公开(公告)号：US09730320B2

公开(公告)日：2017-08-08

申请号：US13882126

申请日：2011-10-27

申请人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

发明人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

IPC分类号： H05K1/03 ,  C08J5/24 ,  C08K3/00 ,  C08K3/22

CPC分类号： H05K1/038 ,  C08J5/24 ,  C08K3/013 ,  C08K3/22 ,  C08K2003/2217 ,  C08K2003/2227 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T442/20 ,  Y10T442/3415 ,  Y10T442/3472 ,  Y10T442/656 ,  Y10T442/659

摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

公开(公告)号：US08603624B2

公开(公告)日：2013-12-10

申请号：US13510770

申请日：2010-10-29

申请人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

发明人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

IPC分类号： B32B15/00

CPC分类号： H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

摘要翻译： 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子， 平均粒径（D50）为2〜15μm，并且含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子 ）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自一组的无机成分（B）的配合比（体积比） 勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

公开(公告)号：US20120228010A1

公开(公告)日：2012-09-13

申请号：US13510770

申请日：2010-10-29

申请人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

发明人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

IPC分类号： H05K1/03 ,  B32B15/08 ,  B32B5/28

CPC分类号： H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

摘要翻译： 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子， 具有2〜15μm的平均粒径（D50），含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子 ）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自基团的无机成分（B）的配合比（体积比） 勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

公开(公告)号：US20130215628A1

公开(公告)日：2013-08-22

申请号：US13882126

申请日：2011-10-27

申请人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

发明人： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Naoyuki Tani ,  Yoshito Kitagawa

IPC分类号： H05K1/03

CPC分类号： H05K1/038 ,  C08J5/24 ,  C08K3/013 ,  C08K3/22 ,  C08K2003/2217 ,  C08K2003/2227 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T442/20 ,  Y10T442/3415 ,  Y10T442/3472 ,  Y10T442/656 ,  Y10T442/659

摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

摘要翻译： 提供了具有优良的导热性，耐热性，钻孔加工性和阻燃性的层压材料。 在通过用热固性树脂组合物浸渍织造或非织造布基材而获得的预浸料中，热固性树脂组合物每100体积份的热固性树脂含有80〜200体积份的无机填料，无机填料含有（A） 平均粒径（D50）为2〜15μm的三水铝矿型氢氧化铝粒子和（B）平均粒径（D50）为0.5〜15μm的氧化镁和三水铝矿型配合比（体积比） 氢氧化铝粒子（A）与氧化镁（B）的摩尔比为1:0.3〜3。

公开(公告)号：US20120152599A1

公开(公告)日：2012-06-21

申请号：US13392554

申请日：2010-09-02

申请人： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

发明人： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

IPC分类号： H05K1/09 ,  H05K3/06

CPC分类号： H05K3/381 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/2072 ,  H05K2203/0773 ,  Y10T29/49128

摘要： A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.

摘要翻译： 多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。 由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。 通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板 具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

公开(公告)号：US08866022B2

公开(公告)日：2014-10-21

申请号：US13392554

申请日：2010-09-02

申请人： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

发明人： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/381 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/2072 ,  H05K2203/0773 ,  Y10T29/49128

摘要： A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.

摘要翻译： 多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。 由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。 通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板 具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

公开(公告)号：US08064213B2

公开(公告)日：2011-11-22

申请号：US11043123

申请日：2005-01-27

申请人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama

发明人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama

IPC分类号： H05K1/18

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/49805 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/183 ,  H05K1/187 ,  H05K3/20 ,  H05K3/403 ,  H05K2203/302 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces. At least one wiring 20 extends from the upper surface to the lower surface through the side surface, and an electronic component 32 is disposed within the sheet substrate.

摘要翻译： 提供具有内置部件的模块，其可以在没有通孔形成步骤的情况下制造。 具有内置部件100的模块包括绝缘片基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c。 至少一个布线20通过侧面从上表面延伸到下表面，并且电子部件32设置在片状基板内。

公开(公告)号：US20110125803A1

公开(公告)日：2011-05-26

申请号：US13055716

申请日：2009-07-16

申请人： Toshiyuki Asahi

发明人： Toshiyuki Asahi

IPC分类号： G06F17/30

CPC分类号： G06T11/206

摘要： A usability evaluation apparatus evaluates usability of evaluation objects by evaluation items (201 and 202) that have a hierarchical structure that is divided into a plurality of hierarchies and supplies usability evaluation points (206) that are the evaluation results to an output element. The output element is caused to supply as output a tree map in which are represented rectangular regions that have shapes that accord with degrees of importance (203 and 204) that indicate the relative importance of evaluation items (201 and 202) in the hierarchy and that indicate the evaluation items (201 and 202) such that the hierarchical structure can be distinguished and graphs that indicate the absolute values of usability evaluation points (206) such that the graphs are depicted in rectangular regions (501) that indicate the lowest-level evaluation items on the tree map according to the shape of the rectangular regions (501).

摘要翻译： 可用性评价装置通过评价项目（201,202）来评价评价对象的可用性，所述评价项目具有被分成多个层级的层次结构，并将作为评价结果的可用性评价点（206）提供给输出要素。 输出元素作为输出提供树形图，其中表示具有符合重要程度（203和204）的形状的矩形区域，其表示评估项目（201和202）在层次中的相对重要性，并且 指示评估项目（201和202），使得可以区分分级结构，以及指示可用性评估点（206）的绝对值的图表，使得图形被描绘在指示最低级别评估的矩形区域（501）中 根据矩形区域（501）的形状，树图上的项目。

公开(公告)号：US20070242440A1

公开(公告)日：2007-10-18

申请号：US11578039

申请日：2006-02-01

申请人： Yasuhiro Sugaya ,  Yoshiyuki Yamamoto ,  Toshiyuki Asahi ,  Katsumasa Miki ,  Yoshiyuki Saitou ,  Takeshi Nakayama

发明人： Yasuhiro Sugaya ,  Yoshiyuki Yamamoto ,  Toshiyuki Asahi ,  Katsumasa Miki ,  Yoshiyuki Saitou ,  Takeshi Nakayama

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/186 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/10015 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.

摘要翻译： 多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层 箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。 固体电解电容器设置成保持在多个电路板之间。 导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。

公开(公告)号：US07018866B2

公开(公告)日：2006-03-28

申请号：US10753933

申请日：2004-01-07

申请人： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Kazuo Ohtani

发明人： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Kazuo Ohtani

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K1/187 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 μm and not more than 100 μm, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 μm and not more than 200 μm. With this configuration, the high-performance and compact-size circuit component built-in module in which circuit components are mounted at a high density is provided so as to be used suitably in various types of electronic information devices.

摘要翻译： 电路部件内置模块包括：由含有无机填料和热固性树脂的混合物制成的第一电绝缘基板; 至少形成在所述第一电绝缘基板的主表面上的多个布线图案; 结合在第一电绝缘基板中并与布线图形电连接的半导体芯片; 以及将所述多个布线图案彼此电连接的内部通孔，所述内部通孔穿过所述第一电绝缘基板。 在电路部件内置模块中，半导体芯片的厚度为30μm以上且100μm以下，具有非接线表面接地，电路部件内置模块的厚度为 范围不小于80μm，不大于200μm。 利用这种配置，提供了以高密度安装电路部件的高性能和紧凑型电路部件内置模块，以便适用于各种类型的电子信息装置。