-
公开(公告)号：US20170013101A1
公开(公告)日：2017-01-12
申请号：US14792664
申请日：2015-07-07
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： MING-SHAN CHEN , SHIH-FU YU , CHIH-PIN LIN , CHIH-HAO HSU
IPC: H04M1/18
CPC classification number: H04M1/18
Abstract: A waterproof housing without any screwing structure includes a top waterproof module, a waterproof gasket disposed on the top waterproof module, and a bottom waterproof module detachably combined with the top waterproof module. The top waterproof module has a top case, a transparent plate, and a resilient film. The top case has a touch-control window and a fingerprint hole, the transparent plate is fixed on the inner surface of the top case and entirely shields the touch-control window, and the resilient film is fixed between the inner surface of the top case and the transparent plate to shield the fingerprint hole. When a smart phone is received in the waterproof housing, the resilient film can be pressed to trigger the fingerprint function of the smart phone. The top and bottom waterproof modules are combined with each other to compress the waterproof gasket.
Abstract translation: 没有任何螺旋结构的防水壳体包括顶部防水模块，设置在顶部防水模块上的防水垫圈，以及与顶部防水模块可拆卸地组合的底部防水模块。 顶部防水模块具有顶盖，透明板和弹性膜。 顶盖具有触摸控制窗和指纹孔，透明板固定在顶盖的内表面上，完全屏蔽触摸控制窗，弹性膜固定在顶盖的内表面之间 和透明板来屏蔽指纹孔。 当智能手机被接收在防水外壳中时，弹性膜可被按压以触发智能手机的指纹功能。 顶部和底部防水模块彼此组合以压缩防水垫圈。
-
公开(公告)号：US09827814B2
公开(公告)日：2017-11-28
申请号：US15131525
申请日：2016-04-18
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： Chih-Hao Hsu , Chung-Hsin Yang , Chih-Pin Lin , Shih-Fu Yu , Wei-Tsen Yen
CPC classification number: B60C23/0491 , B60C23/0447
Abstract: A carrier module of a tire pressure monitoring device includes a plastic carrier and a metallic tube. The plastic carrier has a trough and a tube extended from a bottom portion of the trough. The trough has an airflow channel penetratingly formed on the bottom portion thereof, and the trough is in air communication with the tube by the airflow channel The metallic tube is seamlessly formed on an inner surface of the tube of the plastic carrier. The metallic tube has an inner screw thread formed on an inner surface thereof for detachably screwing to a nozzle of a tire. Thus, by seamlessly forming the metallic tube on the inner surface of the tube of the plastic carrier, the tire pressure monitoring device of the instant disclosure has a better airproof effect and a longer service life.
-
公开(公告)号：US20150136572A1
公开(公告)日：2015-05-21
申请号：US14099193
申请日：2013-12-06
Applicant: Ichia Technologies, Inc.
Inventor： CHANG -LI LIU , YU- CHIH CHANG
CPC classification number: H01H13/10 , H01H13/04 , H01H13/06 , H01H13/52 , H01H13/86 , H01H2013/525 , H01H2217/01 , H01H2223/002 , H01H2227/036 , H01H2237/006
Abstract: A thin push button structure includes a main board, a circuit board, an elastic element, a supporting plate, a key top and a frame. The circuit board is disposed on the main board and formed with a plurality of cavities. The supporting plate includes a seat, an extending portion and a contacting portion. The seat is formed with a window at the central region and connected to the contacting portion by the extending portion. The elastic element is disposed on the circuit board. The key top includes a main body and a plurality of posts that extend therefrom. The frame includes a through opening and a plurality of alignment grooves at the periphery of the opening. The frame sleeves the key top, and the posts are received by the alignment grooves. The key top caps the contacting portion and is movable within the alignment grooves and the cavities.
Abstract translation: 薄按钮结构包括主板，电路板，弹性元件，支撑板，键顶和框架。 电路板设置在主板上并形成有多个空腔。 支撑板包括座，延伸部和接触部。 座椅在中心区域形成有窗口，并通过延伸部分与接触部分连接。 弹性元件设置在电路板上。 键顶包括从其延伸的主体和多个柱。 框架包括通孔和位于开口周边的多个对准槽。 框架围绕键顶，并且柱由对准凹槽接收。 键顶盖接触部分并且可在对准槽和空腔内移动。
-
4.发明申请PRECURSOR SUBSTRATE, FLEXIBLE CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME 审中-公开前置基板，柔性电路板及其制造方法公开(公告)号：US20140224528A1
公开(公告)日：2014-08-14
申请号：US13852002
申请日：2013-03-28
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： CHIEN-HWA CHIU , CHIH-MIN CHAO , PEIR-RONG KUO , CHIA-HUA CHIANG , CHIH-CHENG HSIAO , FENG-PING KUAN , YING-WEI LEE , YUNG-CHANG JUANG
CPC classification number: H05K1/028 , H05K1/0393 , H05K3/20 , H05K3/22 , H05K3/386 , H05K3/426 , H05K3/465 , H05K3/4673 , H05K2201/0154 , Y10T428/24521 , Y10T428/265 , Y10T428/31678
Abstract: The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).
Abstract translation: 本发明提供了一种柔性电路板，其至少包括设置在基板上的多层单元，其中所述多层单元包括：形成在所述基板的表面内的粘附增强层，设置在所述粘合增强层上的第一导电单元， 以及形成在所述第一导电层上的第二导电层，其中所述粘附增强层为钯，所述第一导电层为镍，所述基板由聚酰亚胺（PI）构成。
-
公开(公告)号：US20140103008A1
公开(公告)日：2014-04-17
申请号：US13722928
申请日：2012-12-20
Applicant: ICHIA TECHNOLOGIES, INC.
Inventor： Ko-Ju CHEN
IPC: A61B5/15
CPC classification number: G01N27/3272 , A61B5/14532 , A61B5/1486 , A61B5/150358 , A61B2562/0295 , A61B2562/12 , C25D5/022 , G01N33/525
Abstract: The invention provides a method of fabricating test strip for measuring biological fluid. The method comprises steps of: preparing a metallic membrane and an insulating material; adhering the metallic membrane on the insulating material; photolithographing for the metallic membrane; etching the metallic membrane to form a circuit layer; providing a sensing reagent on the circuit layer to form a sensing reagent layer; and adhering an intermediate layer and a cover to the insulating material to cover the circuit layer and expose part of the circuit layer. The circuit layer is provided in an adhering manner to enhance the stability of resistance and the test accuracy.
Abstract translation: 本发明提供一种制造用于测量生物流体的测试条的方法。 该方法包括以下步骤：制备金属膜和绝缘材料; 将金属膜粘附在绝缘材料上; 光刻用于金属膜; 蚀刻金属膜以形成电路层; 在所述电路层上提供感测试剂以形成检测试剂层; 并且将中间层和盖粘附到绝缘材料上以覆盖电路层并暴露电路层的一部分。 电路层以粘合方式提供，以增强电阻的稳定性和测试精度。
-
Patent Agency Ranking
公开(公告)号：US20170297386A1
公开(公告)日：2017-10-19
申请号：US15131525
申请日：2016-04-18
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： CHIH-HAO HSU , CHUNG-HSIN YANG , CHIH-PIN LIN , SHIH-FU YU , WEI-TSEN YEN
IPC: B60C23/04
CPC classification number: B60C23/0491 , B60C23/0447
Abstract: A carrier module of a tire pressure monitoring device includes a plastic carrier and a metallic tube. The plastic carrier has a trough and a tube extended from a bottom portion of the trough. The trough has an airflow channel penetratingly formed on the bottom portion thereof, and the trough is in air communication with the tube by the airflow channel The metallic tube is seamlessly formed on an inner surface of the tube of the plastic carrier. The metallic tube has an inner screw thread formed on an inner surface thereof for detachably screwing to a nozzle of a tire. Thus, by seamlessly forming the metallic tube on the inner surface of the tube of the plastic carrier, the tire pressure monitoring device of the instant disclosure has a better airproof effect and a longer service life.
-
公开(公告)号：US20160255721A1
公开(公告)日：2016-09-01
申请号：US15149768
申请日：2016-05-09
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： CHIEN-HWA CHIU , CHIH-MIN CHAO , PEIR-RONG KUO , CHIA-HUA CHIANG , CHIH-CHENG HSIAO , FENG-PING KUAN , YING-WEI LEE , WEI-CHENG LEE
CPC classification number: H05K1/115 , C23C18/16 , C23C28/021 , C23C28/023 , C23C28/32 , H05K1/0326 , H05K1/0346 , H05K1/09 , H05K1/111 , H05K1/118 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/381 , H05K3/426 , H05K3/46 , H05K2201/0154 , H05K2201/0338 , H05K2201/05 , Y10T29/49124 , Y10T29/49155
Abstract: A printed circuit board precursor includes a substrate, a catalytic layer, a conductive layer, and a metal layer. The substrate has a top surface, a bottom surface, and a wall defining a channel, and the channel completely penetrates through the substrate from the top surface to the bottom surface. The catalytic layer is formed on the top surface, the bottom surface, and the wall of the substrate. The conductive layer is attached to and covers the catalytic layer. The metal layer is disposed on the conductive layers and filled in the channel.
Abstract translation: 印刷电路板前体包括基板，催化层，导电层和金属层。 衬底具有顶表面，底表面和限定通道的壁，并且通道从顶表面到底表面完全穿透衬底。 催化层形成在基板的顶表面，底表面和壁上。 导电层附着并覆盖催化层。 金属层设置在导电层上并填充在通道中。
-
公开(公告)号：US09326374B2
公开(公告)日：2016-04-26
申请号：US13967401
申请日：2013-08-15
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： Chien-Hwa Chiu , Chih-Min Chao , Peir-Rong Kuo , Chia-Hua Chiang , Chih-Cheng Hsiao , Feng-Ping Kuan , Ying-Wei Lee , Yung-Chang Juang
CPC classification number: H05K1/028 , H05K1/0393 , H05K3/20 , H05K3/22 , H05K3/386 , H05K3/426 , H05K3/465 , H05K3/4673 , H05K2201/0154 , Y10T428/24521 , Y10T428/265 , Y10T428/31678
Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).
Abstract translation: 柔性电路板包括具有凹陷以限定至少隔室的聚酰亚胺层的基板。 隔室包括具有侧壁和底壁的内壁表面。 隔室用于容纳多层单元，其中多层单元包括形成在隔室壁上的粘附增强层，设置在粘附增强层上的第一导电层和形成在第一导电层上的第二导电层 层。 粘附增强层是钯。 第一导电层是镍。 基板由聚酰亚胺（PI）组成。
-
公开(公告)号：US09111700B2
公开(公告)日：2015-08-18
申请号：US14099193
申请日：2013-12-06
Applicant: ICHIA TECHNOLOGIES, INC.
Inventor： Chang-Li Liu , Yu-Chih Chang
CPC classification number: H01H13/10 , H01H13/04 , H01H13/06 , H01H13/52 , H01H13/86 , H01H2013/525 , H01H2217/01 , H01H2223/002 , H01H2227/036 , H01H2237/006
Abstract: A thin push button structure includes a main board, a circuit board, an elastic element, a supporting plate, a key top and a frame. The circuit board is disposed on the main board and formed with a plurality of cavities. The supporting plate includes a seat, an extending portion and a contacting portion. The seat is formed with a window at the central region and connected to the contacting portion by the extending portion. The elastic element is disposed on the circuit board. The key top includes a main body and a plurality of posts that extend therefrom. The frame includes a through opening and a plurality of alignment grooves at the periphery of the opening. The frame sleeves the key top, and the posts are received by the alignment grooves. The key top caps the contacting portion and is movable within the alignment grooves and the cavities.
Abstract translation: 薄按钮结构包括主板，电路板，弹性元件，支撑板，键顶和框架。 电路板设置在主板上并形成有多个空腔。 支撑板包括座，延伸部和接触部。 座椅在中心区域形成有窗口，并通过延伸部分与接触部分连接。 弹性元件设置在电路板上。 键顶包括从其延伸的主体和多个柱。 框架包括通孔和位于开口周边的多个对准槽。 框架围绕键顶，并且柱由对准凹槽接收。 键顶盖接触部分并且可在对准槽和空腔内移动。
-
公开(公告)号：US20140224527A1
公开(公告)日：2014-08-14
申请号：US13967401
申请日：2013-08-15
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： CHIEN-HWA CHIU , CHIH-MIN CHAO , PEIR-RONG KUO , CHIA-HUA CHIANG , CHIH-CHENG HSIAO , FENG-PING KUAN , YING-WEI LEE , YUNG-CHANG JUANG
CPC classification number: H05K1/028 , H05K1/0393 , H05K3/20 , H05K3/22 , H05K3/386 , H05K3/426 , H05K3/465 , H05K3/4673 , H05K2201/0154 , Y10T428/24521 , Y10T428/265 , Y10T428/31678
Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).
Abstract translation: 柔性电路板包括具有凹陷以限定至少隔室的聚酰亚胺层的基板。 隔室包括具有侧壁和底壁的内壁表面。 隔室用于容纳多层单元，其中多层单元包括形成在隔室壁上的粘附增强层，设置在粘附增强层上的第一导电层和形成在第一导电层上的第二导电层 层。 粘附增强层是钯。 第一导电层是镍。 基板由聚酰亚胺（PI）组成。
-
-
-
-
-
-
-
-
-
Search Results
24
records
(took 0.011 seconds)
