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公开(公告)号：TWI663690B
公开(公告)日：2019-06-21
申请号：TW103145038
申请日：2014-12-23
Inventor： 余振華 , YU, CHENHUA , 余國寵 , YEE, KUOCHUNG , 李明機 , LII, MIRNGJI , 李建勳 , LEE, CHIENHSUN , 吳俊毅 , WU, JIUNYI
IPC: H01L21/768 , H01L25/065 , H01L25/10 , H01L23/52 , H01L23/498 , H01L23/488
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公开(公告)号：TW201535596A
公开(公告)日：2015-09-16
申请号：TW103145038
申请日：2014-12-23
Inventor： 余振華 , YU, CHENHUA , 余國寵 , YEE, KUOCHUNG , 李明機 , LII, MIRNGJI , 李建勳 , LEE, CHIENHSUN , 吳俊毅 , WU, JIUNYI
IPC: H01L21/768 , H01L25/065 , H01L25/10 , H01L23/52 , H01L23/498 , H01L23/488
CPC classification number: H01L25/18 , H01L21/568 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/5389 , H01L24/19 , H01L24/45 , H01L24/73 , H01L24/81 , H01L24/96 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/12105 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16235 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81192 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2225/06565 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/15151 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/18162 , H01L2924/37001 , H01L2924/00 , H01L2224/32225 , H01L2924/00012 , H01L2224/05599
Abstract: 本發明的實施例提出一種堆疊式封裝裝置，包括扇出結構、一或多個記憶體晶片與多個連接件，這些連接件將記憶體晶片接合至扇出結構。扇出結構包括了邏輯晶片、環繞邏輯晶片的模塑料與多個導電柱，這些導電柱穿過所述的模塑料。
Abstract in simplified Chinese: 本发明的实施例提出一种堆栈式封装设备，包括扇出结构、一或多个内存芯片与多个连接件，这些连接件将内存芯片接合至扇出结构。扇出结构包括了逻辑芯片、环绕逻辑芯片的模塑料与多个导电柱，这些导电柱穿过所述的模塑料。
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公开(公告)号：TWI588965B
公开(公告)日：2017-06-21
申请号：TW103145039
申请日：2014-12-23
Inventor： 余振華 , YU, CHENHUA , 余國寵 , YEE, KUOCHUNG , 李明機 , LII, MIRNGJI , 李建勳 , LEE, CHIENHSUN , 吳俊毅 , WU, JIUNYI
IPC: H01L23/538 , H01L21/58
CPC classification number: H01L25/18 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16113 , H01L2224/16145 , H01L2224/16227 , H01L2224/19 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73204 , H01L2224/73209 , H01L2224/73265 , H01L2224/81005 , H01L2224/81192 , H01L2224/81193 , H01L2224/81815 , H01L2224/83005 , H01L2224/92124 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/1431 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/14361 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/00012 , H01L2224/45099 , H01L2224/16225 , H01L2924/00
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公开(公告)号：TW201530729A
公开(公告)日：2015-08-01
申请号：TW103145039
申请日：2014-12-23
Inventor： 余振華 , YU, CHENHUA , 余國寵 , YEE, KUOCHUNG , 李明機 , LII, MIRNGJI , 李建勳 , LEE, CHIENHSUN , 吳俊毅 , WU, JIUNYI
IPC: H01L23/538 , H01L21/58
CPC classification number: H01L25/18 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16113 , H01L2224/16145 , H01L2224/16227 , H01L2224/19 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73204 , H01L2224/73209 , H01L2224/73265 , H01L2224/81005 , H01L2224/81192 , H01L2224/81193 , H01L2224/81815 , H01L2224/83005 , H01L2224/92124 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/1431 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/14361 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/00012 , H01L2224/45099 , H01L2224/16225 , H01L2924/00
Abstract: 一實施例之層疊封裝(package-on-package，PoP)元件包含封裝結構、封裝基板、以及複數個連接件將封裝結構接合至封裝基板。封裝結構包含邏輯晶片接合至記憶晶片、模封化合物包圍記憶晶片、以及複數個導電柱延伸穿過模封化合物。這些導電柱附著在邏輯晶片上之接觸墊。
Abstract in simplified Chinese: 一实施例之层叠封装(package-on-package，PoP)组件包含封装结构、封装基板、以及复数个连接件将封装结构接合至封装基板。封装结构包含逻辑芯片接合至记忆芯片、模封化合物包围记忆芯片、以及复数个导电柱延伸穿过模封化合物。这些导电柱附着在逻辑芯片上之接触垫。
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