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1.发明授权公开(公告)号：US08170724B2
公开(公告)日：2012-05-01
申请号：US12029124
申请日：2008-02-11
IPC分类号： G05D23/00
CPC分类号： H05K7/20836 , H05K7/20736 , H05K7/20781 , H05K7/2079
摘要： Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.
摘要翻译： 本文公开了用于冷却计算机部件的计算机系统和相关方法。 计算机系统的一个实施例包括具有与空气出口间隔开的空气入口的计算机机柜。 计算机系统还包括位于计算机机柜中的热交换器，以及与热交换器流体连通的散热系统。 计算机系统还包括至少一个用于监测计算机机柜和房间之间的热传递的传感器。 所述计算机系统还包括可操作地耦合到所述至少一个传感器的控制系统，所述控制系统包括计算机可读介质，所述计算机可读介质保持用于基于来自所述传感器的信息来确定所述计算机机柜和房间之间的热传递是否平衡的指令， 如果没有，调整参数以平衡传热。
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公开(公告)号：US06700070B1
公开(公告)日：2004-03-02
申请号：US09705369
申请日：2000-11-03
IPC分类号： H05K100
CPC分类号： H05K1/0266 , H05K1/0269 , H05K1/0393 , H05K3/0008 , H05K3/0052 , H05K3/0097 , H05K3/243 , H05K3/365 , H05K3/4007 , H05K2201/0367 , H05K2201/0373 , H05K2201/09063 , H05K2201/09781 , H05K2201/09918 , H05K2203/166 , H05K2203/167
摘要： The field of the manufacture of electronic components, specifically to manufacturing flexible conductive strips having contact pads thereon, wherein a first set of alignment marks are provided on a substrate. Using the first set of alignment marks, several electronic components are formed in selected positions on the substrate. The electronic components may be formed in various groups, with a first group being formed using a first mask then, subsequent groups being formed using subsequent masks. Each of the respective masks are aligned with the first set of alignment marks in order to position the electronic components formed using the masks at the desired locations on the substrate. A second set of alignment marks are produced using the same mask as a set of electronic components that are located on the substrate. Subsequently, when a different set of features is produced, it is positioned using the second set of alignment marks located on the individual parts. Thus, tolerances can be achieved that would normally be possible only in the manufacture of individual parts, while still obtaining the advantages of the economies of scale possible by making many parts on a large sheet.
摘要翻译： 电子部件的制造领域，特别是制造其上具有接触焊盘的柔性导电条，其中第一组对准标记设置在基板上。 使用第一组对准标记，在基板上的选定位置形成几个电子部件。 电子部件可以形成为各种组，第一组使用第一掩模形成，然后使用后续掩模形成随后的组。 各个掩模中的每一个对准第一组对准标记，以便将使用掩模形成的电子部件定位在基板上的所需位置。第二组对准标记使用与一组电子装置相同的掩模 位于基板上的部件。 随后，当产生不同的特征集合时，使用位于各个部件上的第二组对准标记进行定位。 因此，可以实现通常仅在制造单个零件时可以实现的公差，同时通过在许多部件上制作大尺寸片而获得规模经济的优点。
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公开(公告)号：US06641406B1
公开(公告)日：2003-11-04
申请号：US09705368
申请日：2000-11-03
IPC分类号： H01R1200
CPC分类号： H01R12/62 , H05K1/11 , H05K3/243 , H05K3/28 , H05K3/365 , H05K3/4007 , H05K3/42 , H05K2201/0367 , H05K2201/0373 , H05K2201/0949
摘要： The flexible connector for high density circuit applications comprises a multilayer flexible substrate upon which are formed a plurality of contact pads, in a density required by a particular application. This density may exceed two hundred contact pads per square inch. Contact pads of similar size and configuration are formed on the surface of another device, i.e., circuit board, and provision made to align the contact pads of the connector with those of the circuit board. Micro-pads are formed on the surface of the contact pads on the connector such, that when the connector is brought into contact with the circuit board, and sufficient pressure is applied, the micro-pads make actual electrical contact with the pads of the circuit board. Since the total surface area in contact, namely the sum of the surface areas of the micro-pads, is a small fraction of the total area of the connector, a large pressure is provided at the electrical contact interface even when low pressure is provided to the connector as a whole.
摘要翻译： 用于高密度电路应用的柔性连接器包括多层柔性基板，其上形成有特定应用所需的密度的多个接触焊盘。 该密度可能超过每平方英寸200个接触垫。 具有相似尺寸和构造的接触垫形成在另一装置即电路板的表面上，并且使连接器的接触垫与电路板的接触垫对齐。 微焊盘形成在连接器上的接触焊盘的表面上，即当连接器与电路板接触并施加足够的压力时，微焊盘与电路板的实际电接触 板。 由于接触的总表面积，即微焊盘的表面积的总和，是连接器总面积的一小部分，所以即使在提供低压时也在电接触界面处提供大的压力 连接器作为一个整体。
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公开(公告)号：US06336816B1
公开(公告)日：2002-01-08
申请号：US09619566
申请日：2000-07-19
IPC分类号： H01R1200
CPC分类号： H01R12/7005 , H01R12/714 , H01R12/721 , H01R12/79 , H05K3/365
摘要： A method and apparatus for coupling electrical connectors to a printed circuit board. The first and second clamp member are held in an open position with electrical connectors therebetween. While in the open position, the clamp is positioned over a printed circuit board, with the first and second clamp members aligned for connection to the circuit board. The clamp is then partially closed, to a preloaded position which aligns the electrodes in the clamping assembly with the electrodes on the circuit board. After the initial alignment has occurred, the clamp is firmly fastened to the printed circuit board, to electrically couple the electrodes of the connectors and the clamp to the electrodes on the printed circuit board.
摘要翻译： 一种用于将电连接器耦合到印刷电路板的方法和装置。 第一和第二夹紧构件保持在打开位置，其间具有电连接器。 当处于打开位置时，夹具定位在印刷电路板上方，其中第一和第二夹紧构件对准以连接到电路板。 然后将夹具部分地封闭到预加载位置，其将夹紧组件中的电极与电路板上的电极对准。 在初始对准发生后，夹具牢固地固定在印刷电路板上，将连接器的电极和夹具电连接到印刷电路板上的电极上。
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公开(公告)号：US06514088B1
公开(公告)日：2003-02-04
申请号：US09705366
申请日：2000-11-03
IPC分类号： H01R1200
CPC分类号： H01R13/2414
摘要： A uniform pressure pad formed of a resilient material having a plurality of uniform pressure areas formed between a row and column array of cavities formed in the pad thickness. The cavities surrounding the pressure areas allow the resilient pad material to flow evenly thereby providing uniformity in the pressure applied to each pressure area.
摘要翻译： 由弹性材料形成的均匀的压力垫，其具有形成在衬垫厚度形成的空腔的行和列阵列之间形成的多个均匀的压力区域。 围绕压力区域的空腔允许弹性垫材料均匀流动，从而提供施加到每个压力区域的压力的均匀性。
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公开(公告)号：US06416330B1
公开(公告)日：2002-07-09
申请号：US09617151
申请日：2000-07-17
IPC分类号： H01R909
CPC分类号： H01R12/7088 , H01R13/2421
摘要： A canted coiled spring is used as a highly conductive, high current electrode between a printed circuit board and a conductive strip connected to a selected voltage. A conductive channel member has fixed therein a coil spring made of a highly conductive, metallic material. The canted coiled spring is fixed at each end so that it may be easily slid along an adjacent electrode of the power strip. The channel member holding the canted coiled spring is coupled to a printed circuit board with a clamped, highly conductive contact surface. The use of the coil spring in a channel member connected to a printed circuit board permits the printed circuit board to be easily slid into, and out of electrical contact with power carrying electrodes.
摘要翻译： 倾斜螺旋弹簧用作印刷电路板和连接到选定电压的导电条之间的高导电高电流电极。 导电通道构件固定有由高导电性金属材料制成的螺旋弹簧。 倾斜的螺旋弹簧在每一端固定，使得它可以容易地沿着电源板的相邻电极滑动。 保持倾斜螺旋弹簧的通道构件与夹持的高度导电的接触表面联接到印刷电路板。 在连接到印刷电路板的通道构件中使用螺旋弹簧允许印刷电路板容易地滑入到与承载电极的电接触中。
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公开(公告)号：US06302705B1
公开(公告)日：2001-10-16
申请号：US09602573
申请日：2000-06-22
IPC分类号： H01R1200
摘要： An electrical connector includes a flexible conductor extending between a pair of mechanical connectors to electrically couple circuits. A supporting member is positioned between the mechanical connectors to reduce twisting of the flexible circuit substrate. The supporting member is cambered to permit the mechanical connectors to translate with respect to one another.
摘要翻译： 电连接器包括在一对机械连接器之间延伸以电耦合电路的柔性导体。 支撑构件位于机械连接器之间，以减少柔性电路基板的扭转。 支撑构件被弧形以允许机械连接器相对于彼此平移。
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8.发明申请公开(公告)号：US20090154091A1
公开(公告)日：2009-06-18
申请号：US11958114
申请日：2007-12-17
申请人： Alexander I. Yatskov
发明人： Alexander I. Yatskov
CPC分类号： G06F1/20 , F28D1/0426 , F28D1/05383 , F28D2021/0064 , F28F1/022 , F28F1/12 , H05K7/20009 , H05K7/20218 , H05K7/2039 , H05K7/20572 , H05K7/20709 , H05K7/20736
摘要： Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the air outlet. The air inlet, the air outlet, and the computer module compartments define an air flow path through the computer cabinet. The computer systems also include a heat exchanger positioned between two adjacent computer module compartments. The heat exchanger includes a plurality of heat exchange elements canted relative to the air flow path.
摘要翻译： 本文公开了具有用于冷却计算机部件的热交换器的计算机系统。 计算机系统包括具有空气入口，与空气入口间隔开的空气出口的计算机机柜和位于空气入口和空气出口之间的多个计算机模块隔间。 空气入口，出气口和计算机模块隔间限定通过计算机机柜的空气流动路径。 计算机系统还包括位于两个相邻的计算机模块隔间之间的热交换器。 热交换器包括相对于空气流动路径倾斜的多个热交换元件。
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9.发明授权Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses 失效用于保持与电子设备和其他设备接触的散热器和其他结构的组件公开(公告)号：US07177156B2
公开(公告)日：2007-02-13
申请号：US10886911
申请日：2004-07-08
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , G06F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Structures and methods for positioning heat sinks in contact with electronic devices are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device in accordance with one aspect of the invention includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device. The heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure further includes a spring holding portion configured to support a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.
摘要翻译： 本文描述了用于定位与电子设备接触的散热器的结构和方法。 在一个实施例中，根据本发明的一个方面的用于保持与电子设备接触的散热器的结构包括电子设备保持部分和散热器保持部分。 电子设备保持部被配置为支撑电子设备。 散热器保持部构造成将散热器定位成与电子设备接触。 该结构还包括弹簧保持部分，其构造成在螺旋弹簧中横向压缩。 当横向压缩时，螺旋弹簧以均匀的或至少近似均匀的压力将散热器压在电子设备上，使得散热器能够有效地将热量从电子设备传导而不损坏设备。
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10.发明授权Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures 有权用于将电子设备和相关散热器安装到计算机模块和其他结构的组件公开(公告)号：US07120027B2
公开(公告)日：2006-10-10
申请号：US10886895
申请日：2004-07-08
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device, and the heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure can further include a spring holding portion configured to laterally support a coil spring. When the coil spring is laterally supported in the spring holding portion, the coil spring exerts a transverse compression force against the heat sink causing the heat sink to press against the electronic device with a uniform, or an approximately uniform, pressure.
摘要翻译： 本文描述了将电子设备和相关联的散热器安装到计算机模块和其它结构的结构和方法。 在一个实施例中，用于保持与电子设备接触的散热器的结构包括电子设备保持部分和散热器保持部分。 电子设备保持部构造为支撑电子设备，并且散热器保持部构造为将散热器定位成与电子设备接触。 该结构还可以包括弹簧保持部分，该弹簧保持部分构造成侧向支撑螺旋弹簧。 当螺旋弹簧横向地支撑在弹簧保持部分中时，螺旋弹簧对散热器施加横向压缩力，导致散热片以均匀或大致均匀的压力压靠在电子设备上。
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