公开(公告)号：US5387493A

公开(公告)日：1995-02-07

申请号：US599428

申请日：1990-10-18

Applicant: Shinichiro Imabayashi ,  Hitoshi Oka ,  Isamu Tanaka ,  Hiroshi Kikuchi ,  Makio Watanabe

Inventor： Shinichiro Imabayashi ,  Hitoshi Oka ,  Isamu Tanaka ,  Hiroshi Kikuchi ,  Makio Watanabe

IPC: G03F7/027 ,  G03F7/004 ,  G03F7/028 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  G03C1/492

CPC classification number: H05K3/185 ,  G03F7/004 ,  G03F7/028 ,  H05K3/4661 ,  H05K2201/0145 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602

Abstract: A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

Abstract translation: 用于形成导体图案的树脂组合物，其包含光固化树脂，光聚合引发剂，热固性树脂，热固性树脂的试剂，光敏半导体颗粒，并且如果需要，多官能不饱和化合物适合于在构型中形成非常细的导体图案， up方法。

公开(公告)号：US4524369A

公开(公告)日：1985-06-18

申请号：US391374

申请日：1982-06-23

Applicant: Masaaki Sato ,  Aizo Kaneda ,  Makio Watanabe

Inventor： Masaaki Sato ,  Aizo Kaneda ,  Makio Watanabe

IPC: B41M5/26 ,  G11B7/24 ,  G11B7/243 ,  G11B7/253 ,  G11B7/26 ,  G01D15/34

CPC classification number: G11B7/26 ,  G11B7/2533 ,  G11B7/2433 ,  G11B7/2536

Abstract: A plastic information-recording medium comprises a pair of juxtaposed transparent plastic substrates molded from a composition, which is comprised of a copolymer consisting of 5 to 25% by weight of acrylonitrile or methacrylonitrile and 95 to 75% by weight of at least one of other monomers copolymerizable with acrylonitrile or methacrylonitrile than styrene or a styrene derivative, or a composition comprising at least 70% by weight of the copolymer and at most 30% by weight of butadiene rubber, and has a clearance between the substrates, the clearance being gas-tightly blocked from an outside atmosphere by joining the substrates together at peripheral edges thereof, and a recording film being provided on each of clearance-facing sides of the substrates.

Abstract translation: 塑料信息记录介质包括由组合物模制的一对并置的透明塑料基材，该组合物由共聚物组成，该共聚物由5至25重量％的丙烯腈或甲基丙烯腈和95至75重量％的其它至少一种 可与苯乙烯或苯乙烯衍生物共聚的单体与丙烯腈或甲基丙烯腈共聚的单体，或包含共聚物的至少70重量％和至多30重量％的丁二烯橡胶的组合物，并且在基材之间具有间隙， 通过在其周边边缘处将基板接合在一起而与外部气氛紧密地阻挡，并且在基板的面向两侧的每个上设置有记录膜。

公开(公告)号：US5480048A

公开(公告)日：1996-01-02

申请号：US113983

申请日：1993-08-30

Applicant: Naoya Kitamura ,  Hisashi Sugiyama ,  Yoshihide Yamaguchi ,  Masayuki Kyoui ,  Hideyasu Murooka ,  Ryoji Iwamura ,  Makio Watanabe

Inventor： Naoya Kitamura ,  Hisashi Sugiyama ,  Yoshihide Yamaguchi ,  Masayuki Kyoui ,  Hideyasu Murooka ,  Ryoji Iwamura ,  Makio Watanabe

IPC: H01L21/48 ,  H05K3/10 ,  H05K3/24 ,  H05K3/42 ,  H05K3/46 ,  B44C1/22 ,  B29C37/00

CPC classification number: H01L21/4857 ,  H05K3/4647 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K3/108 ,  H05K3/243 ,  H05K3/427 ,  H05K3/4602

Abstract: A multilayer wiring board fabricating method and a multilayer wiring board fabricated with use of the method that a solvent-free fluid polymer precursor is put on a wiring layer of a base substrate, and space among the wirings is exhausted and is filled with the precursor, and the precursor is hardened under a hydrostatic pressure and then the next wiring layer is formed before the above process is repeated one or more times. The multilayer wiring board fabricating method is excellent in the mass productivity and low cost and in that the wiring can be made highly dense with the substrate having vertical via conductors for connection among the conductor layers.

Abstract translation: 使用将无溶剂的流体聚合物前体放在基底基板的布线层上的方法制造的多层布线板制造方法和多层布线板，并且布线之间的空间被排出并填充有前体， 并且在静水压力下将前体硬化，然后在上述过程重复一次或多次之前形成下一个布线层。 多层布线板的制造方法在质量生产率和低成本方面都是优异的，并且通过具有用于连接导体层之间的垂直通孔导体的基板，可以使布线高密度化。

公开(公告)号：US4194556A

公开(公告)日：1980-03-25

申请号：US886359

申请日：1978-03-14

Applicant: Makio Watanabe ,  Kaneyosi Aoyama ,  Makoto Shinohara

Inventor： Makio Watanabe ,  Kaneyosi Aoyama ,  Makoto Shinohara

IPC: F01P11/10 ,  F01P5/06 ,  F28D21/00

CPC classification number: F01P5/06

Abstract: Disclosed is a construction of a fan shroud for a fan assembly in an internal combustion engine. The fan shroud operates to direct a flow of air generated by the rotation of the fan so that the flow is effectively passed through the radiator core. The fan shroud has an upper portion which is located above the level of the radiator core. The upper portion has, at the end facing the engine body a cut out portion which operates to decrease the amount of air flow passed through the shroud at a position located above the level of the radiator core. It is thus possible to obtain a fan apparatus of low operational noise, which can operate to generate a sufficient amount of flow of air passed through the radiator core for cooling the engine.

Abstract translation: 公开了一种用于内燃机中的风扇组件的风扇罩的结构。 风扇护罩操作以引导由风扇的旋转产生的空气流，使得流动被有效地通过散热器芯。 风扇罩具有位于散热器芯的水平面上方的上部。 上部在面向发动机主体的端部处具有切口部分，该切口部分用于减小在位于散热器芯体的高度之上的位置处通过护罩的气流量。 因此，可以获得低操作噪声的风扇装置，其可以操作以产生通过散热器芯的足够的空气流来冷却发动机。

公开(公告)号：US5268255A

公开(公告)日：1993-12-07

申请号：US767893

申请日：1991-09-30

Applicant: Hiroshi Kikuchi ,  Makio Watanabe ,  Shinichiro Imabayashi ,  Reiko Yano ,  Isamu Tanaka ,  Hitoshi Oka ,  Yukihiro Taniguchi ,  Shigeru Fujita

Inventor： Hiroshi Kikuchi ,  Makio Watanabe ,  Shinichiro Imabayashi ,  Reiko Yano ,  Isamu Tanaka ,  Hitoshi Oka ,  Yukihiro Taniguchi ,  Shigeru Fujita

IPC: C08G59/00 ,  C08F2/50 ,  C08F283/10 ,  C08G59/18 ,  C08G59/50 ,  C08L63/00 ,  G03F1/00 ,  G03F7/027 ,  G03F7/031 ,  G03F7/032 ,  G03F7/038 ,  H05K3/06 ,  H05K3/18 ,  H05K3/28 ,  G03F7/004

CPC classification number: H05K3/287 ,  C08F283/10 ,  C08G59/5046 ,  G03F7/032 ,  Y10S430/119

Abstract: A printed circuit board has a resist layer made from a photo-setting resist composition containing:(A) a polyfunctional unsaturated compound which is solid at room temperature,(B) a polyfunctional unsaturated compound which is liquid at room temperature,(C) a photopolymerization initiator,(D) an epoxy resin,(E) at least one member selected from the group consisting of:(i) a curing agent for the epoxy resin and either melamine or the derivative thereof, and(ii) a compound having a 2,4-diamino-s-triazine ring and an imidazole ring in the molecule.

Abstract translation: 印刷电路板具有由光固化抗蚀剂组合物制成的抗蚀剂层，其含有：（A）在室温下为固体的多官能不饱和化合物，（B）室温下为液体的多官能不饱和化合物，（C） 光聚合引发剂，（D）环氧树脂，（E）选自以下的至少一种：（i）环氧树脂用固化剂和三聚氰胺或其衍生物，和（ii）具有 2,4-二氨基-s-三嗪环和咪唑环。

公开(公告)号：US5091283A

公开(公告)日：1992-02-25

申请号：US499706

申请日：1990-03-27

Applicant: Isamu Tanaka ,  Hitoshi Oka ,  Makio Watanabe ,  Hiroshi Kikuchi ,  Shinichiro Imabayashi ,  Yukihiro Taniguti

Inventor： Isamu Tanaka ,  Hitoshi Oka ,  Makio Watanabe ,  Hiroshi Kikuchi ,  Shinichiro Imabayashi ,  Yukihiro Taniguti

IPC: C08L31/08 ,  C08F290/00 ,  C08F299/00 ,  C08G59/00 ,  C08G59/40 ,  G03F7/028 ,  G03F7/038 ,  H05K3/28

CPC classification number: G03F7/028 ,  G03F7/038 ,  H05K3/287 ,  Y10S430/119

Abstract: A photo curable diallyl phthalate resin composition characterized by containing 0.1 to 10 parts by weight of an agent for preventing back side undesirable curing and 20 to 100 parts by weight of a filler per 100 parts by weight of a diallyl phthalate prepolymer is particularly suitable for a partly additive process for forming a solder resist effective for preventing back side undesirable curing by ultraviolet light and having resistance to release of substances from the solder resist for deteriorating properties of plated copper film as well as for giving good mechanical properties.

Abstract translation: 一种可光固化的邻苯二甲酸二烯丙酯树脂组合物，其特征在于，相对于100重量份的邻苯二甲酸二烯丙酯预聚物，含有0.1〜10重量份的防止背面不良固化的试剂和20〜100重量份的填料，特别适用于 用于形成阻焊剂的部分添加方法，其有效防止紫外线的背面不期望的固化，并且具有抵抗电阻铜的物质释放的性能，以降低电镀铜膜的性能以及提供良好的机械性能。