公开(公告)号：US08416575B2

公开(公告)日：2013-04-09

申请号：US11755076

申请日：2007-05-30

申请人： Hisashi Sato ,  Yuichi Ishida ,  Masaaki Ishiguro ,  Kazuaki Nakamura

发明人： Hisashi Sato ,  Yuichi Ishida ,  Masaaki Ishiguro ,  Kazuaki Nakamura

IPC分类号： H05K7/20

CPC分类号： H05K7/026 ,  H01R9/226 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0382 ,  H05K2201/092

摘要： An electrical component is mounted a circuit board. A case covers the circuit board. The circuit board includes a plate-like metal core and an insulation portion. The insulation portion covers a surface of the metal core. The metal core is provided with a heat radiation portion exposed from the case.

摘要翻译： 电气部件安装有电路板。 案例涵盖电路板。 电路板包括板状金属芯和绝缘部。 绝缘部分覆盖金属芯的表面。 金属芯设置有从壳体露出的散热部。

公开(公告)号：US07652381B2

公开(公告)日：2010-01-26

申请号：US11055578

申请日：2005-02-09

申请人： Kevin P. Grundy ,  Joseph C. Fjelstad ,  Gary Yasumura ,  William F. Wiedemann ,  Para K. Segaram

发明人： Kevin P. Grundy ,  Joseph C. Fjelstad ,  Gary Yasumura ,  William F. Wiedemann ,  Para K. Segaram

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

摘要翻译： 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。

公开(公告)号：US07180397B1

公开(公告)日：2007-02-20

申请号：US10783073

申请日：2004-02-20

申请人： Galliano R. Busletta ,  Robert J. Roessler

发明人： Galliano R. Busletta ,  Robert J. Roessler

IPC分类号： H01F5/00

CPC分类号： H05K1/165 ,  H01F2027/2819 ,  H05K3/429 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2201/09645

摘要： The present invention provides a PWB for attaching electrical components thereto. The PWB includes a stack of insulating layers, conductive layers located between the insulating layers, wherein the conductive layers terminate at an edge of the PWB, and an edge plate interconnect located on the edge. The edge plate interconnect is free of a complementary via and contacts and electrically interconnects the conductive layers. The present invention also provides a method of making the PWB and also provides a power converter implementing the edge plate interconnects.

公开(公告)号：US20050189640A1

公开(公告)日：2005-09-01

申请号：US11055578

申请日：2005-02-09

申请人： Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

发明人： Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

IPC分类号： H01L23/02 ,  H01L23/13 ,  H01L23/31 ,  H01L25/10 ,  H05K1/18 ,  H05K3/40

CPC分类号： H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

摘要翻译： 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。

公开(公告)号：US06178093B1

公开(公告)日：2001-01-23

申请号：US09033617

申请日：1998-03-03

申请人： Anilkumar Chinuprasad Bhatt ,  Donald Herman Glatzel ,  Allen F. Moring ,  Voya Rista Markovich ,  Kostas Papathomas ,  David John Russell

发明人： Anilkumar Chinuprasad Bhatt ,  Donald Herman Glatzel ,  Allen F. Moring ,  Voya Rista Markovich ,  Kostas Papathomas ,  David John Russell

IPC分类号： H05K111

CPC分类号： H05K3/4652 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/12044 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/246 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/092 ,  H05K2201/0959 ,  H05K2203/0191 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0554 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/249996 ,  H01L2924/00014 ,  H01L2924/00

摘要： An information handling system is provided which comprises: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer, wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling said at least one hole within said first dielectric photoresist layer; a second wiring layer positioned on said first dielectric photoresist layer; wherein said second wiring layer includes a plurality of conductive pads as part thereof; and at least one external component electrically coupled to said conductive pads of said second wiring layer.

摘要翻译： 提供了一种信息处理系统，包括：金属外壳; 位于所述金属外壳内的至少一个电路组件，所述电路组件包括具有至少一个电介质内层的电路化基板，其包括第一表面和至少一个孔; 用于向所述金属外壳内的所述电路化基板提供电力的装置; 填充材料，其中所述填充材料基本上填充所述至少一个电介质内层中的所述至少一个孔; 位于所述至少一个电介质内层的所述第一表面上的第一布线层，其中所述第一布线层基本上覆盖其中具有所述填充材料的所述至少一个孔，所述第一布线层有助于将所述填充材料保持在所述至少一个 在所述至少一个电介质内层中的一个孔; 位于所述第一布线层和所述至少一个电介质内层的所述第一表面上的第一电介质光致抗蚀剂层，其中所述第一电介质光致抗蚀剂层还包括至少一个孔，所述填充材料还基本上填充所述至少一个孔 在所述第一电介质光致抗蚀剂层内; 位于所述第一电介质光致抗蚀剂层上的第二布线层; 其中所述第二布线层包括作为其一部分的多个导电焊盘; 以及电耦合到所述第二布线层的所述导电焊盘的至少一个外部部件。

公开(公告)号：US5387493A

公开(公告)日：1995-02-07

申请号：US599428

申请日：1990-10-18

申请人： Shinichiro Imabayashi ,  Hitoshi Oka ,  Isamu Tanaka ,  Hiroshi Kikuchi ,  Makio Watanabe

发明人： Shinichiro Imabayashi ,  Hitoshi Oka ,  Isamu Tanaka ,  Hiroshi Kikuchi ,  Makio Watanabe

IPC分类号： G03F7/027 ,  G03F7/004 ,  G03F7/028 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  G03C1/492

CPC分类号： H05K3/185 ,  G03F7/004 ,  G03F7/028 ,  H05K3/4661 ,  H05K2201/0145 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602

摘要： A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

摘要翻译： 用于形成导体图案的树脂组合物，其包含光固化树脂，光聚合引发剂，热固性树脂，热固性树脂的试剂，光敏半导体颗粒，并且如果需要，多官能不饱和化合物适合于在构型中形成非常细的导体图案， up方法。

公开(公告)号：US4187339A

公开(公告)日：1980-02-05

申请号：US938104

申请日：1978-08-30

申请人： Pierre-Henri Cayrol

发明人： Pierre-Henri Cayrol

IPC分类号： H01R12/51 ,  H05K1/09 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00 ,  B32B5/16

CPC分类号： H05K3/4664 ,  H05K1/095 ,  H05K2201/092 ,  H05K3/42 ,  H05K3/4602 ,  Y10S428/901 ,  Y10T29/49142 ,  Y10T29/49155 ,  Y10T428/24802 ,  Y10T428/24876 ,  Y10T428/24893 ,  Y10T428/24909 ,  Y10T428/24917

摘要： A printed circuit has additional connections formed on one of its faces by depositing beads of conductive resin on that face. The conductive beads are covered by an insulating coating, and, if required, further conductive beads may be deposited on the insulating coating formed on the first beads.

摘要翻译： 印刷电路通过在该表面上沉积导电树脂珠而在其一个表面上形成附加连接。 导电珠被绝缘涂层覆盖，如果需要，可以在形成在第一珠上的绝缘涂层上沉积另外的导电珠。

公开(公告)号：US09030007B2

公开(公告)日：2015-05-12

申请号：US12903403

申请日：2010-10-13

申请人： Daisuke Mizutani

发明人： Daisuke Mizutani

IPC分类号： H01L23/48 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L21/768 ,  H05K1/02 ,  H05K3/22

CPC分类号： H05K1/147 ,  H01L21/76898 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/222 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor device includes a first circuit base member including a surface having multiple first electrodes formed thereon, a second circuit base member being provided above the first circuit base member and having first through holes and second through holes formed respectively above the first electrodes, a semiconductor package provided above the second circuit base member, and multiple first bumps provided inside the first through holes and the second through holes to connect the first electrodes to the semiconductor package.

摘要翻译： 半导体器件包括：第一电路基体部件，其包括形成有多个第一电极的表面;第二电路基体部件，设置在第一电路基体的上方，并具有分别形成在第一电极上方的第一通孔和第二通孔; 设置在第二电路基体上方的封装，以及设置在第一通孔内的多个第一凸起和第二通孔，以将第一电极连接到半导体封装。

公开(公告)号：US08698283B2

公开(公告)日：2014-04-15

申请号：US13626116

申请日：2012-09-25

申请人： SK Hynix Inc.

发明人： Min Suk Suh

IPC分类号： H01L23/48

CPC分类号： H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13021 ,  H01L2224/13025 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/183 ,  H05K1/184 ,  H05K2201/092 ,  H05K2201/10674 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package includes a substrate including a substrate body having a first face and a second face opposing the first face. A first through electrode passes through the substrate body between the first face and the second face. An insulation member is disposed over the first face; and a connection member having a first conductive unit disposed inside of the insulation member is electrically connected to the first through electrode, and a second conductive unit electrically connected to the first conductive unit is exposed at side faces of the insulation member. A semiconductor chip having third and fourth faces is disposed over the first face of the substrate body in a vertical direction. A second through electrode passes through the substrate body between the third and fourth faces and is electrically connected to the second conductive unit.

摘要翻译： 半导体封装包括：衬底，其包括具有第一面的衬底主体和与第一面相对的第二面。 第一穿透电极在第一面和第二面之间通过衬底本体。 绝缘构件设置在第一面上; 并且具有设置在所述绝缘构件内部的第一导电单元的连接构件与所述第一通孔电连接，并且与所述第一导电单元电连接的第二导电单元在所述绝缘构件的侧面露出。 具有第三和第四面的半导体芯片在垂直方向上设置在基板主体的第一面上。 第二穿透电极在第三和第四面之间通过衬底主体并且电连接到第二导电单元。

公开(公告)号：US20130020683A1

公开(公告)日：2013-01-24

申请号：US13626116

申请日：2012-09-25

申请人： HYNIX SEMICONDUCTOR INC.

发明人： Min Suk SUH

IPC分类号： H01L23/48

CPC分类号： H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13021 ,  H01L2224/13025 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/183 ,  H05K1/184 ,  H05K2201/092 ,  H05K2201/10674 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package includes a substrate including a substrate body having a first face and a second face opposing the first face. A first through electrode passes through the substrate body between the first face and the second face. An insulation member is disposed over the first face; and a connection member having a first conductive unit disposed inside of the insulation member is electrically connected to the first through electrode, and a second conductive unit electrically connected to the first conductive unit is exposed at side faces of the insulation member. A semiconductor chip having third and fourth faces is disposed over the first face of the substrate body in a vertical direction. A second through electrode passes through the substrate body between the third and fourth faces and is electrically connected to the second conductive unit.

摘要翻译： 半导体封装包括：衬底，其包括具有第一面的衬底主体和与第一面相对的第二面。 第一穿透电极在第一面和第二面之间通过衬底本体。 绝缘构件设置在第一面上; 并且具有设置在所述绝缘构件内部的第一导电单元的连接构件与所述第一通孔电连接，并且与所述第一导电单元电连接的第二导电单元在所述绝缘构件的侧面露出。 具有第三和第四面的半导体芯片在垂直方向上设置在基板主体的第一面上。 第二穿透电极在第三和第四面之间通过衬底主体并且电连接到第二导电单元。