-
公开(公告)号：US09126400B2
公开(公告)日：2015-09-08
申请号：US13289840
申请日：2011-11-04
申请人： David S. Davies , Robert A. Owen
发明人： David S. Davies , Robert A. Owen
CPC分类号： B41J3/01 , B41J2/01 , B41J2/442 , B41M3/14 , B42D25/21 , B42D25/30 , B42D25/405 , G06F3/1258 , G06K15/1809 , G06K15/1852 , G06Q20/042 , G06Q30/0621 , G06Q30/0635 , G06Q40/02 , H04N1/32149 , H04N2201/3236
摘要： A negotiable instrument such as a check includes a unique microprint identifier that allows for authentication while preventing unauthorized reproduction and alternation. A printing system generates the identifier after receiving a customer order for printing a plurality of negotiable instruments, to allow inclusion of information that is specific to the customer order and/or the printing process. In various embodiments, the identifier is unique to each or each subset of the plurality of negotiable instruments and facilitates authentication of each of the negotiable instruments when needed.
摘要翻译： 诸如支票的可转让票据包括独特的微型打印标识符，其允许认证，同时防止未授权的再现和交替。 打印系统在接收到用于打印多个可转让票据的客户订单之后生成标识符，以允许包含特定于客户订单和/或打印处理的信息。 在各种实施例中，标识符对于多个可转让票据的每一个或每个子集是唯一的，并且有助于在需要时对每个可转让票据的认证。
-
公开(公告)号：US20130112759A1
公开(公告)日：2013-05-09
申请号：US13289840
申请日：2011-11-04
申请人： David S. Davies , Robert A. Owen
发明人： David S. Davies , Robert A. Owen
CPC分类号： B41J3/01 , B41J2/01 , B41J2/442 , B41M3/14 , B42D25/21 , B42D25/30 , B42D25/405 , G06F3/1258 , G06K15/1809 , G06K15/1852 , G06Q20/042 , G06Q30/0621 , G06Q30/0635 , G06Q40/02 , H04N1/32149 , H04N2201/3236
摘要： A negotiable instrument such as a check includes a unique microprint identifier that allows for authentication while preventing unauthorized reproduction and alternation. A printing system generates the identifier after receiving a customer order for printing a plurality of negotiable instruments, to allow inclusion of information that is specific to the customer order and/or the printing process. In various embodiments, the identifier is unique to each or each subset of the plurality of negotiable instruments and facilitates authentication of each of the negotiable instruments when needed.
-
公开(公告)号：US07122788B1
公开(公告)日：2006-10-17
申请号：US10961975
申请日：2004-10-08
申请人： Robert A. Owen , Vicki D. Paul , Humphrey W. Ha , Roger C. Knott , Mark A. Gohlke , Charles M. Hanson
发明人： Robert A. Owen , Vicki D. Paul , Humphrey W. Ha , Roger C. Knott , Mark A. Gohlke , Charles M. Hanson
IPC分类号： G01D18/00
CPC分类号： H04N5/33 , H04N5/361 , H04N5/3651
摘要： Collecting samples to adjust a signal includes providing a shutter in an opened position to allow a detector of an infrared camera to detect infrared radiation and generate a signal corresponding to the infrared radiation. A first touchup iteration is initiated by moving the shutter to a closed position, and samples of a reference frame are collected according to a collection instruction. The shutter is then moved to the opened position. If there is a change in a state of the infrared camera, the collection instruction is adjusted in response to the change. A second touchup iteration is initiated by moving the shutter to the closed position, and samples are collected according to the adjusted collection instruction. A modification of the signal is determined in accordance with at least some of the samples.
摘要翻译： 收集样品以调整信号包括在打开位置提供快门以允许红外摄像机的检测器检测红外辐射并产生对应于红外辐射的信号。 通过将快门移动到关闭位置来启动第一触摸迭代，并且根据收集指令来收集参考帧的采样。 然后将快门移动到打开位置。 如果红外线摄像机的状态发生变化，则响应于该变化来调整收集指令。 通过将快门移动到关闭位置来启动第二次触摸迭代，并且根据调整的收集指令收集样本。 根据至少一些采样来确定信号的修改。
-
公开(公告)号：US5959298A
公开(公告)日：1999-09-28
申请号：US665135
申请日：1996-06-14
申请人： James F. Belcher , Robert A. Owen
发明人： James F. Belcher , Robert A. Owen
IPC分类号： H01L27/146 , H01L37/02 , G01J5/54
CPC分类号： H01L37/02 , H01L27/1465
摘要： A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A shallow etch stop trench (46) is first ion milled around each ceramic island on front side and then filled with an etch stop material (e.g. parylene 48). An optical coat (e.g transparent metal layer 54, transparent organic layer 56 and conductive metallic layer 58) is elevated above the etch stop material by an elevation layer (e.g. polyimide 49). For some applications, it has been experimentally verified that there is no loss, and sometimes a measured increase, in optical efficiency when the optical coating is not planar in topology. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 86) containing a massive array of sensing circuits.
摘要翻译： 新颖的网状阵列包括使用独特的图案化方法由新型材料制成的陶瓷岛（例如BST 40）。 首先在前侧的每个陶瓷岛周围离子研磨浅蚀刻停止沟槽（46），然后用蚀刻停止材料（例如聚对二甲苯48）填充。 光学涂层（例如透明金属层54，透明有机层56和导电金属层58）通过仰角层（例如聚酰亚胺49）在蚀刻停止材料上方升高。 对于一些应用，已经通过实验证实，当光学涂层在拓扑结构中不是平面的时，光学效率没有损失，有时是测量的增加。 新颖的制造方法还提供了将大量陶瓷岛中的每一个的便利的电和机械结合到包含大量感测电路阵列的信号处理器基板（例如Si 86）。
-
5.发明授权Method for forming electrical contact to the optical coating of an infrared detector using conductive epoxy 失效使用导电环氧树脂与红外检测器的光学涂层形成电接触的方法
公开(公告)号：US5552326A
公开(公告)日：1996-09-03
申请号：US397706
申请日：1995-03-01
IPC分类号： H01L21/60 , H01L31/0224 , H01L31/18 , H01L21/58
CPC分类号： H01L31/022408 , H01L24/11 , H01L2224/13099 , H01L2924/01013 , H01L2924/01022 , H01L2924/01033 , H01L2924/01038 , H01L2924/01056 , H01L2924/01077 , H01L2924/01079 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/19041
摘要： This is a system and method of forming an electrical contact to the optical coating of an infrared detector using conductive epoxy. The method may comprise: forming thermal isolation trenches 22 and bias contact vias 23 in a substrate 20; depositing a trench filler 24 in the thermal isolation trenches 22; depositing conductive epoxy 50 into the bias contact vias 23; replanarizing; depositing a common electrode layer 31 over the thermal isolation trenches 22 and vias 23; depositing an optical coating 26 above the common electrode layer 31; mechanically polishing a backside of the substrate 20 to expose the trench filler 24 and conductive epoxy 50; depositing a contact metal 34 on the backside of the substrate 20; etching the contact metal 34 and the trench filler 24 to form pixel mesas of the contact metal 34 and the substrate 20.
摘要翻译： 这是使用导电环氧树脂形成与红外检测器的光学涂层的电接触的系统和方法。 该方法可以包括：在衬底20中形成热隔离沟槽22和偏置接触通孔23; 在热隔离槽22中沉积沟槽填料24; 将导电环氧树脂50沉积到偏压接触通孔23中; 补充; 在热隔离槽22和通孔23上沉积公共电极层31; 在公共电极层31上沉积光学涂层26; 机械抛光衬底20的背面以暴露沟槽填料24和导电环氧树脂50; 在衬底20的背面沉积接触金属34; 蚀刻接触金属34和沟槽填料24以形成接触金属34和基板20的像素台面。
-
公开(公告)号：US5426304A
公开(公告)日：1995-06-20
申请号：US182865
申请日：1994-01-13
CPC分类号： H01L37/02
摘要： In an exemplary thermal imaging system (20, 120, 220 and 320), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a corresponding focal plane array (30, 130, and 230) of thermal sensors (40, 140, and 240). Each mesa-type structure (52, 54 and 152) includes at least one mesa conductor (56, 58, 156 and 158) that extends from the top of the mesa-type structure (52, 54 and 152) to an adjacent contact pad (72 and 74). The mesa conductors (56, 58, 156 and 158) provide both biasing voltage (V.sub.B) for the respective thermal sensor (40 and 240) and a signal flowpath (V.sub.s) for the respective thermal sensor (40 and 240). The mesa conductors (56, 58, 156 and 158) may be used to provide biasing voltage (V.sub.B) to either a single ferroelectric element (242 and 243) having a void space (277 and 279) or a pair of ferroelectric elements (42 and 44). When the focal plane array (30, 130 and 230) is bonded to the corresponding array of mesa-type structures (52, 54 and 152), a thermally isolated, but electrically conductive path is provided between electrodes (43 and 45) of the thermal sensor (40 and 240) and the corresponding contact pad (72 and 172) of the integrated circuit substrate (70 and 74).
摘要翻译： 在示例性热成像系统（20,120,220和320）中，热隔离结构（50和150）设置在集成电路衬底（70和170）上，用于电连接和机械地结合相应的焦平面阵列（30 ，130和230）热传感器（40,140和240）。 每个台面型结构（52,54和152）包括从台面型结构（52,54和152）的顶部延伸到相邻接触垫的至少一个台面导体（56,58,156和158） （72和74）。 台面导体（56,58,156和158）为相应的热传感器（40和240）提供偏压（VB）和相应的热传感器（40和240）的信号流路（Vs）。 台面导体（56,58,156和158）可用于向具有空隙空间（277和279）或一对铁电元件（42）的单个铁电元件（242和243）提供偏置电压（VB） 和44）。 当焦平面阵列（30,130和230）被结合到相应的台面型结构（52,54和152）阵列时，热隔离但是导电的路径被提供在电极（43和45）之间 热传感器（40和240）以及集成电路基板（70和74）的相应接触焊盘（72和172）。
-
公开(公告)号：US6087661A
公开(公告)日：2000-07-11
申请号：US959943
申请日：1997-10-29
摘要： A thermal sensor (36, 84, 114) comprising a thermal assembly (44, 88, 118) and a signal flowpath (46, 90, 120). The thermal assembly (44, 88, 118) may comprise a thermally sensitive element (50) and a pair of electrodes (52, 54). The thermally sensitive element (50) may generate a signal representative of an amount of thermal radiation incident to the thermally sensitive element (50). The electrodes (52, 54) may collect the signal generated by the thermally sensitive element (50). The signal flowpath (46, 90, 120) may transmit the signal collected by the electrodes (52, 54) to the substrate (34, 82, 112). The signal flowpath (46, 90, 120) may comprise a pair of arms (56, 58, 92, 122) each extending from an electrode (52, 54) and be connected to the substrate (34, 82, 112). The arms (56, 58, 92, 122) may support the thermal assembly (44, 88, 118) in spaced relation with the substrate (34, 82, 112). The arms (56, 58, 92, 122) may be formed of a thermally insulating material.
摘要翻译： 包括热组件（44,88,118）和信号流路（46,90,120）的热传感器（36,84,114）。 热组件（44,88,118）可以包括热敏元件（50）和一对电极（52,54）。 热敏元件（50）可以产生表示入射到热敏元件（50）的热辐射量的信号。 电极（52,54）可以收集由热敏元件（50）产生的信号。 信号流路（46,90,120）可以将由电极（52,54）收集的信号传送到基板（34,82,112）。 信号流路（46,90,120）可以包括一对臂（56,58,92,122），每对臂从电极（52,54）延伸并连接到衬底（34,82,112）。 臂（56,58,92,122）可以以与衬底（34,82,112）间隔开的关系支撑热组件（44,48,118）。 臂（56,58,92,122）可以由隔热材料形成。
-
公开(公告)号：US5737818A
公开(公告)日：1998-04-14
申请号：US711224
申请日：1996-08-30
CPC分类号： H01L37/02 , G01J5/34 , Y10S438/928 , Y10T29/435 , Y10T29/49155
摘要： This is a system and method of forming an electrical contact to the optical coating of an infrared detector. The method may comprise: forming thermal isolation trenches 22 and contact vias 23 in a substrate 20; depositing a bias contact metal 32 into the vias 23 forming biasing contact areas around a periphery of the substrate 20; depositing a first trench filler 24 in the trenches 22 and vias 23; replanarizing; depositing a common electrode layer 25 over the thermal isolation trenches and the biasing contact areas; mechanically thinning the substrate 20 to expose the biasing contact area 32 and the trench filler 24; depositing a contact metal 34 on the backside of the substrate 20, the exposed trench filler 24 and the exposed bias contact area; and etching the contact metal 34 and the trench filler 24 to form pixel mesas of the contact metal 34 and the substrate 20. The thermal isolation trenches 22 and the bias contact vias 23 may be formed by ion milling or laser vaporization. Alternately, the bias contact areas 23 may be formed by performing laser vaporization on the substrate 20 to produce conductive 23 areas within the substrate.
-
公开(公告)号：US5696002A
公开(公告)日：1997-12-09
申请号：US635047
申请日：1996-04-19
IPC分类号： H01L31/0216 , H01L31/0224 , H01L31/18
CPC分类号： H01L31/022408 , H01L31/02161 , Y10S148/08 , Y10S148/135 , Y10S438/977
摘要： This is a system and method of forming an electrical contact to the optical coating of an infrared detector. The method may comprise: forming thermal isolation trenches 22 in a substrate 20; depositing a trench filler 24 in the thermal isolation trenches 22; depositing a common electrode layer 31 over the thermal isolation trenches 22; depositing an optical coating 26 above the common electrode layer 31; mechanically thinning the substrate to expose the trench filler 24; etching to remove the trench filler 24 in the bias contact area; depositing a contact metal 34 on the backside of the substrate 20, wherein the contact metal 34 connects to the common electrode layer 31 at bias contact areas 34 around a periphery of the thermal isolation trenches; and etching the contact metal 34 and the trench filler 24 to form pixel mesas of the contact metal 34 and the substrate 20. Bias contact vias 23 may be formed in the bias contact areas and then filled with bias contact metal 49. Alternately, the bias contact vias may also be filled with the contact metal 34. The thermal isolation trenches may be formed by laser vaporization, ion milling or other equivalent methods. In addition, an elevation layer may be formed between the optical coating and the substrate to provide greater tolerances for ion milling. The elevation layer may be filled with a trench filler and then removed after milling. Alternately, the elevation layer may be filled with a metal 49 to connect the bias contact metal to the common electrode in the bias contact areas.
-
公开(公告)号：US5631467A
公开(公告)日：1997-05-20
申请号：US664047
申请日：1996-06-13
申请人： James F. Belcher , Robert A. Owen
发明人： James F. Belcher , Robert A. Owen
摘要： A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A front side optical coating (e.g. transparent metal layer 44, transparent organic layer 46 and conductive metallic layer 48) is elevated above the substrate between the ceramic islands. This allows additional material (e.g. polyimide 38) between the optical coating and the substrate above the regions where cavities are to be etched. Etching of the cavities (72) is performed from the back side of the substrate without damaging the front side optical coating. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 80) containing a massive array of sensing circuits.
-
-
-
-
-
-
-
-
-
搜索结果
38 条记录 (耗时 0.021 秒)
