公开(公告)号：US06926561B1

公开(公告)日：2005-08-09

申请号：US10139928

申请日：2002-05-07

Applicant: Martin R. Handforth ,  John J. Stankus

Inventor： Martin R. Handforth ,  John J. Stankus

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H01R24/00

CPC classification number: H05K1/117 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/0919 ,  H05K2201/09845

Abstract: A connector assembly includes a substrate assembly and a receptacle. The substrate assembly includes a first substrate layer having a conductive trace that is accessible for direct electrical interconnection with a first conductor associated with another device. A second substrate layer on the assembly includes an electrical contact for electrical interconnection with a second conductor associated with the other device. The electrical contact on the second substrate layer is disposed such that when the substrate assembly is inserted into the receptacle, the electrical contact is electrically connected with the second conductor, a direct electrical interconnection between the conductive trace and the first conductor is maintained. The arrangement is advantageous in that the connector assembly is capable of transmitting low frequency signals through electrical connections that also serve to maintain a high frequency direct electrical interconnection.

Abstract translation: 连接器组件包括基板组件和插座。 衬底组件包括具有导电迹线的第一衬底层，该导电迹线可用于与与另一器件相关联的第一导体的直接电互连。 组件上的第二衬底层包括用于与与另一个器件相关联的第二导体的电互连的电接触件。 第二基板层上的电接触被布置成使得当基板组件插入插座时，电接触件与第二导体电连接，维持导电迹线和第一导体之间的直接电互连。 该装置的优点在于，连接器组件能够通过也用于维持高频直接电互连的电连接来传输低频信号。

公开(公告)号：US4514595A

公开(公告)日：1985-04-30

申请号：US386871

申请日：1982-06-10

Applicant: Stanley D. Rosenbaum ,  Martin R. Handforth

Inventor： Stanley D. Rosenbaum ,  Martin R. Handforth

IPC: H04M19/00 ,  H04M1/74 ,  H04M1/76

CPC classification number: H04M19/005

Abstract: A line circuit includes tip and ring voltage amplifiers each having an output resistively connected via tip and ring feed resistors to tip and ring leads in a telephone line. The tip and ring feed resistors have closely matched ohmic values, and are part of a resistance network which also includes first and second voltage dividers. The first voltage divider is connected in series between the output of the tip voltage amplifier and an end of the ring feed resistor remote from the output of the ring voltage amplifier, and includes a first voltage tap. The second voltage divider is connected in series between the output of the ring voltage amplifier and an end of the tip feed resistor remote from the output of the tip voltage amplifier, and includes a second voltage tap. A control circuit includes a differential input connected across the first and second voltage taps. In operation the control circuit causes the tip and ring voltage amplifiers to provide energizing direct current for the telephone line. Tip and ring feedback networks, connected across the respective tip and ring feed resistors, provide feedback signals to the tip and ring voltage amplifiers such that in operation common mode rejection of longitudinally induced a.c. signals on the telephone line is enhanced.

Abstract translation: 线路电路包括尖端和环形电压放大器，每个端子和环路电压放大器各自具有通过尖端的输出电阻连接和环形馈电电阻器到电话线中的尖端和环形引线。 尖端和环形馈电电阻器具有紧密匹配的欧姆值，并且是电阻网络的一部分，其还包括第一和第二分压器。 第一分压器串联连接在尖端电压放大器的输出端和远离环形电压放大器的输出的环形馈电电阻的端部之间，并且包括第一电压抽头。 第二分压器串联连接在环形电压放大器的输出端和尖端馈电电阻的端部之间，远离尖端电压放大器的输出，并且包括第二电压抽头。 控制电路包括跨越第一和第二电压抽头连接的差分输入。 在操作中，控制电路使尖端和环形电压放大器为电话线路提供激励直流电。 尖端和环形反馈网络，连接在相应的尖端和环形馈电电阻上，向尖端和环形电压放大器提供反馈信号，使得在操作中的纵向感应交流电流的共模抑制。 电话线上的信号增强。

公开(公告)号：US06972647B1

公开(公告)日：2005-12-06

申请号：US10420733

申请日：2003-04-23

Applicant: Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

Inventor： Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

IPC: H01P3/08 ,  H05K1/00 ,  H05K1/02

CPC classification number: H01P3/085 ,  H01P3/088 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0298 ,  H05K2201/0715

Abstract: A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.

公开(公告)号：US06608258B1

公开(公告)日：2003-08-19

申请号：US09749409

申请日：2000-12-28

Applicant: Herman Kwong ,  Richard R. Goulette ,  Martin R. Handforth

Inventor： Herman Kwong ,  Richard R. Goulette ,  Martin R. Handforth

IPC: H05K100

CPC classification number: H05K1/14 ,  H05K1/0239 ,  Y10T29/49126

Abstract: A technique for electrically interconnecting a signal between a first circuit board and a second circuit board is disclosed. In each board, at least one signal conductor is shielded by an electrically conductive shield. Multiple conductors may be shielded by the same shield. A first opening is formed in the electrically conductive shield of the first circuit board and a second opening is formed in the electrically conductive shield of the second circuit board so as to expose the signal conductor in the each circuit board. An electrically conductive adhesive, reflowed solder paste, or interposer/elastomer device is applied surrounding at least one of the openings and may further be applied within at least one of the openings. The first circuit board and the second circuit board are then positioned such that the first opening and the second opening are aligned and a signal propagating along the first signal conductor is electrically interconnected to the second signal conductor.

Abstract translation: 公开了一种用于将第一电路板和第二电路板之间的信号电互连的技术。 在每个板中，至少一个信号导体被导电屏蔽屏蔽。 多个导体可以被同一屏蔽屏蔽。 在第一电路板的导电屏蔽中形成第一开口，并且在第二电路板的导电屏蔽中形成第二开口以暴露每个电路板中的信号导体。 围绕至少一个开口施加导电粘合剂，回流焊膏或插入物/弹性体装置，并且还可以施加在至少一个开口内。 然后将第一电路板和第二电路板定位成使得第一开口和第二开口对齐，并且沿着第一信号导体传播的信号与第二信号导体电互连。

公开(公告)号：US06462957B1

公开(公告)日：2002-10-08

申请号：US09739882

申请日：2000-12-20

Applicant: Herman Kwong ,  Bao Chau L. Nguyen ,  Van C. Au ,  Paul A. Senyshyn ,  Martin R. Handforth ,  Rolf G. Meier ,  Delfin Y. Montuno ,  Ernst A. Munter ,  Hasler R. Hayes

Inventor： Herman Kwong ,  Bao Chau L. Nguyen ,  Van C. Au ,  Paul A. Senyshyn ,  Martin R. Handforth ,  Rolf G. Meier ,  Delfin Y. Montuno ,  Ernst A. Munter ,  Hasler R. Hayes

IPC: H05K714

CPC classification number: H05K1/14 ,  H05K1/0239 ,  H05K7/1445

Abstract: An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.

Abstract translation: 提供了第一电路板和第二电路板之间的改进的电互连。 在一个实施例中，第一电路板具有基本上刚性的电路部分，其具有包括第一信号层的多个电路层和包括第一信号层的第一互连部分，用于与第二电路的第二互连部分配合 板。 第一电路板还包括柔性部分，包括第一信号层，用于将基本刚性的电路部分连接到第一互连部分。 柔性部分允许第一互连部分基本上垂直于基本上刚性的电路部分定向，使得第一互连部分与第二互连部分的配合导致第一电路板和第二电路之间的基本正交的电互连布置 板。

公开(公告)号：US07348494B1

公开(公告)日：2008-03-25

申请号：US09821722

申请日：2001-03-29

Applicant: Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

Inventor： Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

IPC: H05K1/16

CPC classification number: H05K3/368 ,  H01R12/52 ,  H01R12/61 ,  H05K1/0218 ,  H05K1/117 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0715 ,  H05K2201/0919 ,  H05K2201/10598

Abstract: Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by extending the traces beyond the other layers of the printed wiring board. Corresponding conductors associated with the other device are placed in direct physical contact with the exposed inner layer traces, and may be aligned and secured with guide plates, alignment pins and spring members. Such direct connection mitigates the need for vias, and has more favorable electrical characteristics for high frequency signal transmission.

Abstract translation: 暴露多层印刷线路板上的内层迹线，以便能够与诸如印刷电路板的其它器件直接互连。 可以通过去除迹线周围的至少一些电介质基板材料，或者通过将迹线延伸超过印刷线路板的其它层来暴露迹线。 与另一装置相关联的相应的导体被放置成与暴露的内层迹线直接物理接触，并且可以与引导板，对准销和弹簧构件对准和固定。 这种直接连接减轻了对通孔的需要，并且对于高频信号传输具有更有利的电特性。

公开(公告)号：US06949991B1

公开(公告)日：2005-09-27

申请号：US10420734

申请日：2003-04-23

Applicant: Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

Inventor： Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

IPC: H01P3/08 ,  H05K1/00 ,  H05K1/02

CPC classification number: H01P3/085 ,  H01P3/088 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0298 ,  H05K2201/0715

Abstract: A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.

Abstract translation: 公开了一种用于促进多层基板中的高信号频率的信号传输的技术。 在一个实施例中，多层衬底包括导体或一对导体，在导体或一对导体的第一侧上的第一介电层和在导体或导体对的一对导体的第二侧上的第二介电层。 空气通道设置在第一电介质层中，空气通道形成为与导体或一对导体基本共同延伸。 导电屏蔽围绕导体或一对导体，第一介电层和第二介电层，以消除串扰。 导体或导体对可以具有离散的间隔边缘，并且由于空气的低介电常数，可以增加导体或导线对的宽度以调整阻抗。 此外，结构中可以包括附加的空气通道和支撑层。

公开(公告)号：US06885745B1

公开(公告)日：2005-04-26

申请号：US09213271

申请日：1998-12-17

Applicant: Martin R. Handforth ,  Gerard J. Hupe ,  Donald S. McGinn ,  Rolf G. Meier ,  Canute Planthara ,  Raymond K. Wong

Inventor： Martin R. Handforth ,  Gerard J. Hupe ,  Donald S. McGinn ,  Rolf G. Meier ,  Canute Planthara ,  Raymond K. Wong

IPC: H04M3/00 ,  H04M3/18 ,  H04M19/00 ,  H04M3/12

CPC classification number: H04M3/18 ,  H04M3/005 ,  H04M19/001 ,  H04M2201/80

Abstract: A protection arrangement for a telephone subscriber line interface circuit is disclosed. The arrangement is particularly useful for protecting an electronic telephone set from over-voltage and over-current fault conditions. The arrangement provides a FET that operates in saturation mode to connect an office battery to the subscriber line under normal operation. The FET also provides isolation capabilities for protecting the line circuit from an over-current condition on the subscriber line. Over-voltage protection is provided by way of an isolation relay between the line circuit and the subscriber line. Both the FET and isolation relay are operated by a controller that uses timers in the methods of over-voltage and over-current protection that it performs. A further capability of the arrangement is that it resets itself after the fault condition has ended. This feature is particularly useful in the case of fault conditions of short duration.

Abstract translation: 公开了一种用于电话用户线接口电路的保护装置。 该装置对于保护电子电话机免受过电压和过电流故障条件特别有用。 该装置提供了在饱和模式下操作的FET，以在正常操作下将办公室电池连接到用户线路。 FET还提供隔离功能，用于保护线路电路免受用户线上的过电流状态影响。 通过线路电路和用户线路之间的隔离继电器提供过电压保护。 FET和隔离继电器均由控制器操作，控制器使用其执行的过电压和过流保护方法中的定时器。 该装置的另一个能力是在故障状态结束之后它自动复位。 在短时间的故障情况下，该功能特别有用。

公开(公告)号：US5329576A

公开(公告)日：1994-07-12

申请号：US875981

申请日：1992-04-29

Applicant: Martin R. Handforth

Inventor： Martin R. Handforth

IPC: H04B7/26 ,  H04W64/00 ,  H04M11/00 ,  H04B1/00 ,  H04H1/02 ,  H04Q7/00

CPC classification number: H04W64/00 ,  H04B7/26

Abstract: A wireless communication system comprising a plurality of antennae, the antennae being arranged in a grid pattern over a communication region, wireless portable terminals located within the communication region for emitting and/or receiving electromagnetic signals via the antennae, apparatus for determining the position of at least one of the terminals within the communication region relative to the grid pattern.

Abstract translation: 一种包括多个天线的无线通信系统，所述天线在通信区域上以网格图案布置，位于所述通信区域内的用于经由所述天线发射和/或接收电磁信号的无线便携式终端，用于确定所述天线的位置的装置 通信区域内的至少一个终端相对于网格图案。

公开(公告)号：US06876085B1

公开(公告)日：2005-04-05

申请号：US10139982

申请日：2002-05-07

Applicant: Martin R. Handforth ,  John J. Stankus

Inventor： Martin R. Handforth ,  John J. Stankus

IPC: H01R9/05 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H01L23/48 ,  H01R9/00 ,  H01R12/04

CPC classification number: H05K1/117 ,  H01R9/05 ,  H01R12/52 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0298 ,  H05K3/3405 ,  H05K3/361 ,  H05K2201/0919 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/1034

Abstract: An interconnection device has a substrate that includes a conductive trace having an exposed portion at an edge of the substrate. The exposed portion is tapered toward the edge of the substrate. The exposed portion is provided for direct physical contact with a second conductive trace exposed at an edge of a second substrate. A high frequency direct electrical interconnection is thereby provided that reduces the disadvantageous effects of lateral, longitudinal, and co-planar misalignment between the conductive traces.

Abstract translation: 互连器件具有衬底，该衬底包括在衬底的边缘处具有暴露部分的导电迹线。 暴露部分朝向基板的边缘逐渐变细。 暴露部分被提供用于与暴露在第二基底的边缘处的第二导电迹线直接物理接触。 由此提供了高频直接电互连，其减少了导电迹线之间的横向，纵向和共平面的未对准的不利影响。