公开(公告)号：US07745516B2

公开(公告)日：2010-06-29

申请号：US11248803

申请日：2005-10-12

Applicant: Thomas Eugene Dueber ,  John D. Summers ,  Brian C. Auman ,  Munirpallam Appadorai Subramanian ,  Nyrissa S. Rogado

Inventor： Thomas Eugene Dueber ,  John D. Summers ,  Brian C. Auman ,  Munirpallam Appadorai Subramanian ,  Nyrissa S. Rogado

IPC: C08K5/05 ,  C08K5/10 ,  C08K5/103 ,  C08L79/08 ,  B32B15/08

CPC classification number: H01L21/02118 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/02 ,  G03F7/023 ,  G03F7/0387 ,  H01L21/02282 ,  H01L21/312 ,  H05K1/095 ,  H05K2201/0154 ,  Y10T428/31522 ,  C08L2666/20 ,  C08L2666/22

Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.

Abstract translation: 吸水性聚酰亚胺/环氧基组合物（如糊剂（或溶液））特别适用于制作电子可屏幕印刷的材料和电子元件。 发现一组疏水性环氧化物（和可溶性聚酰亚胺）特别耐吸湿性。 用这些环氧化物（和这些聚酰亚胺）制成的聚酰亚胺/环氧树脂浆料可以任选含有热交联剂，粘合促进剂，封闭异氰酸酯和其它无机填料。 本发明的聚酰亚胺/环氧树脂糊料的玻璃化转变温度可以高于250℃，吸水率小于2％，并且具有正的溶解度测量。

公开(公告)号：US06908685B2

公开(公告)日：2005-06-21

申请号：US10343277

申请日：2001-08-23

Applicant: Kenji Uhara ,  Kouichi Sawasaki ,  Naofumi Yasuda ,  Brian C. Auman ,  John D. Summers

Inventor： Kenji Uhara ,  Kouichi Sawasaki ,  Naofumi Yasuda ,  Brian C. Auman ,  John D. Summers

IPC: C08G73/10 ,  H05K1/03 ,  B32B15/08 ,  B32B27/08 ,  C08L77/00

CPC classification number: H05K1/0346 ,  C08G73/1042 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31721

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract translation: 本发明提供一种聚酰亚胺膜，其由均苯四酸二酐制备的聚酰胺酸与10至60mol％的苯二胺和40至90mol％的3,4'-氧二苯胺（基于总二胺）组合。 聚酰亚胺薄膜通过在其表面上提供金属互连作为柔性电路中的金属互连板基板，芯片级封装（CSP），球栅阵列（BGA）或带自动键合（TAB） 高弹性模量，低热膨胀系数，碱蚀刻性和成膜性之间的平衡。

公开(公告)号：US5426071A

公开(公告)日：1995-06-20

申请号：US205440

申请日：1994-03-04

Applicant: John D. Summers

Inventor： John D. Summers

IPC: C08G73/10 ,  C08J5/18 ,  H01L21/027 ,  H01L21/28

CPC classification number: C08J5/18 ,  C08G73/1039 ,  H01L21/0272 ,  C08J2379/08

Abstract: A polyimide copolymer derived from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, oxydiphthalic dianhydride, m-phenylene diamine and 4,4'-oxydianiline, for use as a high-temperature resistant lift-off layer in the fabrication of integrated circuit substrates.

Abstract translation: 衍生自2,2-双（3,4-二羧基苯基）六氟丙烷二酐，氧联二邻苯二甲酸二酐，间苯二胺和4,4'-氧二苯胺的聚酰亚胺共聚物，用作制造中的耐高温剥离层 的集成电路基板。

公开(公告)号：US5202412A

公开(公告)日：1993-04-13

申请号：US591225

申请日：1990-10-02

Applicant: Brian C. Auman ,  John D. Summers

Inventor： Brian C. Auman ,  John D. Summers

IPC: C08G73/10 ,  C08G73/14 ,  C08L79/08

CPC classification number: C08G73/1042 ,  C08G73/14

Abstract: Soluble polymeric precursors having oligomeric imide and amic acid segments, which are suitable to form segmented, preferably insoluble, polyimide copolymers.

公开(公告)号：US5026823A

公开(公告)日：1991-06-25

申请号：US406677

申请日：1989-09-12

Applicant: John D. Summers ,  Thomas O. Jeanes

Inventor： John D. Summers ,  Thomas O. Jeanes

IPC: C08G73/10

CPC classification number: C08G73/1082 ,  C08G73/10 ,  C08G73/1046 ,  C08G73/1057

Abstract: This invention relates to novel polyimides derived from alicyclic dianhydrides and a process for synthesizing the polyimides.

Abstract translation: 本发明涉及衍生自脂环族二酐的新型聚酰亚胺和聚酰亚胺的合成方法。

公开(公告)号：US4988371A

公开(公告)日：1991-01-29

申请号：US406675

申请日：1989-09-12

Applicant: Thomas O. Jeanes ,  John D. Summers ,  Edgar S. Sanders, Jr.

Inventor： Thomas O. Jeanes ,  John D. Summers ,  Edgar S. Sanders, Jr.

IPC: B01D71/64 ,  C08G73/10

CPC classification number: C08G73/105 ,  B01D71/64 ,  C08G73/10 ,  C08G73/1064 ,  C08G73/1082

Abstract: This invention relates to novel polyimide gas separation membranes derived from alicyclic dianhydrides and aliphatic, alicyclic, or aromatic diamines, and a process for using such membranes.

Abstract translation: 本发明涉及衍生自脂环族二酸酐和脂族，脂环族或芳族二胺的新型聚酰亚胺气体分离膜及其使用方法。

公开(公告)号：US09255208B2

公开(公告)日：2016-02-09

申请号：US13383491

申请日：2010-06-11

Applicant: Jay Robert Dorfman ,  John D. Summers

Inventor： Jay Robert Dorfman ,  John D. Summers

IPC: H01B1/02 ,  C09D11/30 ,  C09D11/52

CPC classification number: C09D11/30 ,  C09D11/52

Abstract: The present invention uses a silver/silver chloride composition and ink jet technology in the art of digital printing, especially for use in blood glucose sensors.

Abstract translation: 本发明在数字印刷领域中使用银/氯化银组合物和喷墨技术，特别是用于血糖传感器。

公开(公告)号：US20090023858A1

公开(公告)日：2009-01-22

申请号：US12141137

申请日：2008-06-18

Applicant: JOHN D. SUMMERS ,  THOMAS EUGENE DUEBER

Inventor： JOHN D. SUMMERS ,  THOMAS EUGENE DUEBER

IPC: C08L77/10 ,  C08G69/32 ,  B41M1/12

CPC classification number: H05K1/162 ,  C08G69/00 ,  C08G73/22 ,  H01L51/5253 ,  H05K3/1291 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2203/1126

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Abstract translation: 本发明涉及组合物，以及这些组合物用于保护涂层，特别是电子器件的用途。 本发明涉及涂覆有复合密封剂并嵌入印刷线路板的烧制箔陶瓷电容器。

公开(公告)号：US20080118633A1

公开(公告)日：2008-05-22

申请号：US11982766

申请日：2007-11-05

Applicant: Cheng-Chung Chen ,  Thomas Eugene Dueber ,  Shane Fang ,  John D. Summers

Inventor： Cheng-Chung Chen ,  Thomas Eugene Dueber ,  Shane Fang ,  John D. Summers

IPC: B05D5/12

CPC classification number: H01C17/06586 ,  H01C7/005 ,  H05K1/095 ,  H05K1/167

Abstract: The invention relates generally to methods for creating circuitry components from binder materials having a hydrophobic phenolic component and a hydrophobic epoxy component. The phenolic/epoxy based liquids, solutions, suspensions and/or pastes can generally be screen printed or otherwise formed on an electronic substrate, pattern or device, to provide an electronic component having low water sorption properties.

Abstract translation: 本发明一般涉及从具有疏水性酚类成分和疏水环氧组分的粘合剂材料制备电路元件的方法。 酚醛/环氧基液体，溶液，悬浮液和/或糊剂通常可以丝网印刷或以其它方式形成在电子基材，图案或装置上，以提供具有低吸水性质的电子部件。

公开(公告)号：US07348373B2

公开(公告)日：2008-03-25

申请号：US10782326

申请日：2004-02-19

Applicant: Thomas E. Dueber ,  John D. Summers ,  Xin Fang

Inventor： Thomas E. Dueber ,  John D. Summers ,  Xin Fang

IPC: C08G73/10

CPC classification number: C08G73/1032 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1064 ,  C08K5/0008 ,  C08L79/08 ,  H05K1/0346

Abstract: Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250° C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.

Abstract translation: 吸水性聚酰亚胺浆料（或溶液）对于制造电子丝网印刷浆料和由这些浆料制成的电子部件特别有用。 发现一组可溶性聚酰亚胺及其溶剂特别耐吸湿性。 这些聚酰亚胺溶液任选地含有也含有可交联单体和/或热交联剂的聚酰亚胺。 此外，这些聚酰亚胺浆料可任选地含有粘合促进剂，封闭的异氰酸酯，金属，金属氧化物和其它无机填料。 本发明的聚酰亚胺膏（或溶液）具有玻璃化转变温度大于250℃的聚酰亚胺，吸水系数小于2％，并且具有正的溶解度测量。