includes steps of, in this order, preparing a substrate composed of a first resin layer and a second resin layer laminated in this order, the first resin layer being made of a positive photosensitive resin having positive photosensitivity to light having a wavelength of 280 nm or more, and the second resin layer containing an anthracene compound, partially exposing the second resin layer to light having a wavelength of 300 nm or more, radiating light having a wavelength of 280 nm or more to the first resin layer through the exposed portions of the second resin layer using the unexposed portions of the second resin layer as a mask, thereby exposing the first resin layer to light, and removing the exposed portions of the first resin layer to form a structure.
摘要:
PROBLEM TO BE SOLVED: To provide a polymerizable composition for a solder resist having both good light-shielding property and curing property in an infrared region.SOLUTION: A polymerizable composition for a solder resist contains an infrared ray shielding material, a polymerization initiator and a polymerizable compound. The infrared ray shielding material is preferably an infrared ray absorbing dye or a metal-containing inorganic pigment such as titanium black.
摘要:
PROBLEM TO BE SOLVED: To provide a black curable composition for a wafer-level lens that forms a cured film with excellent light shielding properties and exhibiting excellent sensitiveness necessary for curing in pattern formation, and an easy-to-produce wafer-level lens with light quantity properly adjusted by the presence of a light shielding film. SOLUTION: The black curable composition for a wafer-level lens includes (A) an inorganic pigment, (B) a polymerization initiator, (C) a polymerizable compound, and (D) a cardo resin. COPYRIGHT: (C)2011,JPO&INPIT
摘要:
The invention relates to a recording material having a substrate and a negative-working, radiation-sensitive layer which contains a diazonium salt, at least a first polymeric binder, which is film-forming, and organic coloured pigments, on the surface of which an organic polymeric dispersant has been adsorbed and which are additionally dispersed in a second polymeric binder which does not permanently combine with the pigments chemically or physically. The first and the second polymeric binder may be the same or different. The dispersant generally has groups, in particular primary, secondary or tertiary amino groups or derivatives thereof, which act as anchor groups on the coloured pigment particles. The pigments themselves are preferably phthalocyanine pigments. As a result of the predispersing, aggregation of the pigment particles is effectively prevented so that uniform coloration of the radiation-sensitive layer is achieved. During development of the imagewise exposed recording materials, the coloured pigment particles form virtually no insoluble precipitates. In the prepared printing plates, the printing parts are distinguished from the substrate material through being clearly visible and having high contrast.
摘要:
PROBLEM TO BE SOLVED: To always acquire high dimensional accuracy with little variation in exposure throughput (number of sheets) by preventing the deformation of a resist mask using resist as a light shielding body due to irradiation with exposure light. SOLUTION: Photomask patterns are formed by using a resist containing Si in a base resin or a resist having with metals, such as Si, introduced by a silylation process as the light shielding body, thereby improving the resistance to active oxygen. COPYRIGHT: (C)2004,JPO
摘要:
PROBLEM TO BE SOLVED: To improve pattern accuracy of a semiconductor integrated circuit device. SOLUTION: In the case of replacing a normal photomask with a resist mask, in setting of a plane dimension of a light shielding pattern 2 composed of a resist film, correction of subtracting a correction amount L from the plane dimension of the light shielding pattern 2 composed of a metal corresponding to it is performed. Inversely, in the case of replacing the resist mask with a normal mask, in the setting of the plane dimension of the light shielding pattern 2 composed of the metal, the correction of adding the correction amount L to the plane dimension of the light shielding pattern 3 composed of the resist film corresponding to it is performed.