Band-ratio radiometer
    1.
    发明授权
    Band-ratio radiometer 失效
    带比辐射计

    公开(公告)号:US4225230A

    公开(公告)日:1980-09-30

    申请号:US930268

    申请日:1978-08-02

    IPC分类号: G01J5/08 G01J5/60

    CPC分类号: G01J5/08 G01J5/089 G01J5/60

    摘要: A band-ratio radiometer is disclosed which makes use of either a bifurcated or trifurcated fiber optic bundle, over two branches of which the sample radiation is transmitted in different wavelength regions. The third branch may be used to provide illumination of the target area, for aiming purposes, by injecting light at the near end of this branch. By this means, the remote ends of all three bundles may be focussed precisely upon the target area, with no parallax problem. The system avoids the use of conventional optical filters by making use of detectors which are identical in wavelength sensitivity and optical fibers which differ in wavelength transmittance.

    摘要翻译: 公开了一种使用分支或三叉形光纤束的带比辐射计,其中两个分支的样本辐射在不同的波长区域中传输。 为了瞄准目的,第三分支可以用于通过在该分支的近端注入光来提供目标区域的照明。 通过这种方式,所有三个束的远端可以精确地集中在目标区域上,没有视差问题。 该系统通过利用波长灵敏度相同的检测器和波长透射率不同的光纤来避免使用常规的滤光器。

    Fiber optic scanning system for laser/thermal inspection
    3.
    发明授权
    Fiber optic scanning system for laser/thermal inspection 失效
    用于激光/热检测的光纤扫描系统

    公开(公告)号:US4481418A

    公开(公告)日:1984-11-06

    申请号:US429397

    申请日:1982-09-30

    摘要: An apparatus for inspecting a device made up of a plurality of different infrared radiating elements includes an optical head which is moveable along X-Y coordinates above the fixed device to sequentially scan the infrared radiating elements. A laser beam source is operatively connected to the moveable head for injecting thermal energy into the infrared radiating elements and an infrared detector is provided for sensing the infrared radiation emanating from the elements. The infrared detector may be mounted directly on the moveable head or in a remote location wherein the detector would be connected to the moveable head by a flexible optical fiber. A second moveable head may be located on the opposite side of the device so that thermal energy from the laser source may be injected into opposite sides of the infrared radiating element.

    摘要翻译: 用于检查由多个不同的红外辐射元件组成的装置的装置包括一个可以沿固定装置上方的X-Y坐标移动的光学头,以顺序地扫描红外辐射元件。 激光束源可操作地连接到可移动头部,用于将热能注入到红外辐射元件中,并且提供红外检测器用于感测从元件发出的红外辐射。 红外检测器可以直接安装在可移动头部或远程位置,其中检测器将通过柔性光纤连接到可移动头部。 第二可移动头可以位于装置的相对侧上,使得来自激光源的热能可以被注入到红外辐射元件的相对侧。

    Infrared temperature probe for high pressure use
    4.
    发明授权
    Infrared temperature probe for high pressure use 失效
    红外温度探头用于高压使用

    公开(公告)号:US4444516A

    公开(公告)日:1984-04-24

    申请号:US345130

    申请日:1982-02-02

    摘要: An infrared temperature probe for high pressure use is in the form of a hollow bolt adapted to be threaded into a complementary threaded aperture in the wall of a pressure vessel with the end thereof disposed flush with the internal surface of the pressure vessel wall. An infrared transparent window is secured in the end of the hollow bolt with one surface thereof disposed flush with the end of the bolt. A bundle of optical fibers is secured within the opposite end of the hollow bolt and a glass rod is mounted within the hollow bolt in operative relation to the window and the optical fiber bundle for transmitting infrared radiation from the window to the optical fiber bundle. The interior of the hollow bolt may be supplied with a circulating cooling liquid or gas. An infrared temperature probe can also be used with a mold having an aperture for receiving an ejector pin wherein the hollow ejector pin is provided with an impact surface at one end and an infrared transparent window in the opposite end for receiving infrared radiation from a hot molded article within the mold when the ejector pin is located within the aperture in the mold. A bundle of optical fibers extends through the hollow ejector pin and is disposed in optical transmitting engagement with the window.

    摘要翻译: 用于高压使用的红外温度探头是中空螺栓的形式,其适于在压力容器的壁中螺纹连接到互补的螺纹孔中,其端部与压力容器壁的内表面齐平。 红外透明窗被固定在中空螺栓的端部,其一个表面设置成与螺栓的端部齐平。 一束光纤被固定在中空螺栓的相对端内,并且玻璃杆安装在中空螺栓内,与窗口和光纤束有效连接,用于将红外辐射从窗口传输到光纤束。 中空螺栓的内部可以供应循环冷却液体或气体。 红外温度探测器还可以与具有用于接收顶针的孔的模具一起使用,其中中空顶针在一端设置有冲击表面,在相对端设有红外透明窗,用于接收来自热模制件的红外辐射 当顶针位于模具的孔内时,模具内的物品。 一束光纤延伸穿过中空推顶销并设置成与窗口发生光学传递接合。

    Controller for spot welding
    5.
    发明授权
    Controller for spot welding 失效
    点焊控制器

    公开(公告)号:US4359622A

    公开(公告)日:1982-11-16

    申请号:US150808

    申请日:1980-05-19

    IPC分类号: B23K11/25 B23K11/24

    CPC分类号: B23K11/252

    摘要: A controller for a spot-welding machine compares the temperature evolution at a site at which a spot weld is being made to a standard thermal history stored in a digital read/write memory in controlling the welding current for the weld. Standard thermal histories can be generated and written into the memory as needed by an operator of the welding machine to take into account changes in operating conditions. The temperature evolution of the spot-welding operation is monitored by detecting radiant energy whose intensity provides a measure of a temperature of the weld. Phosphorescent radiation from a thermographic phosphor located in a welding tip of the welding machine and thermal infrared radiation are preferred for monitoring the temperature evolution of the spot-welding operation.

    摘要翻译: 用于点焊机的控制器将在点焊处的位置处的温度演变与在数字读/写存储器中存储的标准热历史进行比较,以控制焊接的焊接电流。 根据焊机操作员的需要,可以生成标准热历史记录并将其写入存储器,以考虑操作条件的变化。 通过检测强度提供焊缝温度测量的辐射能来监测点焊操作的温度演变。 来自位于焊接机焊接端的热成像荧光体的光电辐射和热红外辐射是监测点焊操作的温度演变的首选。

    Method and apparatus for placing and electrically connecting components
on a printed circuit board
    6.
    发明授权
    Method and apparatus for placing and electrically connecting components on a printed circuit board 失效
    用于将部件放置和电连接在印刷电路板上的方法和装置

    公开(公告)号:US4696104A

    公开(公告)日:1987-09-29

    申请号:US895633

    申请日:1986-08-12

    摘要: A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow solderiung utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material. The infrared detector also continues to sense the thermal radiation from the heated solder material during cool down to provide a signal which will be compared with a standard signal to determine the quality of the solder joint.

    摘要翻译: 用于在印刷电路板上放置,焊接和检查诸如焊接接头和电子部件的组成部件的系统利用传送装置,用于将特定电子部件选择和传送到印刷电路板上的预定位置并将每个部件保持在 在回流焊接操作期间通过使用转移装置来将组件部件机械地和电气地连接到印刷电路板的期望位置。 回流焊接使用激光束将热能注入到每个焊接接头中以熔化焊接材料。 红外检测器感测来自加热的焊料材料的热辐射和/或反射的辐射,以在焊料材料液化时停止施加激光束到焊料材料。 红外检测器还在冷却期间继续感测来自加热的焊料的热辐射,以提供将与标准信号进行比较的信号,以确定焊点的质量。

    Method and apparatus for placing and electrically connecting components
on a printed circuit board
    7.
    发明授权
    Method and apparatus for placing and electrically connecting components on a printed circuit board 失效
    用于将部件放置和电连接在印刷电路板上的方法和装置

    公开(公告)号:US4696101A

    公开(公告)日:1987-09-29

    申请号:US908920

    申请日:1986-09-19

    摘要: A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow soldering utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material. The infrared detector also continues to sense the thermal radiation from the heated solder material during cool down to provide a signal which will be compared with a standard signal to determine the quality of the solder joint.

    摘要翻译: 用于在印刷电路板上放置,焊接和检查诸如焊接接头和电子部件的组成部件的系统利用传送装置,用于将特定电子部件选择和传送到印刷电路板上的预定位置并将每个部件保持在 在回流焊接操作期间通过使用转移装置来将组件部件机械地和电气地连接到印刷电路板的期望位置。 回流焊接使用激光束将热能注入每个焊接接头以熔化焊接材料。 红外检测器感测来自加热的焊料材料的热辐射和/或反射的辐射,以在焊料材料液化时停止施加激光束到焊料材料。 红外检测器还在冷却期间继续感测来自加热的焊料的热辐射,以提供将与标准信号进行比较的信号,以确定焊点的质量。