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1.发明授权Method for creating printed circuit board substrates having solder mask-free edges 失效用于制造具有无焊料边缘的印刷电路板基板的方法公开(公告)号：US06564452B2
公开(公告)日：2003-05-20
申请号：US09952590
申请日：2001-09-14
IPC分类号： H05K330
CPC分类号： H05K3/3452 , H01L21/481 , H01L23/49816 , H01L2924/0002 , H05K3/0052 , H05K2201/0989 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , H01L2924/00
摘要： A substrate for a plurality of electronic assemblies includes a strip of printed circuit board (PCB) material including a surface and a plurality of segments. Each segment is adapted to receive at least one electronic component and is arranged to be singulated into a plurality of individual electronic assemblies. Each segment has a perimeter portion located generally about the periphery of the segment, with the surface being covered with a solder mask, except for the perimeter portion.
摘要翻译： 用于多个电子组件的基板包括包括表面和多个段的印刷电路板（PCB）材料条。 每个段适于接收至少一个电子部件，并且被布置成被分成多个单独的电子组件。 每个段具有大致围绕该段的周边定位的周边部分，除了周边部分之外，该表面被焊接掩模覆盖。
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公开(公告)号：US6064117A
公开(公告)日：2000-05-16
申请号：US986275
申请日：1997-12-05
申请人： Joseph C. Barrett
发明人： Joseph C. Barrett
CPC分类号： H01L23/3128 , H01L2924/0002 , Y10T29/49146 , Y10T29/49171
摘要： An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural support to a corner section of the substrate.
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公开(公告)号：US5810459A
公开(公告)日：1998-09-22
申请号：US606812
申请日：1996-02-26
CPC分类号： A47B47/02 , A47B87/0276
摘要： A stackable modular cabinet having modular, interlocking side units which allow cabinet dimensions to be tailored both vertically and laterally to user needs while also providing the strength and stability to support heavy equipment such as electronic subassemblies. Each side unit has a pair of mating flanges with apertures for receiving and retaining fastening pins that interlock to the fastening pins of a different side unit when the respective flanges of the two side units mate. The interlocked fastening pin structure forms unified rods which extend the full height of the cabinet and which cooperates with the intervening side unit flanges. Each side unit further has re-enforced, double-sided bracket structures at opposing ends which, in combination with the pin structure, provides an unusual amount of strength to the modular cabinet.
摘要翻译： 具有模块化互锁侧单元的可堆叠模块化机柜，允许机柜尺寸垂直和横向地定制到用户需要，同时还提供强度和稳定性以支持诸如电子组件的重型设备。 每个侧单元具有一对匹配凸缘，其具有孔，用于当两个侧单元的相应凸缘相配合时，用于接收并保持与不同侧单元的紧固销互锁的紧固销。 互锁紧固销结构形成统一的杆，其延伸机柜的整个高度并与中间侧单元凸缘配合。 每个侧面单元还在相对的端部处具有重新实施的双面支架结构，其与销结构组合为模块化柜提供了不寻常的强度。
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公开(公告)号：US06545351B1
公开(公告)日：2003-04-08
申请号：US09536240
申请日：2000-03-27
IPC分类号： H01L23495
CPC分类号： H05K1/021 , H01L23/3128 , H01L23/3677 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8547 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H05K1/0204 , H05K1/182 , H05K2201/10416 , H05K2201/10734 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099
摘要： An integrated circuit package which includes an integrated circuit that is attached to a first side of a substrate. The package may also have a solder ball and a heat slug that are both attached to a second side of the substrate. The heat slug and solder ball can be attached to a printed circuit board. The heat slug can provide a thermal path from the substrate to the circuit board which has a relatively wide area. The wide area reduces the thermal impedance and the junction temperatures of the integrated circuit for a given amount of heat.
摘要翻译： 一种集成电路封装，其包括附接到基板的第一侧的集成电路。 封装还可以具有焊接球和加热块，两者都附接到衬底的第二侧。 散热片和焊球可以连接到印刷电路板上。 散热片可以提供从基板到具有相对较宽面积的电路板的热路径。 广泛的面积减少了给定热量的集成电路的热阻抗和结温。
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公开(公告)号：US06310298B1
公开(公告)日：2001-10-30
申请号：US09001024
申请日：1997-12-30
IPC分类号： H05K103
CPC分类号： H05K3/3452 , H01L21/481 , H01L23/49816 , H01L2924/0002 , H05K3/0052 , H05K2201/0989 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , H01L2924/00
摘要： A substrate for a plurality of electronic assemblies includes a strip of printed circuit board (PCB) material including a surface and a plurality of segments. Each segment is adapted to receive at least one electronic component and is arranged to be singulated into a plurality of individual electronic assemblies. Each segment has a perimeter portion located generally about the periphery of the segment, with the surface being covered with a solder mask, except for the perimeter portion.
摘要翻译： 用于多个电子组件的基板包括包括表面和多个段的印刷电路板（PCB）材料条。 每个段适于接收至少一个电子部件，并且被布置成被分成多个单独的电子组件。 每个段具有大致围绕该段的周边定位的周边部分，除了周边部分之外，该表面被焊接掩模覆盖。
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6.发明授权
公开(公告)号：US5933324A
公开(公告)日：1999-08-03
申请号：US991957
申请日：1997-12-16
申请人： Joseph C. Barrett
发明人： Joseph C. Barrett
CPC分类号： H05K1/0207 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H05K1/0206 , H05K2201/066 , H05K2201/10303 , H05K2201/10734 , H05K3/429
摘要： An apparatus for dissipating heat transferred to a circuit board. A board on which to mount an electronic device includes a conductive layer. A first board heat dissipation element is thermally coupled to the conductive layer and extends away from a surface of the board to dissipate heat from the conductive layer to the ambient.
摘要翻译： 用于耗散传递到电路板的热量的装置。 安装电子设备的电路板包括导电层。 第一板散热元件热耦合到导电层并且远离板的表面延伸以将热量从导电层散发到环境。
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公开(公告)号：US06867506B2
公开(公告)日：2005-03-15
申请号：US09921070
申请日：2001-08-02
申请人： Joseph C. Barrett
发明人： Joseph C. Barrett
CPC分类号： H01L23/3128 , H01L2924/0002 , Y10T29/49146 , Y10T29/49171 , H01L2924/00
摘要： An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural support to a corner section of the substrate.
摘要翻译： 用于封装逻辑芯片的装置包括其上安装有逻辑芯片的基板和设置在基板上并覆盖逻辑芯片的模具盖。 模具盖包括足够尺寸和形状的至少一个延伸部，以向基底的拐角部分提供结构支撑。
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公开(公告)号：US06605492B2
公开(公告)日：2003-08-12
申请号：US09527284
申请日：2000-03-17
申请人： Joseph C. Barrett
发明人： Joseph C. Barrett
IPC分类号： H01L2144
CPC分类号： H01L23/3128 , H01L2924/0002 , Y10T29/49146 , Y10T29/49171 , H01L2924/00
摘要： An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural support to a corner section of the substrate.
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公开(公告)号：US06404067B1
公开(公告)日：2002-06-11
申请号：US09618968
申请日：2000-07-19
申请人： Kuljeet Singh , Joseph C. Barrett
发明人： Kuljeet Singh , Joseph C. Barrett
IPC分类号： H01L2348
CPC分类号： H01L23/3128 , H01L21/565 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package including a substrate, an integrated circuit, and an encapsulant. The substrate has two opposing surfaces and an opening that extends between the two surfaces. The integrated circuit is mounted to the substrate substantially centered over the opening such that a portion of the opening is left uncovered by the integrated circuit. The encapsulant encapsulates the integrated circuit with a portion of the encapsulant extending between the two surfaces of the substrate and attached to the lower surface of the integrated circuit.
摘要翻译： 一种集成电路封装，包括衬底，集成电路和密封剂。 衬底具有两个相对的表面和在两个表面之间延伸的开口。 集成电路安装到基板上，基本上位于开口的中心，使得开口的一部分被集成电路覆盖。 密封剂封装集成电路，其中一部分密封剂在衬底的两个表面之间延伸并附接到集成电路的下表面。
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公开(公告)号：US6060777A
公开(公告)日：2000-05-09
申请号：US119863
申请日：1998-07-21
IPC分类号： H01L23/31 , H01L23/367 , H05K1/02 , H05K1/18 , H01L23/10
CPC分类号： H05K1/021 , H01L23/3128 , H01L23/3677 , H05K1/0204 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8547 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H05K1/182 , H05K2201/10416 , H05K2201/10734
摘要： An integrated circuit package which includes an integrated circuit that is attached to a first side of a substrate. The package may also have a solder ball and a heat slug that are both attached to a second side of the substrate. The heat slug and solder ball can be attached to a printed circuit board. The heat slug can provide a thermal path from the substrate to the circuit board which has a relatively wide area. The wide area reduces the thermal impedance and the junction temperatures of the integrated circuit for a given amount of heat.
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