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公开(公告)号：TW201533872A
公开(公告)日：2015-09-01
申请号：TW103145751
申请日：2014-12-26
Inventor： 梁裕民 , LIANG, YUMIN , 吳俊毅 , WU, JIUNYI
IPC: H01L23/485
CPC classification number: H01L24/16 , H01L21/4853 , H01L21/4857 , H01L23/49811 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/13082 , H01L2224/131 , H01L2224/16157 , H01L2224/16225 , H01L2224/16238 , H01L2225/06513 , H01L2924/12042 , H01L2924/14 , H01L2924/381 , H01L2924/3841 , H05K1/111 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/10674 , H01L2924/00 , H01L2924/00014 , H01L2924/014
Abstract: 一種實施方式裝置包含介電層、於介電層中之導體導線，以及凸塊焊墊。導體導線包含具有暴露上表面之第一部分，其中暴露上表面自介電層的上表面凹陷。此外，凸塊焊墊位於導體導線之第二部分上，且與第二部分電性連接。
Abstract in simplified Chinese: 一种实施方式设备包含介电层、于介电层中之导体导线，以及凸块焊垫。导体导线包含具有暴露上表面之第一部分，其中暴露上表面自介电层的上表面凹陷。此外，凸块焊垫位于导体导线之第二部分上，且与第二部分电性连接。
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公开(公告)号：TW201528432A
公开(公告)日：2015-07-16
申请号：TW103144813
申请日：2014-12-22
Inventor： 梁裕民 , LIANG, YUMIN , 吳俊毅 , WU, JIUNYI
IPC: H01L21/768 , H01L23/498
CPC classification number: H01L23/49838 , H01L22/14 , H01L23/481 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/11614 , H01L2224/11622 , H01L2224/131 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/1712 , H01L2224/17132 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81466 , H01L2224/81815 , H01L2924/01057 , H01L2924/01072 , H01L2924/05042 , H01L2924/0533 , H01L2924/0534 , H01L2924/05342 , H01L2924/05432 , H01L2924/05442 , H01L2924/05994 , H01L2924/14 , H01L2924/1531 , H01L2924/15787 , H01L2924/2064 , H01L2924/20641 , H05K1/0268 , H05K1/113 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/096 , H05K2201/0989 , H05K2201/10674 , H05K2203/0353 , H01L2924/014 , H01L2924/00014
Abstract: 提供一晶粒和一基材。晶粒包含至少一積體電路晶片，且基材包含第一子集合和一第二子集合之多個導電柱，此些導電柱係延伸而穿過基材。此些導電柱之第一子集合中之每一者包含從基材之表面突起之突起凸塊墊，且此些導電柱之第二子集合中之每一者部分形成凹陷至基材之表面中之跡線。晶粒經由多個導電凸塊來耦合該至該基材，此些導電凸塊中之每一者係於此些突起凸塊墊中之一者與晶粒之間延伸。
Abstract in simplified Chinese: 提供一晶粒和一基材。晶粒包含至少一集成电路芯片，且基材包含第一子集合和一第二子集合之多个导电柱，此些导电柱系延伸而穿过基材。此些导电柱之第一子集合中之每一者包含从基材之表面突起之突起凸块垫，且此些导电柱之第二子集合中之每一者部分形成凹陷至基材之表面中之迹线。晶粒经由多个导电凸块来耦合该至该基材，此些导电凸块中之每一者系于此些突起凸块垫中之一者与晶粒之间延伸。
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公开(公告)号：TWI588965B
公开(公告)日：2017-06-21
申请号：TW103145039
申请日：2014-12-23
Inventor： 余振華 , YU, CHENHUA , 余國寵 , YEE, KUOCHUNG , 李明機 , LII, MIRNGJI , 李建勳 , LEE, CHIENHSUN , 吳俊毅 , WU, JIUNYI
IPC: H01L23/538 , H01L21/58
CPC classification number: H01L25/18 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16113 , H01L2224/16145 , H01L2224/16227 , H01L2224/19 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73204 , H01L2224/73209 , H01L2224/73265 , H01L2224/81005 , H01L2224/81192 , H01L2224/81193 , H01L2224/81815 , H01L2224/83005 , H01L2224/92124 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/1431 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/14361 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/00012 , H01L2224/45099 , H01L2224/16225 , H01L2924/00
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Patent Agency Ranking
公开(公告)号：TW201530729A
公开(公告)日：2015-08-01
申请号：TW103145039
申请日：2014-12-23
Inventor： 余振華 , YU, CHENHUA , 余國寵 , YEE, KUOCHUNG , 李明機 , LII, MIRNGJI , 李建勳 , LEE, CHIENHSUN , 吳俊毅 , WU, JIUNYI
IPC: H01L23/538 , H01L21/58
CPC classification number: H01L25/18 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16113 , H01L2224/16145 , H01L2224/16227 , H01L2224/19 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73204 , H01L2224/73209 , H01L2224/73265 , H01L2224/81005 , H01L2224/81192 , H01L2224/81193 , H01L2224/81815 , H01L2224/83005 , H01L2224/92124 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/1431 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/14361 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/00012 , H01L2224/45099 , H01L2224/16225 , H01L2924/00
Abstract: 一實施例之層疊封裝(package-on-package，PoP)元件包含封裝結構、封裝基板、以及複數個連接件將封裝結構接合至封裝基板。封裝結構包含邏輯晶片接合至記憶晶片、模封化合物包圍記憶晶片、以及複數個導電柱延伸穿過模封化合物。這些導電柱附著在邏輯晶片上之接觸墊。
Abstract in simplified Chinese: 一实施例之层叠封装(package-on-package，PoP)组件包含封装结构、封装基板、以及复数个连接件将封装结构接合至封装基板。封装结构包含逻辑芯片接合至记忆芯片、模封化合物包围记忆芯片、以及复数个导电柱延伸穿过模封化合物。这些导电柱附着在逻辑芯片上之接触垫。
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公开(公告)号：TWI663690B
公开(公告)日：2019-06-21
申请号：TW103145038
申请日：2014-12-23
Inventor： 余振華 , YU, CHENHUA , 余國寵 , YEE, KUOCHUNG , 李明機 , LII, MIRNGJI , 李建勳 , LEE, CHIENHSUN , 吳俊毅 , WU, JIUNYI
IPC: H01L21/768 , H01L25/065 , H01L25/10 , H01L23/52 , H01L23/498 , H01L23/488
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公开(公告)号：TWI566351B
公开(公告)日：2017-01-11
申请号：TW103145751
申请日：2014-12-26
Inventor： 梁裕民 , LIANG, YUMIN , 吳俊毅 , WU, JIUNYI
IPC: H01L23/485
CPC classification number: H01L24/16 , H01L21/4853 , H01L21/4857 , H01L23/49811 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/13082 , H01L2224/131 , H01L2224/16157 , H01L2224/16225 , H01L2224/16238 , H01L2225/06513 , H01L2924/12042 , H01L2924/14 , H01L2924/381 , H01L2924/3841 , H05K1/111 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/10674 , H01L2924/00 , H01L2924/00014 , H01L2924/014
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公开(公告)号：TWI550768B
公开(公告)日：2016-09-21
申请号：TW103144813
申请日：2014-12-22
Inventor： 梁裕民 , LIANG, YUMIN , 吳俊毅 , WU, JIUNYI
IPC: H01L21/768 , H01L23/498
CPC classification number: H01L23/49838 , H01L22/14 , H01L23/481 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/11614 , H01L2224/11622 , H01L2224/131 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/1712 , H01L2224/17132 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81466 , H01L2224/81815 , H01L2924/01057 , H01L2924/01072 , H01L2924/05042 , H01L2924/0533 , H01L2924/0534 , H01L2924/05342 , H01L2924/05432 , H01L2924/05442 , H01L2924/05994 , H01L2924/14 , H01L2924/1531 , H01L2924/15787 , H01L2924/2064 , H01L2924/20641 , H05K1/0268 , H05K1/113 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/096 , H05K2201/0989 , H05K2201/10674 , H05K2203/0353 , H01L2924/014 , H01L2924/00014
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公开(公告)号：TW201535596A
公开(公告)日：2015-09-16
申请号：TW103145038
申请日：2014-12-23
Inventor： 余振華 , YU, CHENHUA , 余國寵 , YEE, KUOCHUNG , 李明機 , LII, MIRNGJI , 李建勳 , LEE, CHIENHSUN , 吳俊毅 , WU, JIUNYI
IPC: H01L21/768 , H01L25/065 , H01L25/10 , H01L23/52 , H01L23/498 , H01L23/488
CPC classification number: H01L25/18 , H01L21/568 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/5389 , H01L24/19 , H01L24/45 , H01L24/73 , H01L24/81 , H01L24/96 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/12105 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16235 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81192 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2225/06565 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/15151 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/18162 , H01L2924/37001 , H01L2924/00 , H01L2224/32225 , H01L2924/00012 , H01L2224/05599
Abstract: 本發明的實施例提出一種堆疊式封裝裝置，包括扇出結構、一或多個記憶體晶片與多個連接件，這些連接件將記憶體晶片接合至扇出結構。扇出結構包括了邏輯晶片、環繞邏輯晶片的模塑料與多個導電柱，這些導電柱穿過所述的模塑料。
Abstract in simplified Chinese: 本发明的实施例提出一种堆栈式封装设备，包括扇出结构、一或多个内存芯片与多个连接件，这些连接件将内存芯片接合至扇出结构。扇出结构包括了逻辑芯片、环绕逻辑芯片的模塑料与多个导电柱，这些导电柱穿过所述的模塑料。
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