公开(公告)号：US08937326B2

公开(公告)日：2015-01-20

申请号：US13033702

申请日：2011-02-24

申请人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

发明人： Chung Hoon Lee ,  Keon Young Lee ,  Hong San Kim ,  Dae Won Kim ,  Hyuck Jung Choi

IPC分类号： H01L33/62 ,  H01L27/15 ,  F21K99/00 ,  H01L33/48 ,  H01L33/64

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

摘要翻译： 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US08492775B2

公开(公告)日：2013-07-23

申请号：US13472236

申请日：2012-05-15

申请人： Chung-Hoon Lee ,  Keon-Young Lee ,  Lacroix Yves

发明人： Chung-Hoon Lee ,  Keon-Young Lee ,  Lacroix Yves

IPC分类号： H01L27/15

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a light emitting device including a light emitting element having a plurality of light emitting cells arranged on a substrate, a first electrode arranged on each light emitting cell of the plurality of light emitting cells, a second electrode arranged between the substrate and each light emitting cell of the plurality of light emitting cells, the second electrode being disposed to face the first electrode. The light emitting device also includes a conductive material electrically connecting the second electrode arranged under a first light emitting cell of the plurality of light emitting cells to the first electrode arranged on an adjacent second light emitting cell of the plurality of light emitting cells, and a control unit configured to control waveforms of a voltage and a current applied to the light emitting element.

摘要翻译： 本发明涉及一种发光装置，其包括发光元件，该发光元件具有布置在基板上的多个发光单元，布置在多个发光单元的每个发光单元上的第一电极，布置在基板之间的第二电极 和所述多个发光单元中的每个发光单元，所述第二电极被设置为面对所述第一电极。 发光装置还包括导电材料，电连接布置在多个发光单元的第一发光单元下面的第二电极到布置在多个发光单元的相邻的第二发光单元上的第一电极，以及 控制单元，被配置为控制施加到所述发光元件的电压和电流的波形。

公开(公告)号：US07901113B2

公开(公告)日：2011-03-08

申请号：US12730856

申请日：2010-03-24

申请人： Do-Hyung Kim ,  Chung-Hoon Lee ,  Keon-Young Lee ,  Kwang-Il Park

发明人： Do-Hyung Kim ,  Chung-Hoon Lee ,  Keon-Young Lee ,  Kwang-Il Park

IPC分类号： F21V5/00

CPC分类号： G02B19/0071 ,  G02B19/0028 ,  G02B19/0061 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/19107 ,  H01L2924/00014

摘要： The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.

摘要翻译： 本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面 形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。 根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。 此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率 和镜头的制造成本。

公开(公告)号：US20090036134A1

公开(公告)日：2009-02-05

申请号：US12176944

申请日：2008-07-21

申请人： Dong Won RYU ,  Keon Young LEE

发明人： Dong Won RYU ,  Keon Young LEE

IPC分类号： H04Q7/20

CPC分类号： H04W36/14 ,  H04W8/22

摘要： A revision level notification method and system for a mobile station is provided for facilitating a handover between networks of different generations. The revision level notification method for an inter-generation handover includes detecting a handover trigger event for a handover from a first network to a second network, setting a protocol version in association with the first network, receiving a classmark enquiry message from the second network, and transmitting a classmark change message containing a revision level of a mobile station obtained with reference to the protocol version to the second network in response to the classmark enquiry message.

摘要翻译： 提供了一种用于移动台的修订级别通知方法和系统，用于促进不同代的网络之间的切换。 用于跨代切换的修订级别通知方法包括检测用于从第一网络到第二网络的切换的切换触发事件，设置与第一网络相关联的协议版本，从第二网络接收到类标识查询消息， 以及响应于所述等级标识查询消息，向所述第二网络发送包含参考所述协议版本而获得的移动台的修订级别的类别标记改变消息。

公开(公告)号：US20080303052A1

公开(公告)日：2008-12-11

申请号：US12196028

申请日：2008-08-21

申请人： Chung Hoon LEE ,  Do Hyung KIM ,  Keon-Young LEE

发明人： Chung Hoon LEE ,  Do Hyung KIM ,  Keon-Young LEE

IPC分类号： H01L33/00

CPC分类号： H01L33/52 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.

摘要翻译： 公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子。 一对引线端子的至少一部分嵌入在封装主体中。 包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。 第一模塑树脂覆盖LED芯片。 具有比第一模塑树脂硬度更高的第二模塑树脂覆盖第一模塑树脂。 因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

公开(公告)号：US08569961B2

公开(公告)日：2013-10-29

申请号：US12945295

申请日：2010-11-12

申请人： Keon Young Lee ,  Choong Hae Lee

发明人： Keon Young Lee ,  Choong Hae Lee

IPC分类号： H05B37/02

CPC分类号： H05B33/0806 ,  H05B33/0821 ,  H05B33/089

摘要： Provided is an AC LED light emitting device. The AC LED light emitting device flows a current to at least one AC LED array among at least two AC LED arrays of an AC LED light emitting unit to turn it on during one period of an AC power having sine wave characteristics if a magnitude of a voltage applied to the AC LED light emitting unit including at least two AC LED arrays each of which including at least one AC LED is smaller than a turn-on voltage determined according to the number of AC LED arrays of the AC LED light emitting unit. If the magnitude of the voltage applied to the AC LED light emitting unit is larger than the turn-on voltage of the AC LED light emitting unit, all of the AC LED arrays of the AC LED light emitting unit are turned on.

摘要翻译： 提供了一种AC LED发光装置。 交流LED发光装置将电流流向AC LED发光单元的至少两个AC LED阵列中的至少一个AC LED阵列，以在具有正弦波特性的AC功率的一个周期内将其导通， 施加到包括至少两个包括至少一个AC LED的至少两个AC LED阵列的AC LED发光单元的电压小于根据AC LED发光单元的AC LED阵列的数量确定的导通电压。 如果施加到AC LED发光单元的电压的大小大于AC LED发光单元的接通电压，则AC LED发光单元的所有AC LED阵列都被接通。

公开(公告)号：US20120235583A1

公开(公告)日：2012-09-20

申请号：US13472236

申请日：2012-05-15

申请人： Chung-Hoon LEE ,  Keon-Young LEE ,  Lacroix YVES

发明人： Chung-Hoon LEE ,  Keon-Young LEE ,  Lacroix YVES

IPC分类号： H05B37/02

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a light emitting device including a light emitting element having a plurality of light emitting cells arranged on a substrate, a first electrode arranged on each light emitting cell of the plurality of light emitting cells, a second electrode arranged between the substrate and each light emitting cell of the plurality of light emitting cells, the second electrode being disposed to face the first electrode. The light emitting device also includes a conductive material electrically connecting the second electrode arranged under a first light emitting cell of the plurality of light emitting cells to the first electrode arranged on an adjacent second light emitting cell of the plurality of light emitting cells, and a control unit configured to control waveforms of a voltage and a current applied to the light emitting element.

摘要翻译： 本发明涉及一种发光装置，其包括发光元件，该发光元件具有布置在基板上的多个发光单元，布置在多个发光单元的每个发光单元上的第一电极，布置在基板之间的第二电极 和所述多个发光单元中的每个发光单元，所述第二电极被设置为面对所述第一电极。 发光装置还包括导电材料，电连接布置在多个发光单元的第一发光单元下面的第二电极到布置在多个发光单元的相邻的第二发光单元上的第一电极，以及 控制单元，被配置为控制施加到所述发光元件的电压和电流的波形。

公开(公告)号：US08168988B2

公开(公告)日：2012-05-01

申请号：US12911342

申请日：2010-10-25

申请人： Chung-Hoon Lee ,  Keon-Young Lee ,  Lacroix Yves

发明人： Chung-Hoon Lee ,  Keon-Young Lee ,  Lacroix Yves

IPC分类号： H01L27/15

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.

摘要翻译： 本发明涉及具有排列单元的发光元件，其制造方法和使用其的发光器件。 本发明提供一种发光元件及其制造方法，所述发光元件包括发光单元块，所述发光单元块具有串联或并联连接在单个基板上的多个发光单元，其中，所述多个发光单元中的每一个包括 N型半导体层和P型半导体层，并且一个发光单元的N型半导体层电连接到另一相邻发光单元的P型半导体层。 此外，本发明提供一种发光装置，其包括具有串联连接的多个发光单元的发光元件。 因此，能够简化能够与家用AC电源一起使用的照明用发光元件的制造工序，能够减少在制造照明用发光元件时发生的不合格率，并大量生产光 用于照明的发光装置。 此外，通过在发光元件外部设置预定的整流电路，可以提高交流动作的直流驱动效率。

公开(公告)号：US20120097996A1

公开(公告)日：2012-04-26

申请号：US13341659

申请日：2011-12-30

申请人： Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

发明人： Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

IPC分类号： H01L27/15

CPC分类号： H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

摘要翻译： 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US20100109031A1

公开(公告)日：2010-05-06

申请号：US12685145

申请日：2010-01-11

申请人： Chung-Hoon LEE ,  Keon-Young LEE ,  Lacroix YVES

发明人： Chung-Hoon LEE ,  Keon-Young LEE ,  Lacroix YVES

IPC分类号： H01L27/15 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.

摘要翻译： 本发明涉及具有排列单元的发光元件，其制造方法和使用其的发光器件。 本发明提供一种发光元件及其制造方法，所述发光元件包括发光单元块，所述发光单元块具有串联或并联连接在单个基板上的多个发光单元，其中，所述多个发光单元中的每一个包括 N型半导体层和P型半导体层，并且一个发光单元的N型半导体层电连接到另一相邻发光单元的P型半导体层。 此外，本发明提供一种发光装置，其包括具有串联连接的多个发光单元的发光元件。 因此，能够简化能够与家用AC电源一起使用的照明用发光元件的制造工序，能够减少在制造照明用发光元件时发生的不合格率，并大量生产光 用于照明的发光装置。 此外，通过在发光元件外部设置预定的整流电路，可以提高交流动作的直流驱动效率。