公开(公告)号：US20130215628A1

公开(公告)日：2013-08-22

申请号：US13882126

申请日：2011-10-27

申请人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

发明人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

IPC分类号： H05K1/03

CPC分类号： H05K1/038 ,  C08J5/24 ,  C08K3/013 ,  C08K3/22 ,  C08K2003/2217 ,  C08K2003/2227 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T442/20 ,  Y10T442/3415 ,  Y10T442/3472 ,  Y10T442/656 ,  Y10T442/659

摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

摘要翻译： 提供了具有优良的导热性，耐热性，钻孔加工性和阻燃性的层压材料。 在通过用热固性树脂组合物浸渍织造或非织造布基材而获得的预浸料中，热固性树脂组合物每100体积份的热固性树脂含有80〜200体积份的无机填料，无机填料含有（A） 平均粒径（D50）为2〜15μm的三水铝矿型氢氧化铝粒子和（B）平均粒径（D50）为0.5〜15μm的氧化镁和三水铝矿型配合比（体积比） 氢氧化铝粒子（A）与氧化镁（B）的摩尔比为1:0.3〜3。

公开(公告)号：US06666752B1

公开(公告)日：2003-12-23

申请号：US09786008

申请日：2001-06-04

申请人： Masayoshi Yamamoto ,  Toshiaki Kasazaki ,  Naoyuki Tani ,  Shinichiro Kawahara ,  Takashi Ando

发明人： Masayoshi Yamamoto ,  Toshiaki Kasazaki ,  Naoyuki Tani ,  Shinichiro Kawahara ,  Takashi Ando

IPC分类号： B24B100

CPC分类号： H01L21/6836 ,  B24B37/30 ,  C08L33/08 ,  C09J7/22 ,  C09J7/26 ,  C09J7/29 ,  C09J7/38 ,  C09J2203/326 ,  C09J2400/243 ,  C09J2433/00 ,  H01L2221/68327

摘要： A wafer retainer includes: a foam layer capable of adsorbing a wafer on a surface thereof in a detachable manner; a first pressure-sensitive adhesive layer formed on a back face of the foam layer; a support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support for adhering to a base plate of a polishing machine; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-chain crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition. The side-chain crystallizable polymer includes as a main component thereof an acrylic acid ester and/or methacrylic acid ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side-chain.

摘要翻译： 晶片保持器包括：能够以可拆卸的方式在其表面上吸附晶片的泡沫层; 形成在泡沫层的背面上的第一压敏粘合剂层; 形成在第一粘合剂层的背面上的支撑体; 第二粘合剂层，形成在所述支撑体的背面上，用于粘附到抛光机的基板; 以及可释放地附接到第二压敏粘合剂层的剥离片。 第二粘合剂层包括粘合剂组合物。 粘合剂组合物包含压敏粘合剂和侧链可结晶聚合物，使得侧链可结晶聚合物以基于粘合剂组合物的约1重量％至约30重量％的量存在。 侧链可结晶聚合物作为主要成分包括具有包含16个或更多个碳原子的直链烷基作为侧链的丙烯酸酯和/或甲基丙烯酸酯。

公开(公告)号：US09730320B2

公开(公告)日：2017-08-08

申请号：US13882126

申请日：2011-10-27

申请人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

发明人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

IPC分类号： H05K1/03 ,  C08J5/24 ,  C08K3/00 ,  C08K3/22

CPC分类号： H05K1/038 ,  C08J5/24 ,  C08K3/013 ,  C08K3/22 ,  C08K2003/2217 ,  C08K2003/2227 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T442/20 ,  Y10T442/3415 ,  Y10T442/3472 ,  Y10T442/656 ,  Y10T442/659

摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

公开(公告)号：US20050179385A1

公开(公告)日：2005-08-18

申请号：US11054951

申请日：2005-02-11

申请人： Osamu Morita ,  Naoyuki Tani ,  Tatsuo Mifune

发明人： Osamu Morita ,  Naoyuki Tani ,  Tatsuo Mifune

IPC分类号： C03C3/072 ,  C03C4/16 ,  H01J11/12 ,  H01J11/14 ,  H01J11/22 ,  H01J11/24 ,  H01J11/26 ,  H01J11/34 ,  H01J11/38 ,  H01J11/44 ,  H01J17/49

CPC分类号： C03C4/16 ,  C03C3/072 ,  H01J11/12 ,  H01J11/38

摘要： In a plasma display panel containing a front plate having an dielectric glass layer for covering display electrodes formed on a transparent substrate, the glass composition forming the dielectric layer contains titanium. The glass composition should preferably contain 0.9-6.7 wt % of TiO2 on the basis of the weight of an oxide, further preferably, contain 2.6-5.5 wt % of TiO2 on the basis of the weight of an oxide.

摘要翻译： 在包含具有用于覆盖形成在透明基板上的显示电极的电介质玻璃层的前板的等离子体显示面板中，形成电介质层的玻璃组合物含有钛。 基于氧化物的重量，玻璃组合物应优选含有0.9-6.7重量％的TiO 2，进一步优选含有2.6-5.5重量％的TiO 2， 基于氧化物的重量。

公开(公告)号：US08603624B2

公开(公告)日：2013-12-10

申请号：US13510770

申请日：2010-10-29

申请人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

发明人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

IPC分类号： B32B15/00

CPC分类号： H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

摘要翻译： 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子， 平均粒径（D50）为2〜15μm，并且含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子 ）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自一组的无机成分（B）的配合比（体积比） 勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

公开(公告)号：US20120228010A1

公开(公告)日：2012-09-13

申请号：US13510770

申请日：2010-10-29

申请人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

发明人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

IPC分类号： H05K1/03 ,  B32B15/08 ,  B32B5/28

CPC分类号： H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

摘要翻译： 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子， 具有2〜15μm的平均粒径（D50），含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子 ）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自基团的无机成分（B）的配合比（体积比） 勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

公开(公告)号：US20120152599A1

公开(公告)日：2012-06-21

申请号：US13392554

申请日：2010-09-02

申请人： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

发明人： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

IPC分类号： H05K1/09 ,  H05K3/06

CPC分类号： H05K3/381 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/2072 ,  H05K2203/0773 ,  Y10T29/49128

摘要： A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.

摘要翻译： 多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。 由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。 通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板 具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

公开(公告)号：US5198064A

公开(公告)日：1993-03-30

申请号：US520458

申请日：1990-05-08

申请人： Naoyuki Tani ,  Kusutaro Yoshida

发明人： Naoyuki Tani ,  Kusutaro Yoshida

IPC分类号： A61L15/58 ,  C09J7/02 ,  C09J7/04

CPC分类号： C09J7/045 ,  C09J7/0207 ,  Y10S602/903 ,  Y10T428/2857 ,  Y10T428/2891 ,  Y10T428/2896

摘要： Process for preparing a permeable adhesive tape which comprises;preparing a dispersion comprising, as a dispersion medium, an organic solvent solution containing a natural or synthetic rubber and/or acrylic pressure sensitive adhesive agent and a polyfunctional isocyanate compound, and at least water and hydrophobic inorganic fine particles and optionally a water absorptive high molecular weight compound dispersed in the organic solvent solution,applying the dispersion directly onto a porous material or impregnating the porous material with the dispersion, thereafter the dispersion-applied or impregnated porous material being dried by heating; or spplying the dispersion onto a releasing sheet, heat drying the dispersion-applied sheet and laminating a porous material on the dispersion-applied surface thereof, thereby providing the permeable adhesive tape in which the permeable adhesive layer and the porous material are integrated.

公开(公告)号：US08866022B2

公开(公告)日：2014-10-21

申请号：US13392554

申请日：2010-09-02

申请人： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

发明人： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/381 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/2072 ,  H05K2203/0773 ,  Y10T29/49128

摘要： A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.

摘要翻译： 多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。 由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。 通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板 具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

公开(公告)号：US06616520B1

公开(公告)日：2003-09-09

申请号：US09786007

申请日：2001-06-04

申请人： Shinichiro Kawahara ,  Toshiaki Kasazaki ,  Naoyuki Tani ,  Takashi Ando ,  Masayoshi Yamamoto

发明人： Shinichiro Kawahara ,  Toshiaki Kasazaki ,  Naoyuki Tani ,  Takashi Ando ,  Masayoshi Yamamoto

IPC分类号： B24D1100

CPC分类号： B24B37/22 ,  B24B37/24 ,  B24D3/004 ,  B24D13/20 ,  C09J7/22 ,  C09J7/26 ,  C09J7/29 ,  C09J7/38 ,  C09J2400/263 ,  C09J2433/00

摘要： A polishing cloth includes: a polishing cloth substrate; a first-pressure adhesive layer formed on a back face of the polishing cloth substrate; as support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-china crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition. The side-chain crystallizable polymer includes as a main component thereof an acrylic acid ester and/or methacrylic acid ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side chain.

摘要翻译： 抛光布包括：抛光布基材; 形成在所述研磨布基材的背面上的第一压力粘合剂层; 作为形成在第一压敏粘合剂层的背面上的支撑体; 形成在所述支撑体的背面上的第二压敏粘合剂层; 以及可释放地附接到第二压敏粘合剂层的剥离片。 第二粘合剂层包括粘合剂组合物。 粘合剂组合物包含压敏粘合剂和侧链可结晶聚合物，使得侧面可结晶聚合物以基于粘合剂组合物的约1重量％至约30重量％的量存在。 侧链可结晶聚合物作为主要组分包括具有包含16个或更多个碳原子的直链烷基作为侧链的丙烯酸酯和/或甲基丙烯酸酯。