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13 条记录 (耗时 0.016 秒)

    Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto
    3.
    发明申请
    Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto 审中-公开
    包含聚酰亚胺和疏水性环氧树脂和酚醛树脂的组合物，以及与其相关的方法

    公开(公告)号：US20090111948A1

    公开(公告)日：2009-04-30

    申请号：US11977563

    申请日：2007-10-25

    申请人： Thomas Eugene Dueber ,  Nyrissa S. Rogado

    发明人： Thomas Eugene Dueber ,  Nyrissa S. Rogado

    IPC分类号： C08L63/00

    CPC分类号： C08G73/1039 ,  C08G73/1064 ,  C08K3/22 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/22

    摘要： Water absorption resistant compositions of the present disclosure, e.g., pastes (or solutions), are well suited for electronic screen-printable materials and electronic components. The composition of the present disclosure may optionally contain thermal crosslinking agents, adhesion promoters, and other inorganic fillers. The composition of the present disclosure can have a glass transition temperature greater than 250° C. and a water absorption factor of less than 2%, and a positive solubility measurement.

    摘要翻译： 本公开的耐吸水组合物，例如糊剂（或溶液）非常适用于电子可屏幕印刷的材料和电子部件。 本公开的组合物可以任选地含有热交联剂，粘合促进剂和其它无机填料。 本公开的组合物可以具有大于250℃的玻璃化转变温度和小于2％的吸水系数和正的溶解度测量。

    Flexible, flame-retardant, aqueous-processable photoimageable composition for coating flexible printed circuits
    7.
    发明授权
    Flexible, flame-retardant, aqueous-processable photoimageable composition for coating flexible printed circuits 有权
    柔性，阻燃，水性加工的可光成像组合物用于涂布柔性印刷电路

    公开(公告)号：US06218074B1

    公开(公告)日：2001-04-17

    申请号：US09358212

    申请日：1999-07-21

    申请人： Thomas Eugene Dueber ,  Yueh-Ling Lee ,  Frank Leonard Schadt, III

    发明人： Thomas Eugene Dueber ,  Yueh-Ling Lee ,  Frank Leonard Schadt, III

    IPC分类号： G03F7095

    CPC分类号： G03F7/033 ,  H05K3/287 ,  H05K3/4676 ,  Y10S430/108 ,  Y10S430/111

    摘要： A flexible, flame-retardant, aqueous processable, photoimageable resin composition for forming a permanent, protective coating film for printed circuitry and a multilayer photoimageable element containing a layer of the photoimageable resin composition in combination with a low tack photoimageable resin sublayer and a temporary support film are disclosed. The photoimageable resin composition has excellent aqueous developability and provides a cured coating film having good flexibility, adhesion, solvent resistance, surface hardness, thermal resistance, electrical insulating properties and flame retardancy.

    摘要翻译： 一种用于形成用于印刷电路的永久性保护涂膜的柔性阻燃水性可加工的可光成像树脂组合物，以及含有可光成像树脂组合物层与低粘度可光成像树脂子层和临时载体的多层可光成像元件 披露电影。 可光成像树脂组合物具有优异的水性显影性，并且提供具有良好的柔韧性，粘合性，耐溶剂性，表面硬度，耐热性，电绝缘性和阻燃性的固化涂膜。

    Polyimide composite coverlays and methods and compositions relating thereto
    9.
    发明授权
    Polyimide composite coverlays and methods and compositions relating thereto 有权
    聚酰亚胺复合材料覆盖物及其相关的方法和组合物

    公开(公告)号：US07579134B2

    公开(公告)日：2009-08-25

    申请号：US11080608

    申请日：2005-03-15

    申请人： Thomas Eugene Dueber ,  Brian C. Auman ,  Kuppusamy Kanakarajan

    发明人： Thomas Eugene Dueber ,  Brian C. Auman ,  Kuppusamy Kanakarajan

    IPC分类号： G03F7/028 ,  G03F7/032

    CPC分类号： H05K3/281 ,  C09J7/22 ,  C09J7/35 ,  C09J2479/08 ,  C09J2479/086 ,  H05K3/0023 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10S430/107 ,  Y10S430/117 ,  Y10S430/127 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31725

    摘要： The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250° C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/° C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material.

    摘要翻译： 本发明涉及衍生自具有覆盖层并与其相邻的粘合剂层的两层聚酰胺酸基复合材料的覆盖层组合物，其中所述覆盖层包含聚酰胺酸和允许组合物为光敏性和水性基础显影的其它添加剂，以及 其中粘合剂层可以形成玻璃化转变温度在170和250℃之间的聚酰亚胺。本发明的双层覆盖层组合物用于封装形成在柔性印刷电路基底基板上的金属电路迹线。 这些双层组合物是特别有用的，因为其具有10至40ppm /℃的总体平面内CTE，可用于避免当用作基于聚酰亚胺的覆盖材料时柔性印刷电路的不必要的卷曲的范围。